Interlayer structure composite material and preparation method thereof
A composite material and sandwich structure technology, applied in chemical instruments and methods, electronic equipment, layered products, etc., can solve the problems of difficult quality assurance, inability to form thin-walled structures, and low production efficiency.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0027] The preparation method of sandwich structure composite material of the present invention, comprises the steps:
[0028] Provide carbon fiber unidirectional yarn or carbon fiber woven cloth and a first resin matrix, draw carbon fiber unidirectional yarn or carbon fiber woven cloth under preset tension, and compound the first resin matrix on carbon fiber unidirectional yarn or carbon fiber woven cloth On both sides, a sandwich layer is formed, and the first resin matrix is melted and impregnated in carbon fiber unidirectional yarn or carbon fiber woven cloth by a hot pressing roller to form a carbon fiber prepreg;
[0029]Provide glass fiber cloth, hollow glass microspheres, and a second resin matrix, add the hollow glass microspheres into the second resin matrix, mix thoroughly, draw out the glass fiber cloth under preset tension, and place the first The mixture of the second resin matrix and hollow glass microspheres is compounded on both sides of the glass fiber clot...
Embodiment 1
[0051] The preparation method of the sandwich structure composite material described in this embodiment comprises the following steps:
[0052] Provide the following components by weight: the median particle diameter D50 is 40 μm, and the true density is 0.1 g / cm 3 ~0.5g / cm 3 100 parts by weight of hollow glass microspheres, 100 parts by weight of alcohol, 4 parts by weight of silane coupling agent, and 0.8 parts by weight of fluorocarbon surfactant were added to a high-speed disperser and stirred at a high speed at a speed of 1500 rpm to obtain a mixed solution ; Dry the treated hollow glass microspheres in an oven at 100°C.
[0053] Provide the following components by weight: 70 parts of bisphenol A glycidyl ether epoxy resin E51, 20 parts of bisphenol F glycidyl ether epoxy resin CYDF-170, 10 parts of novolac epoxy resin F51, bisphenol 7 parts of cyanamide curing agent, 3 parts of accelerator DCMU (N-(3,4-dichlorophenyl)-N', N'-dimethylurea), mix the above components and ...
Embodiment 2
[0060] The preparation method of the sandwich structure composite material described in this embodiment comprises the following steps:
[0061] Provide the following components by weight: the median particle diameter D50 is 50 μm, and the true density is 0.1 g / cm 3 ~0.5g / cm 3 100 parts by weight of hollow glass microspheres, 100 parts by weight of alcohol, 4 parts by weight of silane coupling agent, and 0.8 parts by weight of fluorocarbon surfactant were added to a high-speed disperser and stirred at a high speed at a speed of 1500 rpm to obtain a mixed solution ; Dry the treated hollow glass microspheres in an oven at 100°C.
[0062] Provide the following components by weight: 70 parts of bisphenol A glycidyl ether epoxy resin E51, 30 parts of E20, 8 parts of dicyandiamide curing agent, 1 part of 2-ethyl-4-methylimidazole, the above The components are mixed and heated to a temperature of 90°C, stirred at a high speed and mixed evenly to obtain a resin matrix, the first resi...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
density | aaaaa | aaaaa |
Basis weight | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com