Epoxy resin adhesive and preparation method thereof
An epoxy resin and adhesive technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of plasticity (poor elongation at break, etc., achieve high shear strength, high Tensile strength, inexpensive and easily obtainable effects
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[0050] A preparation method of an epoxy adhesive with high temperature resistance and high toughness, the specific steps are as follows:
[0051] (1) Taking materials: Weigh each raw material according to weight percentage.
[0052] (2) Preparation of component A: Pre-bake the filler of component A at 110-130°C for 10-30 hours, and then mix epoxy resin, toughener, acrylate oligomer, diluent, component A The coupling agent of component A and the defoamer of component A are added to the reactor, at 50-70°C, the planetary speed is 25-35Hz, the mixing time is 5-30min, and then the filler of component A and the filler of component A are added. Mix fumed silica, planetary speed 25-35Hz, disperse 900-1100rpm, time 5-30min, then turn on vacuum-0.1Mpa, defoam for 10-30min, and then discharge to get A component.
[0053] (3) Preparation of component B: Add alicyclic amine, polyamide, modified aliphatic amine, and defoamer of component B into the reactor, at 50-70°C, planetary speed 25-...
Embodiment 1
[0058] An epoxy adhesive with high temperature resistance, high toughness and high plasticity, the raw materials according to weight percentage include: 50% of A component and 50% of B component. The raw materials of the A component include: E51 epoxy resin 75%, carboxyl-terminated liquid nitrile rubber 6%, methyl acrylate oligomer 9%, glycerol triglycidyl ether 3.5%, vinyl triglycidyl ether Ethoxysilane (brand name KH-151) 0.5%, hydrophobic fumed silica 0.5%, talcum powder 5.4%, polydimethylsiloxane defoamer 0.1%, the raw materials of the B component according to weight percentage Including: polyamide (grade 651) 92%, tetraethylenepentamine 3%, hexahydropyridine 4.9%, polydimethylsiloxane defoamer 0.1%.
[0059] The preparation method of described high temperature resistance, high toughness, high plasticity epoxy adhesive, concrete steps are as follows:
[0060] (1) Taking materials: take each raw material according to weight percentage:
[0061] (2) Preparation of componen...
Embodiment 2
[0067] An epoxy adhesive with high temperature resistance, high toughness and high plasticity, the raw materials according to weight percentage include: 45% of A component and 55% of B component. The raw materials of the A component include: E54 epoxy resin 45%, E51 epoxy resin 30%, polysulfide rubber (brand LP-1) 5%, ethyl acrylate oligomer 12%, trimethylol Propane triglycidyl ether 4.0%, γ-aminopropyl triethoxysilane (brand KH-550) 0.6%, hydrophobic fumed silica 0.5%, calcium carbonate 2.8%, tributyl phosphate defoamer 0.1% , The raw materials of the B component include: polyamide (brand 600) 94%, diethylenetriamine 2%, hexahydropyridine 3.9%, tributyl phosphate defoamer 0.1% according to weight percentage
[0068] The preparation method of described high temperature resistance, high toughness, high plasticity epoxy adhesive, concrete steps are as follows:
[0069] (1) Taking materials: take each raw material according to weight percentage:
[0070] (2) Preparation of comp...
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