A conductive
epoxy composition is disclosed comprising an
epoxy resin, a low-
viscosity hydrocarbon diluent, silver, and
graphene. The one-part formulation provides enhanced electrical
conductivity,
mechanical strength, and process stability. The
epoxy resin may include
resorcinol diglycidyl ether,
diglycidyl ether of
Bisphenol A, or
Bisphenol F. The
hydrocarbon diluent may include glycidyl-
ether-family resins having defined carbon-chain characteristics and molecular weights. Silver may be present in particulate, flake,
nanoparticle, or coated forms at about 55-90 wt. %, while
graphene may be present at 0.03-0.3 wt. % with dimensions of 1-10 μm and surface areas of 400-2,000 m2 / g. Optional additives include solvents, ionic liquids, latent curing agents, and strength enhancers to optimize curing and adhesion.