Chemical mineral dressing pretreatment method for waste printed circuit board multi-metal powder

Abstract

The invention provides a chemical mineral dressing pretreatment method for waste printed circuit board multi-metal powder. According to the chemical mineral dressing pretreatment method for the waste printed circuit board multi-metal powder, oxidizing leaching of the waste printed circuit board multi-metal powder is conducted in an alkaline system containing a catalyst through feeding of oxygen, tin is dissolved into a leaching solution in a sodium stannate form, copper is separated from a residual plastic matrix at the same time, and the tin is recycled from the leaching solution through an electro-deposition method; and a copper-enriched object and waste plastic are generated from leaching residues in a shaking table separation manner, and the waste plastic is oxidized and dissolved in a sulfuric acid solution in a potential-controlled manner, so that copper mixed with the waste plastic is completely dissolved. The essence of the chemical mineral dressing pretreatment method for the waste printed circuit board multi-metal powder is that the waste printed circuit board multi-metal powder is treated in the chemical mineral dressing manner combining alkaline pressurized oxidation leaching and shaking table separation, effective removal of the tin and the plastic in the multi-metal powder is achieved at the same time, and high-quality raw materials are provided for following-up recycling of copper. The content of the plastic in the copper-enriched object is smaller than 0.1%, and the environmental pollution caused in the following-up copper recycling process is completely eradicated through the source treatment measure. The content of the copper in the waste plastic is smaller than 0.1%, and dispersed loss of heavy metal and secondary pollution are avoided.

Description

technical field [0001] The invention relates to a hydrometallurgical process in the field of nonferrous metallurgy, in particular to a hydrometallurgical method for treating polymetallic powder of waste circuit boards by using a chemical beneficiation method combining alkaline pressure oxidation leaching and shaking table separation. Background technique [0002] In recent years, the electrical and electronic industry has developed rapidly, and corresponding waste electric and electronic equipment or e-wate (WEEE) has become the fastest growing urban mineral resource in the world. According to reports, the global e-waste production in 2013 was 39.8 million tons, which rose to 41.8 million tons in 2014, and is expected to reach 50 million tons in 2018, and will maintain a high growth rate of about 2 million tons per year. UN estimates that the global annual The output is 20-50 million tons. According to estimates, 5 million computers were scrapped in the United States between...

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Problems solved by technology

[0006] According to production experience and literature reports, the pyro-smelting process of polymetallic powder for circuit boards will bring the following problems: on the one hand, the tin in the polymetallic powder will be dispersed in the three products of blister copper, smelting slag and smoke during the reduction smelting process , not only makes it difficult to effectively recycle tin, but also makes it difficult for the subsequent electrolytic refining to operate normally, making the quality of cathode copper unqualified; on the other hand, the solder mask oil in the multi-metal powder and the remaining substrate will produce toxic and harmful Gas, which brings serious environmental pollution risk, and the smell of smelting flue gas is difficult to eliminate

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