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High-toughness anti-stripping epoxy resin adhesive

A technology of epoxy resin glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of short storage time, toughness, heat resistance that cannot meet the demand, and poor anti-peeling effect. Achieve fast curing speed, good anti-peeling effect and good wetting performance

Inactive Publication Date: 2016-10-26
HEFEI DONGCAI PRINTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although epoxy resin materials are widely used, there are still many shortcomings. At higher temperatures, the toughness and heat resistance cannot meet the needs, the anti-peeling effect is poor, and the storage time is short.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] An epoxy resin adhesive with good toughness and anti-peeling, its raw materials include by weight: 50 parts of phenolic modified epoxy resin, 5 parts of resorcinol bisglycidyl ether type epoxy resin, E-12 epoxy resin 35 parts, 15 parts of modified wheat gluten, 8 parts of polyimide modified phenolic resin, 1 part of carboxy-terminated nitrile rubber, 2 parts of polybutadiene-polymethyl methacrylate, methylene bicyclohexyl 1 part of alkylamine, 6 parts of epoxidized SBS, 1 part of ethylene triamine, 2 parts of triethanolamine, 5 parts of calcined clay, 5 parts of sodium carboxymethyl cellulose, 20 parts of diglycidyl ether.

Embodiment 2

[0017] An epoxy resin adhesive with good toughness and anti-peeling, its raw materials include by weight: 20 parts of phenolic modified epoxy resin, 15 parts of resorcinol bisglycidyl ether type epoxy resin, E-12 epoxy resin 20 parts, 30 parts of modified wheat gluten, 1 part of polyimide modified phenolic resin, 2 parts of carboxy-terminated nitrile rubber, 1 part of polybutadiene-polymethyl methacrylate, methylene bicyclohexyl 10 parts of alkylamine, 2 parts of epoxidized SBS, 4 parts of vinyl triamine, 1 part of triethanolamine, 15 parts of calcined clay, 1 part of sodium carboxymethyl cellulose, 50 parts of diglycidyl ether.

Embodiment 3

[0019] An epoxy resin adhesive with good toughness and anti-peeling, its raw materials include by weight: 40 parts of phenolic modified epoxy resin, 12 parts of resorcinol bisglycidyl ether type epoxy resin, E-12 epoxy resin 26 parts, 24 parts of modified wheat gluten, 2 parts of polyimide modified phenolic resin, 1.5 parts of carboxy-terminated nitrile rubber, 1.5 parts of polybutadiene-polymethyl methacrylate, methylene bicyclohexyl 6 parts of alkylamine, 3 parts of epoxidized SBS, 3 parts of ethylene triamine, 1.4 parts of triethanolamine, 13 parts of calcined clay, 2 parts of sodium carboxymethyl cellulose, 40 parts of diglycidyl ether.

[0020] The modified wheat gluten is prepared by the following process: 10 parts of wheat gluten, 30 parts of absolute ethanol, and 20 parts of water are mixed and stirred for 100 minutes according to parts by weight, centrifuged, the supernatant is concentrated, freeze-dried, pulverized, added 1 part of sodium sulfite, 6 parts of urea, an...

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PUM

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Abstract

The invention discloses a high-toughness anti-stripping epoxy resin adhesive. The high-toughness anti-stripping epoxy resin adhesive is prepared from, by weight, 20-50 parts of phenolic modified epoxy resin, 5-15 parts of resorcinol diglycidyl ether type epoxy resin, 20-35 parts of E-12 epoxy resin, 15-30 parts of modified wheat gluten, 1-8 parts of polyimide modified epoxy resin, 1-2 parts of carboxyl-terminated butadiene acrylonitrile rubber, 1-2 parts of polybutadiene-polymethyl methacrylate, 1-10 parts of methylene bicyclohexyl amine, 2-6 parts of epoxidized SBS (styrene butadiene styrene), 1-4 parts of vinyl triamine, 1-2 parts of triethanolamine, 5-15 parts of calcined clay, 1-5 parts of sodium carboxymethylcellulose and 20-50 parts of diglycidyl ether. The high-toughness anti-stripping epoxy resin adhesive is excellent in toughness, favorable in anti-stripping effect, high in thermal stability and long in storage time even at a high temperature and is safe, environment friendly and free of environment pollution.

Description

technical field [0001] The invention relates to the technical field of epoxy adhesives, in particular to an epoxy resin adhesive with good toughness and anti-peeling. Background technique [0002] Epoxy resins are organic compounds containing two or more epoxy groups in a class of molecules, which can react with various types of curing agents to form polymers with a three-dimensional crosslinked network structure. Epoxy resin has the characteristics of good adhesion, corrosion resistance, insulation, high mechanical strength, low shrinkage rate, and good processing performance. It plays an important role and becomes an indispensable basic material in the national economy and people's livelihood. Although epoxy resin materials are widely used, there are still many shortcomings. At higher temperatures, the toughness and heat resistance cannot meet the requirements, the anti-stripping effect is poor, and the storage time is short. Contents of the invention [0003] An epoxy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04C09J11/06
CPCC09J163/00C08K2201/011C08L2201/02C08L2201/08C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C08L63/00C08L61/14C08L13/00C08L47/00C08L53/025C08L1/286C08L89/00C08K13/02C08K3/346C08K2003/2286
Inventor 唐述振
Owner HEFEI DONGCAI PRINTING TECH
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