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Bottom filling adhesive having good compatibility with scaling powder and preparation method thereof

An underfill and compatibility technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve problems such as low reliability, poor flux compatibility, and small expansion coefficient, so as to ensure reliability , flow speed and solidification speed are fast, and the expansion coefficient is small

Active Publication Date: 2017-02-15
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the disadvantages of poor compatibility with flux and low reliability in existing common underfills, the present invention provides an underfill with good compatibility with flux and a preparation method thereof, and obtains products compatible with fluxes Excellent, fast flow speed and curing speed, small expansion coefficient, so that the packaging components have higher reliability

Method used

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  • Bottom filling adhesive having good compatibility with scaling powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] a. Add 500 parts of rosin dimer acid into the kettle, heat and melt, continue to heat to 180°C, add 140 parts of xylene formaldehyde resin Nikanol and 1.0 parts of catalyst p-toluenesulfonic acid under stirring, in a nitrogen-protected environment React for 2 hours, then add 90 parts of 1,4-butanediol diglycidyl ether and 0.2 part of triphenylphosphine, and react for another 3 hours to obtain a self-synthetic compatible resin.

[0036] b. Add 5% of self-synthesized compatible resin, 50% of cycloaliphatic epoxy resin 2021P, 5% of dodecyl to myristyl glycidyl ether, β-(3,4-epoxycyclohexyl) in the following percentages by weight 3% of ethyltrimethoxysilane, 1% of dispersant BYK-9076, 50% of silicon micropowder, and 30% of curing agent PN23 are successively dropped into a stirring tank, stirred evenly, and vacuumized for degassing to obtain the compound of the present invention and Underfill with good flux compatibility.

Embodiment 2

[0038] a. Add 700 parts of tall oil dimer acid into the kettle, heat and melt, continue heating to 220°C, add 360 parts of xylene formaldehyde resin Nikanol and 8.0 parts of catalyst p-toluenesulfonic acid under stirring, under nitrogen protection The reaction was carried out in an environment for 4 hours, then 190 parts of 1,6-hexanediol diglycidyl ether and 3.0 parts of triphenylphosphine were added, and the reaction was continued for 6 hours to obtain a self-synthetic compatible resin.

[0039] b. Add 25% of self-synthesized compatible resin, 20% of bisphenol A epoxy resin 828EL, 20% of trimethylol triglycidyl ether, and 2.0% of γ-glycidyloxypropyl trimethoxysilane in the following weight percentages %, 0.5% of dispersant BYK-W9010, 35% of silicon micropowder, and 5.0% of curing agent PN40, put them into the stirring tank in turn, stir evenly, vacuumize and defoam, and make the bottom of the present invention with good compatibility with flux Filler.

Embodiment 3

[0041] a. Add 600 parts of soybean oil dimer acid into the kettle, heat and melt, continue to heat to 200 ° C, add 260 parts of xylene formaldehyde resin Nikanol and 4.0 parts of catalyst p-toluenesulfonic acid under stirring, in a nitrogen-protected environment React in the environment for 3 hours, then add 140 parts of neopentyl glycol diglycidyl ether and 1.6 parts of triphenylphosphine, and react for another 4.5 hours to obtain a self-synthetic compatible resin.

[0042] b. Add 15% of self-synthesized compatible resin, 35% of bisphenol F epoxy resin 830LVP, 13% of 4-tert-butylphenyl glycidyl ether, and 2.5% of γ-mercaptopropyl trimethoxysilane in the following weight percentages , 0.1% of dispersant BYK-W985, 42% of silicon micropowder, and 17% of curing agent fujicure 1020 are put into the stirring tank in turn, stirred evenly, vacuumized and defoamed, and the bottom with good compatibility with flux of the present invention is obtained. Filler.

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Abstract

The invention discloses a bottom filling adhesive having good compatibility with scaling powder and a preparation method thereof. The bottom filling adhesive is compounded by, by weight, 5-25 parts of self-synthesized compatible resin, 20-50 parts of epoxy resin, 5-20 parts of thinner, 1-3 parts of coupling agent, 0.1-1 part of dispersant, 35-50 parts of filler and 5-30 parts of curing agent, wherein the self-synthesized compatible resin is compounded by, by weight, 500-700 parts of dimer acid, 140-360 parts of hydroxyl-terminated toughened resin, 1-8 parts of methyl benzenesulfonic acid, 90-190 parts of low-viscosity bifunctional epoxy resin and 0.2-3.0 parts of triphenyl phosphine. Compared with the prior art, the compatibility with scaling powder of the bottom filling adhesive is excellent, the defects formed in the flowing and curing process are decreased, the flowing speed and the curing speed are high, the bottom filling adhesive meets the requirement for high density packaging, an expansion coefficient is small, and the reliability of packaging components is effectively guaranteed.

Description

technical field [0001] The invention relates to an underfill adhesive with good compatibility with soldering flux and a preparation method thereof, which is suitable for underfill for packaging such as chip size packaging (CSP) and ball grid array packaging (BGA), and belongs to the field of adhesives. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced. Intelligence, light weight, small size, fast speed, strong function, and good reliability have become the main development trends of electronic products. In order to adapt to the development of this trend, flip-chip technology has been produced. Key benefits of flip-chip include shrinkability and space savings, in addition to shorter and lower inductance interconnect paths, high I / O density, rework and self-alignment capabilities. Flip-chip performance is also outstanding for thermal management. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04
CPCC08L2203/206C08L2205/025C09J11/04C09J163/00C08L63/00C08K3/36
Inventor 姜贵琳王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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