Sealing thermo-curing resin material

A thermosetting, resin material technology, used in the field of electronic components, packaging material preparation, can solve the problems of low tensile strength, dielectric constant, dielectric loss, etc., achieve good sealing effect, excellent comprehensive performance, wide range The effect of the application foreground

Inactive Publication Date: 2016-11-23
黄宇
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a thermosetting resin material for sealing to solve the problems of the existing semiconductor chip sealing materials such as low dielectric constant, low tensile strength, high dielectric loss, and high weight loss rate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0029] The preparation method of the thermosetting resin material for sealing comprises the following steps:

[0030] S1: Combine 2,2'-[(1-methylethylene)bis(4,1-phenylenecarbaldehyde)]dioxirane and methylene-bis(1,3-benzenediol) - Tetraglycidyl ether, silicone resin modified tung oil alkyd resin, o-cresol novolac epoxy resin A, dioctyl phthalate, ethylene propylene rubber, polysiloxane mixed, at a temperature of 240-255 ° C, rotating speed Stir at 300-400r / min for 6-8min to prepare mixture A;

[0031] S2: Under nitrogen protection, add oleyl amino acid potassium, sodium metasilicate, paraffin, carbon fiber, polymaleimide, phthalic acid, silicon dioxide, N-2 to the mixture A prepared in step 1 -(aminoethyl)-3-aminopropylmethyldimethoxysilane coupling agent, modified polyacrylate compatibilizer, 2,2'-methylene-bis-(4-ethyl-6 - tert-butylphenol), anhydrite stabilizer, DCP bridging agent, acrylate regulator, azobisisobutyric acid (ethylene glycol acrylate) ester initiator, di-t...

Embodiment 1

[0036] A thermosetting resin material for sealing, made of the following raw materials in units of weight: 2,2'-[(1-methylethylene)bis(4,1-phenylenecarbaldehyde)]bicyclo Oxyethane and methylene-bis(1,3-benzenediol)-tetraglycidyl ether 220 parts, silicone resin modified tung oil alkyd resin 65 parts, o-cresol novolac epoxy resin A50 parts, phthalic acid 25 parts of dioctyl ester, 42 parts of ethylene propylene rubber, 27 parts of polysiloxane, 23 parts of oleyl amino acid potassium, 19 parts of sodium metasilicate, 30 parts of paraffin wax, 20 parts of carbon fiber, 17 parts of polymaleimide, 20 parts of phthalic acid, 20 parts of silicon dioxide, 4 parts of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane coupling agent, 4 parts of modified polyacrylate compatibilizer 2,2'-methylene-bis-(4-ethyl-6-tert-butylphenol) 1.2 parts, anhydrite stabilizer 0.9 parts, DCP bridging agent 0.9 parts, acrylate regulator 0.8 parts 0.5 parts, 0.5 parts of 701 powder strengthening agent, 0....

Embodiment 2

[0046] A thermosetting resin material for sealing, 2,2'-[(1-methylethylene)bis(4,1-phenylenecarbaldehyde)]dioxirane and methylene Base-bis(1,3-benzenediol)-tetraglycidyl ether 168 parts, silicone resin modified tung oil alkyd resin 54 parts, o-cresol novolac epoxy resin A44 parts, dioctyl phthalate 25 parts, 35 parts of ethylene propylene rubber, 22 parts of polysiloxane, 20 parts of potassium oleyl amino acid, 16 parts of sodium metasilicate, 26 parts of paraffin, 14 parts of carbon fiber, 15 parts of polymaleimide, 14 parts of phthalic acid , 14 parts of silicon dioxide, 3 parts of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane coupling agent, 3 parts of modified polyacrylate compatibilizer, 2,2' -Methylene-bis-(4-ethyl-6-tert-butylphenol) 0.8 parts, anhydrous gypsum stabilizer 0.6 parts, DCP bridging agent 0.6 parts, acrylate regulator 0.5 parts, 701 powder strengthening agent 0.4 parts, 0.4 parts of polyaluminum chloride coagulant, 0.5 parts of styrene-butadiene ther...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
dielectric lossaaaaaaaaaa
Login to view more

Abstract

The invention discloses a sealing thermo-curing resin material which is prepared from the following raw materials: 2, 2'-[(1-methyl ethylidene) bi (4, 1-phenylene formaldehyde)] dioxirane and methylene-bi (1, 3- hydroquinone)-tetraglycidyl ether, silicon resin modified China wood oil alkide resin, o-cresol formaldehyde epoxy resin A, dioctyl phthalate, ethylene propylene rubber, polysiloxane, oil-based potassium amino acid, sodium metasilicate, paraffin, carbon fibers, polymaleimide, o-phenylenediacetic acid, silicon dioxide and additives. The prepared sealing thermo-curing resin material has excellent comprehensive performance, can be effectively applied to the technical field of electronic components and achieves good sealing effects.

Description

technical field [0001] The invention belongs to the technical field of electronic components and the technical field of packaging material preparation, and in particular relates to a thermosetting resin material for sealing. Background technique [0002] Semiconductor packaging generally uses resin as packaging material to isolate semiconductor devices such as diodes, transistors, integrated circuits, large-scale integrated circuits, and ultra-large-scale integrated circuits from the external environment to protect semiconductor devices from damage caused by external forces or environmental factors. Since epoxy resin can provide excellent plasticity, adhesion, insulation properties, mechanical properties and waterproof properties compared with other thermosetting resins, epoxy resin is widely used as a packaging material for semiconductor devices. For example, US Patent No. 6,342,309 discloses an epoxy resin composition, which includes a novolac type epoxy resin, a brominate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L67/08C08K13/04C08K7/06C08K5/12C08K3/36C08K3/34
CPCC08K2201/014C08L63/00C08L2203/206C08L2205/035C08L2205/16C08L67/08C08K13/04C08K7/06C08K5/12C08K3/36C08K3/34
Inventor 黄宇
Owner 黄宇
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap