Expediting setting polyurethane pouring sealant material and preparing method thereof

A potting glue and polyurethane technology, applied in the field of sealants, can solve the problems of long curing time, unenvironmental protection, and opaque potting glue, and achieve the effect of shortening curing time, improving production efficiency and fast curing speed.

Active Publication Date: 2016-08-24
BEIJING POLYSTAR HITECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Through literature search, it is found that Chinese patent CN 102102006 A discloses a method for preparing two-component polyurethane potting glue prepolymer method, the obtained potting glue has excellent performance, but the production process is complicated
Patent CN 104263307 A discloses a polyurethane potting material that can be cured at room temperature, and its mechanical properties are good, but because the hydroxyl-terminated polybutadiene is used in the B component, the odor is large and it is not environmentally friendly; and when the B component is used The ratio with component A is 100:30~40, which is inconvenient for workers to operate
Patent CN 102212325 A discloses a method for preparing potting glue with low viscosity and moderate hardness, but the curing time of this potting glue is long, 4-8 hours at 40-70°C, or 24-48 hours at room temperature, which seriously affects Productivity
200910173019.5 discloses a one-step method for preparing polyurethane potting glue with excellent performance, but the prepared potting glue has high hardness, Shore 70-85A, which is not suitable for some occasions, such as the potting of low-range weighing sensors
Patent 200610045091.6 discloses a two-component potting compound with a ratio of 1:1, which is convenient for workers to operate, but the catalyst used in it is organic lead, which will affect the health of operators
Patent 200610130718.8 A discloses a preparation method of polyurethane encapsulant with low viscosity, good leveling property and less pores, but there is carbon black in component A, so the prepared encapsulant is opaque, which affects circuit maintenance

Method used

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  • Expediting setting polyurethane pouring sealant material and preparing method thereof
  • Expediting setting polyurethane pouring sealant material and preparing method thereof
  • Expediting setting polyurethane pouring sealant material and preparing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Example 1 A polyurethane potting material

[0032] This embodiment provides a polyurethane potting adhesive material, which contains the following composition in parts by mass:

[0033] Component A: 80 parts of polyether polyol with a functionality of 2 after dehydration, 20 parts of polyether polyol with a functionality of 3, 0.2 part of organic bismuth catalyst 1610, 0.1 part of defoamer BYK 054, coupling agent 0.2 parts of KH-550, stir well, and keep in a sealed seal.

[0034] Component B: 8 parts of liquefied MDI with a functionality of 2, 22 parts of an isocyanate oligomer with a functionality of 3, and 70 parts of dehydrated dioctyl phthalate (DOP), stir well, and keep sealed.

Embodiment 2

[0035] Example 2 A polyurethane potting material

[0036] This embodiment provides a polyurethane potting adhesive material, which contains the following composition in parts by mass:

[0037] Component A: 70 parts of 2-functional polyether polyol after dehydration, 20 parts of 3-functional polyether polyol, 10 parts of castor oil, 0.4 part of organic bismuth catalyst, 0.2 part of organic zinc catalyst 1910, defoaming 0.2 parts of agent BYK 067A, 0.25 parts of coupling agent KH-560, stir well, and keep sealed.

[0038] Component B: 10 parts of MDI-50 (functionality 2), 10 parts of MDI prepolymer (functionality between 2-3), 20 parts of isocyanate oligomers (functionality 3), dehydrated phthalate 60 parts of dioctyl diformate, stir evenly, and keep sealed.

Embodiment 3

[0039] Example 3 A polyurethane potting material

[0040] This embodiment provides a polyurethane potting adhesive material, which contains the following composition in parts by mass:

[0041] Component A: 60 parts of 2-functional polyether polyol after dehydration, 10 parts of 3-functional polyether polyol, 30 parts of castor oil, 2 parts of organic zinc catalyst, 0.5 part of defoamer 141, coupling agent KH550 0.25 parts, stir well, and keep sealed.

[0042] B component: polymeric MDI (functionality between 2-3) 5 parts, MDI prepolymer (functionality between 2-3) 22 parts, isocyanate oligomer 10 parts (functionality is 3), 63 parts of dehydrated dioctyl phthalate, stir evenly, and keep sealed.

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Abstract

The invention relates to a polyurethane pouring sealant material and a preparing method thereof. The polyurethane pouring sealant material contains a component A and a component B, wherein the component A is prepared from, by mass, 70-100 parts of polyether polyol, 0-30 parts of castor oil, 0.2-4 parts of catalyst, 0.1-0.5 part of defoamer and 0.2-0.5 part of coupling agent, and the component B is prepared from, by mass, 30-60 parts of isocyanate and 40-70 parts of diluents. The polyurethane pouring sealant material has the advantages that setting speed is high, matching operation is easy, environment friendliness is realized, hardness is adjustable, line repair can be achieved conveniently, and preparing process is simple.

Description

technical field [0001] The invention relates to a fast-curing polyurethane potting adhesive material and a preparation method thereof, belonging to the field of sealants. Background technique [0002] In order to ensure the normal and stable use of components, many parts need to be potted so that the components can be fixed and protected from environmental influences. Polyurethane potting material has low hardness, moderate strength, good elasticity, water resistance, mildew resistance, excellent electrical insulation and flame retardancy, no corrosion to electrical components, no corrosion to steel, aluminum, copper, tin and other metals, as well as rubber, plastic , wood and other materials have good adhesion, and the price is moderate. It overcomes the brittleness of commonly used epoxy resin and the disadvantages of low strength and poor adhesion of silicone resin, and is an ideal potting protection material for electronic components. But there is no product with bette...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C08G18/66C08G18/48C08G18/36
CPCC08G18/36C08G18/4812C08G18/6696C08G2190/00C09J175/08
Inventor 王捷谭锦锦
Owner BEIJING POLYSTAR HITECH CO LTD
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