Composite enhanced through coupling of flaky and linear thermal conductive materials and preparation method

A technology for strengthening composite materials and thermally conductive materials, applied in the field of composite materials, can solve problems such as difficulty in exerting thermal conductivity, and achieve the effect of improving bonding strength and preventing dissociation

Active Publication Date: 2016-07-27
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reinforcement in this composite material only contains a single diamond rod, and the diamond rods exist in isolation, making it difficult to exert the overall thermal conductivity

Method used

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  • Composite enhanced through coupling of flaky and linear thermal conductive materials and preparation method
  • Composite enhanced through coupling of flaky and linear thermal conductive materials and preparation method
  • Composite enhanced through coupling of flaky and linear thermal conductive materials and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Cu foil is selected as the substrate material with a thickness of 0.3mm, and a high thermal conductivity diamond film is grown on its surface, that is, as a sheet-shaped thermal conductivity material. A series of parallel through-holes with a diameter of 3mm are arranged on the diamond sheet with a substrate. The spacing is 5mm; tungsten wire with a diameter of 0.3mm is used as the substrate to deposit diamond film as a linear heat-conducting material, and the composite is carried out according to the following steps:

[0060] (1) Pre-treatment of the surface of copper foil and tungsten wire: ultrasonic treatment with acetone to remove surface oil and stains, and ultrasonic acetone solution planting seed crystal treatment on copper foil tungsten wire substrate;

[0061] (2) Using magnetron sputtering to sputter a layer of W film on the surface of Cu foil in advance, the thickness of W film is 200nm; the surface of W-coated copper foil surface hot wire CVD to prepare diam...

Embodiment 2

[0066]W foil is selected as the substrate material with a thickness of 0.4mm, and a high thermal conductivity diamond film is grown on its surface, that is, as a sheet-shaped thermal conductivity material. A series of parallel through holes with a diameter of 3mm are arranged on the diamond sheet with the substrate. The spacing is 6mm; tungsten wire with a diameter of 0.5mm is selected as the substrate to deposit diamond film as a linear heat-conducting material, and the composite is carried out according to the following steps:

[0067] (1) Pre-treatment of the surface of tungsten foil and tungsten wire: that is, ultrasonic treatment with acetone to remove surface oil and stains, and ultrasonic acetone solution planting seed crystal treatment on tungsten foil and tungsten wire substrate;

[0068] (2) Using hot wire CVD to prepare diamond film on the surface of tungsten foil and tungsten wire Process parameters: hot wire distance 6mm, substrate temperature 850°C, hot wire tempe...

Embodiment 3

[0072] (5) A graphite sheet with a thickness of 2mm and a planar thermal conductivity of 1200W / (m K) is selected as the sheet-shaped heat-conducting material. A series of parallel through-holes with a diameter of 2mm are arranged on the graphite sheet, and the distance between the through-holes is 5mm. Choose a tungsten wire with a diameter of 1mm as the substrate to deposit a diamond film as a linear heat-conducting material, and perform the compounding according to the following steps:

[0073] (1) Carry out preliminary treatment on the surface of graphite sheet and W wire, that is, use acetone ultrasonic treatment to remove surface oil and stains, and plant seed crystals on W substrate ultrasonic acetone solution;

[0074] (2) Hot wire chemical vapor deposition is used to deposit diamond on the surface of tungsten wire. The deposition process parameters are: the mass flow rate of methane and hydrogen is 1.0%; the growth temperature is 800°C, the growth pressure is 3000Pa, an...

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Abstract

The invention provides a composite enhanced through coupling of flaky and linear thermal conductive materials. The composite is obtained through compounding a porous flaky thermal conductive material, a linear thermal conductive material and a basis material, wherein the thermal conductive materials are at least one selected from graphite, diamond, graphene, carbon nanotubes, graphene coated diamond and carbon nanotube coated diamond; the basis material is a metal or a polymer; and high-thermal conductivity particles can be added in the basis material. According to the invention, the metal based or polymer based composite enhanced through coupling of the porous flaky thermal conductive material and the linear thermal conductive material has relatively high thermal conductivity in the direction parallel to the heat flux direction and the direction vertical to the heat flux direction, the industrial production can be achieved, and the application prospect is wide.

Description

Technical field: [0001] The invention belongs to the field of composite materials, and in particular relates to a metal-based or polymer-based composite material and a preparation method thereof, which are coupled with sheet-like and linear heat-conducting materials. Background technique [0002] Electronic packaging is an operation process that rationally arranges, assembles, bonds, connects, and isolates the various components that constitute electronic devices or integrated circuits according to the specified requirements. It requires packaging materials to have high thermal conductivity and low thermal expansion coefficient. Good mechanical support, physical protection, electrical connection, heat dissipation and moisture resistance, external field shielding, size transition, and stable component parameters. With the rapid development of electronic information technology, electronic instruments are rapidly developing in the direction of high performance, low cost, miniat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/10C08L63/00C08L61/06C08K3/04C08K7/06C08K7/24
CPCC08K3/04C08K7/06C08K7/24C22C1/10C08L63/00C08L61/06
Inventor 周科朝马莉魏秋平余志明张龙叶文涛张岳峰
Owner CENT SOUTH UNIV
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