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Antistatic DAP molding compound for injection molding and preparing method thereof

A molding compound and antistatic technology, applied in the field of antistatic DAP molding compound for injection molding and its preparation, can solve the problems of unsatisfactory heat resistance and the like, and achieve a simple and easy-to-control preparation method, high molding efficiency, and improved plasticizing ability. Effect

Inactive Publication Date: 2016-07-20
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The molding compound described in this invention has better antistatic performance and mechanical strength, but its heat resistance is not ideal enough

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 1) Weigh the following components for later use: DAP resin 20%; n-butyl-4,4 (tert-butyl peroxy) valerate 1%; diallyl phthalate monomer 5%; conductive graphite 10%; Aluminum Hydroxide 43%; Stearic Acid 1%; Glass Fiber 20%.

[0044] 2) Take the inorganic filler and carry out conventional surface treatment with a silane coupling agent equivalent to 0.5% of its consumption;

[0045] 3) Mix the DAP resin with the surface-treated inorganic filler and other components evenly;

[0046] 4) put the mixed material into a twin-screw extruder for extrusion, the barrel temperature of the twin-screw extruder is 75-90°C, and the screw rotation speed is 100rpm;

[0047] 5) The extruded material is cooled and pulverized to obtain the antistatic DAP molding compound for injection molding of the present invention.

Embodiment 2

[0049] 1) Weigh the following components for later use: 30% of DAP resin; 4% of dicumyl peroxide; 3% of diallyl phthalate monomer; 1.5% of graphene; 37.5% of magnesium hydroxide; Calcium fatty acid 4%; glass fiber 20%.

[0050] 2) Take the inorganic filler and carry out conventional surface treatment with a silane coupling agent equivalent to 1% of its consumption;

[0051] 3) Mix the DAP resin with the surface-treated inorganic filler and other components evenly;

[0052] 4) put the mixed material into a twin-screw extruder for extrusion, the barrel temperature of the twin-screw extruder is 95-100°C, and the screw rotation speed is 110rpm;

[0053] 5) The extruded material is cooled and pulverized to obtain the antistatic DAP molding compound for injection molding of the present invention.

Embodiment 3

[0055] 1) Weigh the following components for later use: DAP resin 35%; α,α'bis(tert-butyl peroxide)-1,3-dicumene 4.5%, diallyl phthalate monomer 1 %; dibutyl phthalate 1.5%; graphene 1%; conductive graphite 2%; magnesium hydroxide 32%; zinc stearate 3%; glass fiber 20%.

[0056] 2) Take the inorganic filler and carry out conventional surface treatment with an aluminate coupling agent equivalent to 2% of its consumption;

[0057] 3) Mix the DAP resin with the surface-treated inorganic filler and other components evenly;

[0058] 4) put the mixed material into a twin-screw extruder for extrusion, the barrel temperature of the twin-screw extruder is 85-95°C, and the screw rotation speed is 120rpm;

[0059] 5) The extruded material is cooled and pulverized to obtain the antistatic DAP molding compound for injection molding of the present invention.

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Abstract

The invention discloses an antistatic DAP molding compound for injection molding and a preparing method thereof. The antistatic DAP molding compound for injection molding is prepared from, by weight, 20-50% of DAP resin, 1-6% of cross-linking agent, 1-5% of plasticizer, 1-10% of conductive filler, 17-43% of inorganic filler, 1-5% of release agent and 10-30% of glass fiber. DAP resin, peroxide cross-linking agent with high half-time temperature, conductive filler, plasticizer and other components are reasonably matched to improve the plasticizing capacity of DAP resin and avoid solidification of the DAP molding compound in an injection molding machine charging barrel while realizing the antistatic purpose, so that the requirement for injection molding is met. The surface resistivity of the DAP molding compound prepared according to the formula is 1.0E+7 omega or more, bending strength is larger than 90 MPa, and thermal deformation temperature is higher than 240 DEG C.

Description

technical field [0001] The invention relates to a thermosetting molding compound, in particular to an antistatic DAP molding compound for injection molding and a preparation method thereof. Background technique [0002] DAP (diallyl phthalate) molding compound can maintain good mechanical properties and outstanding electrical properties under long-term humid and hot conditions, and is mostly used in the manufacture of miniature electrical and electronic components. The existing ordinary DAP molding compound has little flow, it is difficult to plasticize when using a thermosetting injection molding machine, and it is easy to solidify in the barrel of the injection molding machine, so the molding material is mainly used for molding, and the molding efficiency is low. [0003] On the other hand, the existing ordinary DAP molding compound is easy to form charge accumulation after long-term use, and electrostatic discharge will cause electronic equipment to malfunction or damage ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L31/08C08L67/06C08K13/06C08K3/04C08K3/34C08K7/14C08K5/14C08K5/12C08K3/22
CPCC08K13/06C08K3/04C08K3/22C08K5/12C08K5/14C08K7/14C08K2003/2224C08K2003/2227C08K2201/001C08K2201/014C08L31/08C08L2201/04C08L2201/08
Inventor 刘建文王明军沈锡仙刘艳斌
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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