Nano-cerium oxide-nano aluminium nitride hybridization-modified LED organic silicon encapsulation adhesive and preparation method thereof

Abstract

The invention discloses nano-cerium oxide-nano aluminium nitride hybridization-modified LED organic silicon encapsulation adhesive. In the preparation process of the encapsulation adhesive, the nano-cerium oxide and the nano aluminium nitride are subjected to surface treatment by a silane coupling agent and then are put into imidazolium ionic liquid to react to obtain highly-dispersed nano-powder with the surface coated by ionic liquid, octakis(trimethylsiloxy)silsesquioxane is added and is doped with an organic material, the nano-material is efficiently grafted to organic silica gel, and the organic silicon encapsulation adhesive with high heating conductivity, high refractive index and high light and heat stability is finally prepared. The organic silicon encapsulation adhesive has excellent mechanical properties and adhesive ability; the encapsulated LED lamp can maintain high luminescence property for a long time and has a longer service life.

Description

technical field [0001] The invention relates to the technical field of organosilicon encapsulation glue, in particular to a nano-cerium oxide-nano-aluminum nitride hybrid modified LED organosilicon encapsulation glue and a preparation method thereof. Background technique [0002] LED is called the fourth-generation light source, which has the characteristics of energy saving, environmental protection, safety, low power consumption, low heat, high brightness, concentrated beam, easy maintenance, etc., and can be widely used in various indications, displays, decorations, backlights, and general lighting and other fields. At present, improving the luminous efficiency of LED is still a key technical issue. In the process of LED production, the packaging material has a significant impact on the luminous efficiency and service life of the product. The packaging material is required to have high transparency, high refraction, high bonding strength, and light resistance. , heat agi...

AI Technical Summary

Problems solved by technology

At present, the commonly used packaging glue mainly includes epoxy resin and silica gel. Compared with epoxy resin, silica gel has higher light transmittance, UV resistance and heat resistance stability, and has become an ideal packaging material at present. However, the refractive index of silicone material , poor mechanical properties and bonding performance, its application is limited, so the synthesis of silicone encapsulants with high refractive index and high bonding force is a hot spot in industry research

[0003] The current research on silicone encapsulants shows that increasing the refractive index of silica gel can effectively reduce the photon loss caused by the physical barrier of the refractive index and improve the external quantum efficiency. However, the performance of silica gel is greatly affected by the ambient temperature. As the temperature increases, the The increase of thermal stress causes the refractive index of silica gel to decrease, which affects the light efficiency and light intensity distribution of LED. Therefore, improving the thermal conductivity of silica gel plays a vital role in ensuring the refractive index of the material.

At present, the main way to improve the thermal conductivity of silicone encapsulants is to directly add thermal conductive fillers. In order to obtain a more ideal thermal conductivity effect, a large amount of filling is required, which will affect the viscosity, light transmittance and comprehensive mechanical properties of the resin, and thermal conductive fillers The decentralized nature of is also a thorny issue