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Method for making artificial plates through using waste copper-clad plates

A technology for copper clad laminates and plates, applied in the field of man-made panels, can solve the problems of low water absorption thickness expansion rate, poor water resistance, and low recycling rate of discarded copper clad laminates.

Inactive Publication Date: 2016-09-07
常州梦泰照明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention: Aiming at the problem of low reuse rate of waste copper clad laminates, the present invention provides a method for reusing waste copper clad laminate resources
The plate prepared by the invention can not only solve the problem of the utilization rate of non-metallic residues of copper-clad laminates, but also because the main components of waste copper-clad laminates are cured resin and glass fiber, the cured resin is hydrophobic, and the glass fiber basically does not absorb water. Therefore, compared with ordinary medium-density wood fiber structural boards, its water absorption thickness expansion rate is much lower, which can solve the problem of poor water resistance of ordinary medium-density fiberboards. The boards can be used to produce various furniture, floors, partitions, etc. bright future

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0017] Collect the waste copper-clad laminates after copper recovery, crush them into 80-mesh particles by a pulverizer, wash them three times with deionized water, and then soak them in 0.5mol / L sodium hydroxide solution and 18% hydrochloric acid for 6 hours. , washed with deionized water until neutral, and dried in an oven at 105°C; weighed 1 part of silane coupling agent, 1 part of styrene, and 96 parts of the above air-dried waste copper-clad laminate , 30 parts of ethyl acetate, soak the waste copper-clad laminate in ethyl acetate for 1.0 hour, then add silane coupling agent and styrene in turn under the condition of stirring until the mixture is completely uniform, filter to obtain filter residue, filter residue Dry at 100 ° C to obtain surface pretreated copper-clad laminate particles for subsequent use; in parts by weight, take 94 parts of vinyl resin, 2 parts of cobalt isooctanoate, 1 part of methyl ethyl ketone peroxide, and 2 parts of polyethylene glycol Acrylamide,...

example 2

[0020] Collect the waste copper-clad laminates after recovering copper, grind them into 90-mesh particles by a pulverizer, wash them 4 times with deionized water, and then soak them in 0.5mol / L sodium hydroxide solution and 18% hydrochloric acid for 8 hours. , washed with deionized water until neutral, dried in an oven at 105°C; weighed 1 part of silane coupling agent, 1 part of styrene, and 97 parts of the waste copper-clad laminate after air-drying , 35 parts of ethyl acetate, soak the discarded copper-clad laminate in ethyl acetate for 1.5 hours, then add silane coupling agent and styrene in turn under the condition of stirring until the mixture is completely uniform, filter to obtain filter residue, filter residue Dry at 100 ° C to obtain surface pretreated copper-clad laminate particles for subsequent use; in parts by weight, take 95 parts of vinyl resin, 3 parts of cobalt isooctanoate, 1 part of methyl ethyl ketone peroxide, and 3 parts of polyethylene glycol Acrylamide,...

example 3

[0023] Collect the waste copper-clad laminates after recovering copper, grind them into 100-mesh particles through a pulverizer, wash them with deionized water for 5 times, and then soak them in 0.5mol / L sodium hydroxide solution and 18% hydrochloric acid for 12 hours. , washed with deionized water until neutral, and dried in an oven at 105°C; weighed 2 parts of silane coupling agent, 2 parts of styrene, and 98 parts of the waste copper-clad laminate after air-drying , 40 parts of ethyl acetate, first soak the waste copper-clad laminate in ethyl acetate for 2.0 hours, then add silane coupling agent and styrene in turn under the condition of stirring, until the mixture is completely uniform, filter to obtain filter residue, filter residue Dry at 100 ° C to obtain surface pretreated copper-clad laminate particles for subsequent use; in parts by weight, take 97 parts of vinyl resin, 4 parts of cobalt isooctanoate, 2 parts of methyl ethyl ketone peroxide, and 5 parts of polyethylen...

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Abstract

The invention relates to a method for making artificial plates through using waste copper-clad plates, and belongs to the field of production of artificial plates. The waste copper-clad plate recycling method is provided against the problem of small reuse rate of the waste copper-clad plates. The method adopting the waste copper-clad plates comprises the following steps: preprocessing the glass fibers in the waste copper-clad plates and organic resin through a silane coupling agent to form firm, waterproof and interpenetrating waste copper-clad plates with a polymer net structure, adding an additive, pouring the obtained material to a die, carrying out shake pressing, solidifying the obtained material, cutting the solidified material, and polishing the cut material to make the plates. The plates made in the invention can solve the utilization problem of nonmetal residues of the copper-clad plates, main components of the waste copper-clad plates are solidified resin and glass fibers, the solidified resin are hydrophobic, and the glass fibers do not absorb water basically, so the plates made in the invention have an obviously lower water absorption water thickness swelling rate than common medium-density wood fiber structure plates, can solve the problem of poor waterproof property of the common medium-density fiber plates, can be used to produce various furniture, floors and separator plates, and have a wide application prospect.

Description

technical field [0001] The invention relates to a method for preparing artificial boards by using waste copper-clad laminates, belonging to the field of artificial board production. Background technique [0002] With the mass production of electronic products and the shortening of the scrap cycle, the amount of discarded copper-clad laminates used as circuit board substrates is also increasing sharply, becoming a serious environmental problem. A large part of the residue of non-metallic materials left after waste copper clad laminates are recycled as garbage is discarded, incinerated or buried, which not only causes serious environmental pollution, but also leads to a large waste of useful resources. Chemical recovery can eventually obtain a relatively pure product, but the cost is high. The non-metallic residue of waste copper clad laminate contains more bromine and a small amount of chlorine. Incineration treatment will cause air pollution, especially dioxin pollution. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08L63/10C08L33/26C08K9/06C08K7/14C08K5/098C08K5/14
CPCC08L101/00C08L2205/03C08L2207/20
Inventor 李锦宇王龙
Owner 常州梦泰照明科技有限公司