Epoxy resin adhesive and preparation method thereof

An epoxy resin and adhesive technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of plasticity (poor elongation at break, etc., achieve high shear strength, high Tensile strength, inexpensive and easily obtainable effects

Active Publication Date: 2016-09-21
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy adhesives have good bonding properties (shear strength) and anti-aging properties; epoxy adhesives modified by nitrile rubber have good toughness (tear strength) in addition to the characteristics of epoxy adhesives, but Its plasticity (elongation at break) is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0050] A preparation method of an epoxy adhesive with high temperature resistance and high toughness, the specific steps are as follows:

[0051] (1) Taking materials: Weigh each raw material according to weight percentage.

[0052] (2) Preparation of component A: Pre-bake the filler of component A at 110-130°C for 10-30 hours, and then mix epoxy resin, toughener, acrylate oligomer, diluent, component A The coupling agent of component A and the defoamer of component A are added to the reactor, at 50-70°C, the planetary speed is 25-35Hz, the mixing time is 5-30min, and then the filler of component A and the filler of component A are added. Mix fumed silica, planetary speed 25-35Hz, disperse 900-1100rpm, time 5-30min, then turn on vacuum-0.1Mpa, defoam for 10-30min, and then discharge to get A component.

[0053] (3) Preparation of component B: Add alicyclic amine, polyamide, modified aliphatic amine, and defoamer of component B into the reactor, at 50-70°C, planetary speed 25-...

Embodiment 1

[0058] An epoxy adhesive with high temperature resistance, high toughness and high plasticity, the raw materials according to weight percentage include: 50% of A component and 50% of B component. The raw materials of the A component include: E51 epoxy resin 75%, carboxyl-terminated liquid nitrile rubber 6%, methyl acrylate oligomer 9%, glycerol triglycidyl ether 3.5%, vinyl triglycidyl ether Ethoxysilane (brand name KH-151) 0.5%, hydrophobic fumed silica 0.5%, talcum powder 5.4%, polydimethylsiloxane defoamer 0.1%, the raw materials of the B component according to weight percentage Including: polyamide (grade 651) 92%, tetraethylenepentamine 3%, hexahydropyridine 4.9%, polydimethylsiloxane defoamer 0.1%.

[0059] The preparation method of described high temperature resistance, high toughness, high plasticity epoxy adhesive, concrete steps are as follows:

[0060] (1) Taking materials: take each raw material according to weight percentage:

[0061] (2) Preparation of componen...

Embodiment 2

[0067] An epoxy adhesive with high temperature resistance, high toughness and high plasticity, the raw materials according to weight percentage include: 45% of A component and 55% of B component. The raw materials of the A component include: E54 epoxy resin 45%, E51 epoxy resin 30%, polysulfide rubber (brand LP-1) 5%, ethyl acrylate oligomer 12%, trimethylol Propane triglycidyl ether 4.0%, γ-aminopropyl triethoxysilane (brand KH-550) 0.6%, hydrophobic fumed silica 0.5%, calcium carbonate 2.8%, tributyl phosphate defoamer 0.1% , The raw materials of the B component include: polyamide (brand 600) 94%, diethylenetriamine 2%, hexahydropyridine 3.9%, tributyl phosphate defoamer 0.1% according to weight percentage

[0068] The preparation method of described high temperature resistance, high toughness, high plasticity epoxy adhesive, concrete steps are as follows:

[0069] (1) Taking materials: take each raw material according to weight percentage:

[0070] (2) Preparation of comp...

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Abstract

The invention relates to a high-temperature resistant and high-toughness epoxy resin adhesive and a preparation method thereof. With the use of common epoxy resin, a toughening agent, an acrylic oligomer, a modified polyamide curing agent and the like, the epoxy resin adhesive has good toughness, and excellent breaking elongation and elasticity modulus, and can maintain higher shear strength at high temperature. The preparation method is simple, the process can be regulated and controlled easily, the cost is low, and the high-temperature resistant and high-toughness epoxy resin adhesive can be cured at room temperature, is particularly applicable to fragile material adhering, and is the high-performance adhesive with both high strength and high elastoplasticity.

Description

technical field [0001] The invention relates to an epoxy resin adhesive and a preparation method thereof, in particular to an epoxy resin adhesive with high temperature resistance, high toughness and high plasticity and a preparation method thereof. The high temperature resistance, high toughness and high plasticity refer to The tensile shear strength at -250°C is not less than 2.0MPa, the tensile strength at room temperature is not less than 14.0MPa, and the elongation at break is not less than 70%, which belongs to the technical field of polymer material preparation. Background technique [0002] Epoxy adhesive is a kind of good bonding material and has a wide range of applications. The research on epoxy adhesive mainly focuses on toughening and high temperature resistance. For toughening research, epoxy resin is mainly modified by nitrile rubber or styrene-butadiene rubber with nano-type core-shell structure, which can effectively absorb impact force and achieve toughenin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06C09J11/08
CPCC09J4/06C09J11/04C09J11/06C09J11/08
Inventor 郭安儒刘子路李瑞杰王泽华王洁李杰
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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