Thermosetting resin composition and prepregs and laminates produced by using the same
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A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, lamination, lamination devices, etc., which can solve the problems of poor adhesion, damage to the dielectric properties of the system, and low heat resistance.
Active Publication Date: 2017-01-25
SHENGYI TECH SUZHOU
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Problems solved by technology
A large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. However, there are still many problems to be solved in practical applications such as low transition temperature and poor adhesion.
For example, in the Chinese invention patent CN10544841B, a combination of hydrocarbon resin and allyl-modified phenolic resin is used to make printed circuit boards. Although the adhesive performance of the resin is improved, the peel strength of the board is improved, but it is still low. And the heat resistance of the system is low
Chinese patent CN104845363A uses hydrocarbon resin, allyl-modified benzoxazine resin and allyl-modified bismaleimide resin composition to make printed circuit boards, which improves heat resistance and peel strength , but because allyl-modified benzoxazine resin and allyl-modified bismaleimide resin will introduce a large number of hydroxyl groups, which will damage the dielectric properties of the system
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Synthetic example 1
[0069]Put N-(4-hydroxyphenyl)maleimide (190g, 1mol), phenol (94g, 1mol, M94) and oxalic acid (10g) into the flask equipped with thermometer, condenser and stirrer, mix and stir After uniformity, put it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (150mL, the ratio of phenol / aldehyde to 1 / 0.8) dropwise into the flask for 0.5 hours; after adding formaldehyde, maintain 70°C The temperature and stirring conditions were reacted for 15 hours; then, the reaction product was dissolved and diluted with 400mL acetone, and then the reaction product was precipitated with 40% methanol aqueous solution; the above dissolution-precipitation operation was repeated 3 to 5 times, and it was filtered, separated, Drying yielded pure maleimide phenolic formaldehyde (P-1).
[0070] Take 100g of maleimide phenolic novolac (P-1) prepared by the above method and 500g of methyl isobutyl ketone solvent and put them in a flask to fully mix and dissolve, dep...
Synthetic example 2
[0073] With reference to the method of synthetic example 1, the maleimide ester (B-2) of following structure is obtained:
[0074] ; Among them, Ar is , R is phenyl;
[0075] Wherein, n is 1~10, and the ratio of x to y is 0.5:1.
Synthetic example 3
[0077] With reference to the method for synthetic example 1, the maleimide ester (B-3) of following structure is obtained:
[0078] ; Among them, Ar is: , R is maleimidophenyl;
[0079] Wherein, n is 1~10, and the ratio of x to y is 0.1:1.
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Abstract
The invention discloses a thermosetting resin composition. The thermosetting resin composition is prepared from, by solid weight: (a) 10-100 parts of hydrocarbon resin; (b) 20-100 parts of maleimide; (c) 0.1-8 parts of initiator; (d) 10-100 parts of cyanate ester resin. The thermosetting resin composition applies the maleimide with multi-functional long-chain structure and rigid imide ring and combines with a flexible hydrocarbon resin to form a thermosetting composition through the interaction, and finally makes the thermosetting resin composition and prepregs and laminates produced by using the same for the printed circuit have the characteristics of excellent dielectrical property, heat resistance, adhesion, flame resistance, bending strength, toughness, high peel strength, low water absorption, excellent processing performance and others.
Description
technical field [0001] The invention relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition, and belongs to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in...
Claims
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