The invention relates to a high-
thermal conductivity high-performance aluminum-based
copper-clad plate and a preparation method thereof. The
copper-clad plate is composed of
copper foil, a high-
thermal conductivity electric insulating paste and an aluminum plate. The preparation method comprises the following steps: mixing multifunctional
fluorine-containing
epoxy resin with 1,4-di(2,4-diamino phenoxy)
benzene for reacting, adding
resorcinol diglycidyl ether epoxy resin and partial
inorganic filler, and uniformly stirring and mixing to obtain a component A; uniformly mixing and stirring methyl tetrahydrophthalic anhydride and
inorganic filler to obtain a component B; and uniformly mixing and stirring the component A and the component B to obtain the high-
thermal conductivity electric insulating paste, then uniformly applying the high-thermal
conductivity electric insulating paste onto the surface of the
copper foil and the aluminum plate, and pressing and curing by a high-temperature panel pressing
machine, thereby obtaining the high-thermal
conductivity high-performance aluminum-based copper-clad plate. The operation process is simple; with the green and clean production process, a
solvent is avoided, and the copper-clad plate has an environment-friendly effect; the copper-clad plate is wide in application range and has good market prospects, and the large-scale
mass production can be easily carried out.