Solvent-free type organosilicone coating adhesive and preparation method thereof

A silicone, solvent-free technology, used in adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of poor tear resistance, high production cost, slow curing speed, etc., and achieve shock resistance and corona resistance. Performance, simple production process, good high and low temperature resistance

Active Publication Date: 2016-12-07
新亚电子制程(广东)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the performance of silicone coating adhesives on the market varies, and they usually have disadvantages such as slow curing speed, complicated production process, high production

Method used

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  • Solvent-free type organosilicone coating adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0049] Example 1:

[0050] Put 70 parts by mass of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 500 mPa·s and 30 parts by mass of silicone resin into the reactor, vacuum and stir for 60 minutes, and then add 1 part by mass of methyl tributyl Base ketoxime silane, 2 parts by mass of vinyl tributyl ketoxime silane, 0.3 parts by mass of dibutyltin diacetate, and 0.5 parts by mass of vinyl trimethoxysilane, stirred under vacuum for 30 minutes to obtain a solvent-free organic Silicon coating.

Example Embodiment

[0051] Example 2:

[0052] 50 parts by mass of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 500 mPa·s, 30 parts by mass of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 1500 mPa·s, and 25 parts by mass Put the silicone resin into the reactor, vacuum and stir for 60 minutes, then add 3 parts by mass of vinyl ketoxime silane, 0.2 parts by mass of dibutyltin dilaurate and 1 part by mass of propenyltrimethoxysilane, vacuum Stir under conditions for 30 minutes to obtain a solvent-free silicone coating.

Example Embodiment

[0053] Example 3:

[0054] 60 parts by mass of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 500 mPa·s, 20 parts by mass of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 5000 mPa·s, and 10 parts by mass Put the silicone resin into the reactor, vacuum and stir for 60 minutes, then add 3 parts by mass of vinyl ketoxime silane, 0.7 parts by mass of dioctyltin dilaurate and 0.5 parts by mass of γ-glycidyl ether oxypropyl Trimethoxysilane was stirred for 30 minutes under vacuum to obtain a solvent-free silicone coating.

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Abstract

The invention discloses a solvent-free type organosilicone coating adhesive and a preparation method thereof. The organosilicone coating adhesive is prepared from, by mass, 70-100 parts of hydroxyl end-blocked dimethylsiloxane, 10-30 parts of adhesive film enhancer, 2-6 parts of cross-linking agent, 0.1-0.8 part of catalyst and 0.5-1.5 parts of tackifier. The preparation method of the solvent-free type organosilicone coating adhesive includes the following steps that hydroxyl end-blocked dimethylsiloxane and the adhesive film enhancer are added into a reaction still and stirred and mixed to be uniform under the vacuum condition, the cross-linking agent, the catalyst and the tackifier are added, and the mixture is stirred and mixed to be uniform under the vacuum condition. When the organosilicone coating adhesive is used, no organic solvent is needed for dilution, safety and environment friendliness are achieved, the compactness of cured adhesive film is high, and good high and low temperature resistance, insulating performance, binding performance, dampness resistance, earthquake resistance and corona resistance are achieved; the production process of the organosilicone coating adhesive is simple, the production cost is low, and the product is easy to construct.

Description

technical field [0001] The invention relates to a solvent-free silicone coating glue and a preparation method thereof. Background technique [0002] Circuit boards, electronic components and electrical modules are affected by vibration, high dust, salt spray, humidity, high temperature, etc. during use, and are prone to corrosion, softening, deformation, mildew, etc., resulting in equipment failure. People usually apply a layer of coating glue on the surface of circuit boards, electronic components and electrical modules, etc., to obtain a protective film with functions such as moisture-proof, dust-proof, insulation, and anti-corona. Coating adhesives can be mainly divided into three types: silicone, polyurethane and acrylic. Silicone coating adhesives have excellent properties such as high and low temperature resistance, electrical insulation, ozone resistance, radiation resistance, flame retardancy, and water repellency. The most widely used. [0003] At present, the per...

Claims

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Application Information

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IPC IPC(8): C09J183/06C09J11/06C09J11/08C08G77/20C08G77/12C08G77/14
CPCC08G77/12C08G77/14C08G77/20C08K2201/014C08L2201/08C08L2203/20C08L2205/02C08L2205/025C08L2205/03C09J11/06C09J11/08C09J183/06C08L83/04C08K5/544C08L83/06
Inventor 黄计锋练志良李良
Owner 新亚电子制程(广东)股份有限公司
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