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Addition-curable silicone composition

A silicone composition, addition curing technology, applied in the direction of electrical solid devices, semiconductor/solid device manufacturing, semiconductor/solid device components, etc., to achieve excellent adhesion and inhibit thermal shrinkage

Inactive Publication Date: 2016-07-27
MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, an adhesive-improving component is blended together with a rare earth salt of a carboxylic acid in the addition-curable silicone composition to suppress the curing of the addition-curable silicone composition caused by the adhesive-improving component. Attempts to heat shrink objects are not yet known

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0155]

[0156] Polyorganosiloxane (D24) can be produced by the method shown below, for example.

[0157] That is, put into the reaction vessel selected from R ep Si(OR 6 ) 3 The trifunctional silane represented by R ep R 6 Si(OR 6 ) 2 Difunctional silanes represented by R ep R 6 2 Si(OR 6 ) of monofunctional silanes represented by at least one epoxy group-containing silane compound and R 7 2 Si(OR 6 ) represents a silane compound having an alkenyl group, and if necessary, put in R 8 Si(OR 6 ) 3 Trifunctional silanes represented by and / or represented by R 8 2 Si(OR 6 ) 2 For the bifunctional silane shown, the liquid is made alkaline and heated to perform partial hydrolysis, followed by condensation reaction.

[0158] In the above formula, R ep Represents a 1-valent organic group with an epoxy group, R 6 represents an alkyl group, R 7 Represents a monovalent hydrocarbon group selected from alkenyl, alkyl and aryl, R 8 Indicates an alkyl or aryl group. ...

Embodiment

[0197] Examples of the present invention are described below, but the present invention is not limited to these Examples. In addition, in the following examples, the viscosity is the measured value at 25 degreeC.

[0198] In the following examples and comparative examples, the following compounds and the like were used as (A) to (G) components. In the following description, Vi represents a vinyl group, Me represents a methyl group, and Ph represents a phenyl group.

[0199] (A) Component: Polyorganosiloxane (A1), Polyorganosiloxane (A2)

[0200] (Organopolysiloxane (A1): Linear methyl vinyl polysiloxane (A11))

[0201] Take the average composition formula: (ViMe 2 SiO 1 / 2 )(Me 2 SiO 2 / 2 ) m1 (ViMeSiO 2 / 2 ) m2 (ViMe 2 SiO 1 / 2 ) represents a linear methyl vinyl polysiloxane with an average degree of polymerization of 450 (m1=448, m2=0), a viscosity of 5000 mPa·s, and an average of 2 vinyl groups per molecule.

[0202] (Organopolysiloxane (A1): Linear methyl vinyl pol...

Synthetic example 1

[0225] 185.9 g (0.788 mol) of 3-glycidoxypropyltrimethoxysilane, 347.1 g (2.888 mol) of dimethyldimethoxysilane, 178.5 g (1.313 mol) After methyltrimethoxysilane of 34.7g (0.263mol) of methylvinyldimethoxysilane and 105g of toluene, 1.02g of 6N sodium hydroxide (NaOH) aqueous solution and 53g of ion-exchanged water were added and carried out Stir.

[0226] Heat the mixture in the reaction vessel until the liquid temperature becomes 30°C. At this time, the above four silane compounds (3-glycidyloxypropyltrimethoxysilane, dimethyldimethoxysilane, dimethyldimethoxysilane, etc.) Silane, methyltrimethoxysilane, and methylvinyldimethoxysilane) partial hydrolysis reaction of the methoxy group, began to generate heat. Even after heating was stopped, heat generation continued, and the temperature was raised to 50° C. while the reaction mixture became transparent. When continuing to stir and the temperature begins to decrease, add ion-exchanged water (the ion-exchanged water added at ...

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Abstract

Provided is an addition-curable silicone composition having little shrinkage or change in hardness due to heat, a cured silicone product of which obtained has excellent adhesiveness and appearance and makes it possible to protect metals, especially silver, from corrosion. An addition-curable silicone composition containing 100 parts by mass of polyorganosiloxane having an alkenyl group, polyorganohydrogensiloxane in an amount to make 0.9-3.0 mol of hydrogen atoms bonded to silicon atoms per 1 mol total amount of this alkenyl group, a catalytic amount of hydrosilylation catalyst, 0.01-10 parts by mass of adhesiveness-imparting agent, and 0.001-0.015 parts by mass, calculated in terms of metal atoms, of carboxylic acid metal salt indicated by (R<3>COO)kM (M indicates a metal atom selected from Ce, Fe, Cr, La, Nd, Pr, and Sm, k indicates a positive number of 2-4, and R<3> indicates a substituted or unsubstituted hydrocarbon group having 4-10 carbon atoms).

Description

technical field [0001] The present invention relates to an addition-curable silicone composition, and particularly relates to a cured product that can protect metals, especially silver, from corrosion, and that can protect metals, especially silver, from shrinkage and hardness caused by heat while having excellent adhesiveness and appearance. An addition-curable silicone composition with little change. Background technique [0002] Silicone (polyorganosiloxane) compositions such as silicone rubber and silicone gel are used in various kinds of uses. [0003] For example, in an optical semiconductor device including a light emitting element such as a light emitting diode (LED: Light Emitting Diode), a silicone composition excellent in heat resistance and ultraviolet resistance is used as a material for encapsulating the light emitting element. In particular, an addition-curable silicone composition cured by hydrosilylation is widely used because it cures in a short time by h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K3/36C08K5/098C08K5/3492C08L83/05C08L83/06H01L21/52H01L23/29H01L23/31
CPCC08K3/36C08K5/098C08K5/3492H01L23/296H01L24/29H01L24/45H01L24/48H01L2224/2919H01L2224/2929H01L2224/29298H01L2224/45144H01L2224/48639H01L2224/83855H01L2924/12041C08L83/04H01L2924/0715H01L2924/00012H01L2924/00014C08L83/06C08L83/00C08K5/56C08K5/34924H01L23/293C08L2205/025C08L2203/206C08L2205/05C09J183/04H01L24/73H01L33/56H01L33/62H01L2224/73265H01L2924/10346H01L2924/17747
Inventor P.库马高桥英雄
Owner MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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