Preparation process for high-strength high-conductivity micro copper wire

Abstract

The invention discloses a preparation process for a high-strength high-conductivity micro copper wire. The preparation process comprises the following steps: S1, adding electrolytic copper into a smelting furnace, preserving heat and melting the electrolytic copper completely to obtain molten copper, introducing an inert gas, adding a composite refining agent, standing and slagging; S2, detecting that the molten copper comprises the following components in percentage by weight: 0.45 to 0.55 percent of Ti, 0.25 to 0.35 percent of Zr, 0.07 to 0.09 percent of Te, 0.07 to 0.09 percent of La, 0.03 to 0.05 percent of Y, 0.15 to 0.25 percent of Sn, less than or equal to 0.05 percent of Mg, and the balance of Cu; S3, enabling a crystallizer of a continuous casting machine to extend into the molten copper, and drawing upwards through a drawing roller mechanism to form an oxygen-free copper rod; S4, extruding the oxygen-free copper rod continuously and drawing repeatedly to obtain the high-strength high-conductivity micro copper wire. According to the copper wire which is prepared by the preparation process, the electric conductivity reaches over 95 percent IACS, and moreover, the tensile strength is also over 480 MPa.

Description

technical field [0001] The invention relates to the technical field of electrical copper, in particular to a preparation process of high-strength and high-conductivity fine copper wire. Background technique [0002] With the development of the electrical industry, the market demand for cables, wires, switches and copper wires for power supply and distribution equipment has increased rapidly. The reason why copper wire can attract attention and be promoted is inseparable from its high electrical conductivity and high thermal conductivity. With the development of integrated circuits in the direction of high density, multi-function, miniaturization, and low cost, especially the packaging form is changed from the traditional The change from the ceramic package to the plastic package, the copper wire that matches the plastic package will be very useful. [0003] The main problem of copper wire at present is its low strength. It is necessary to greatly increase its strength by ad...

AI Technical Summary

Problems solved by technology

[0003] The main problem of copper wire at present is its low strength. It is necessary to greatly increase its strength by adding alloy elements. For example, although the strength of the Cu-Ni-Si copper alloy material developed in Japan has reached more than 550MPa, the alloy strengthening is often accompanied by A decrease in electrical conductivity, which is the most important performance indicator for copper wire