LED chip cleaning solution

A technology of LED chip and cleaning solution, which is applied in the direction of detergent compounding agent, detergent composition, surface active detergent composition, etc., can solve the problems of detection failure, corrosion and rust, short circuit and open circuit, etc., and achieve energy saving and decontamination Strong ability and high cleaning efficiency

Inactive Publication Date: 2016-11-09
ANHUI FUN OPTOELECTRONICS TECH
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Problems with electronic components due to contamination by contamination particles and improper cleaning, including high leakage, shorts, corros

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A cleaning solution for LED chips, comprising the following raw materials: 15g of alkanolamide polyoxyethylene ether, 15g of sorbitan fatty acid ester polyoxyethylene ether, 8g of benzotriazole, 4g of citric acid, 2g of glycerin, and 2g of ethanol , polyoxyethylene ether 8g, hydrogen peroxide 8g, ammonium hydroxide 4g, 1,3-dioxolane 10g, tert-butyl-4-hydroxyanisole 8g, tripropylene glycol methyl ether 5g.

Embodiment 2

[0015] A cleaning solution for LED chips, comprising the following raw materials: 15g of alkanolamide polyoxyethylene ether, 10g of sorbitan fatty acid ester polyoxyethylene ether, 5g of benzotriazole, 4g of citric acid, 2g of glycerin, and 2g of ethanol , polyoxyethylene ether 6g, hydrogen peroxide 6g, ammonium hydroxide 3g, 1,3-dioxolane 8g, tert-butyl-4-hydroxyanisole 6g, tripropylene glycol methyl ether 4g.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an LED chip cleaning solution. The LED chip cleaning solution comprises the following raw materials by mass: 10 to 15 parts of alkylolamide polyoxyethylene ether, 10 to 15 parts of sorbitan fatty acid ester polyoxyethylene ether, 5 to 8 parts of benzotriazol, 3 to 4 parts of citric acid, 1 to 2 parts of glycerin, 1 to 2 parts of ethanol, 5 to 8 parts of polyoxyethylene ether, 5 to 8 parts of hydrogen peroxide, 2 to 4 parts of ammonium hydroxide, 6 to 10 parts of 1,3-dioxolane, 6 to 8 parts of t-butyl-4-methoxyphenol and 4 to 5 parts of tripropylene glycol methyl ether. The LED chip cleaning solution is high in cleaning efficiency, strong in detergency, good in safety performance, free of pollution to environment, reduced in consumption of energy and low in washing cost; and in the process of washing, the cleaning solution causing no damage to LEDs can form a protection film on the chip, isolate air, prevent water and other molecules in the atmosphere from corroding the chip, resist oxidation and facilitates subsequent operations.

Description

technical field [0001] The invention relates to the field of cleaning agents for LED lamps, in particular to a cleaning solution for LED chips. Background technique [0002] LED is a semiconductor light-emitting diode. LED energy-saving lamps use high-brightness white light-emitting diodes as light sources. They have high luminous efficiency, low power consumption, long life, easy control, maintenance-free, safety and environmental protection; Bright, colorful, low loss, low energy consumption, green and environmental protection. Existing LED lampshade materials have poor flame retardancy. [0003] In the manufacturing of electronics industry, the production and assembly of electronic components consists of multiple stages, and each stage has a cleaning process to ensure high reliability and high yield of products. Problems with electronic components due to contamination by particles and improper cleaning include high leakage, short circuit, corrosion, detection failure, p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C11D1/825C11D3/60C11D3/28C11D3/20C11D3/39C11D3/04
CPCC11D1/825C11D1/66C11D1/72C11D1/74C11D3/044C11D3/2013C11D3/2065C11D3/2068C11D3/2086C11D3/2096C11D3/28C11D3/3942
Inventor 汪卫国
Owner ANHUI FUN OPTOELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products