In-situ compatibilization polymerization enhanced thermosetting phenolic foam insulation board and preparation method thereof

Abstract

The invention discloses an in-situ compatibilization polymerization enhanced thermosetting phenolic foam insulation board and a preparation method thereof, wherein the in-situ compatibilization polymerization enhanced thermosetting phenolic foam insulation board comprises the following materials in parts by weight: 50-60 parts of resol, 20-30 parts of hydroxymethyl polyamide resin, 20-35 parts of a modified filler, 5-10 parts of a curing agent, 3-7 parts of an emulgator, 8-15 parts of a foaming agent, 0.5-1 part of a heat stabilizer, and 0.5-1 part of an ultraviolet light absorber; the resol is a component of foamex, the hydroxymethyl polyamide resin is a chain extender and a toughening component, and the modified filler is an in-situ compatibilization polymerization enhancing component. The resol, the hydroxymethyl polyamide resin, the modified filler, the curing agent, the emulgator, the foaming agent, the heat stabilizer and the ultraviolet light absorber prepared in advance are added into a reaction kettle, stirred evenly, and applied onto a non-woven fabric; on a continuous board production line, the temperature is kept at 70-75 DEG C, and crosslinking and foaming are performed within 20 minutes to obtain the in-situ compatibilization polymerization enhanced thermosetting phenolic foam insulation board. The in-situ compatibilization polymerization enhanced thermosetting phenolic foam insulation board is low in residue rate, high in compression strength and tensile strength, and good in heat resistance and ageing resistance.

Description

technical field [0001] The invention relates to an in-situ compatibilization polymerization reinforced thermosetting phenolic foam insulation board and a preparation method thereof, belonging to the field of preparation of building insulation materials. Background technique [0002] Phenolic foam board is a thermosetting material formed by cross-linking, curing and foaming of resole phenolic resin, curing agent, foaming agent and other additive components under high temperature conditions. Phenolic foam board has excellent flame retardancy, low smoke density, high temperature resistance, and good thermal insulation performance, so it is widely used in the field of building insulation materials. Compared with traditional inorganic thermal insulation materials such as rock wool, glass wool, and foam glass, phenolic foam board has the advantages of light weight, easy installation, and good thermal insulation and energy saving effects. Compared with traditional organic insulati...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the defects of thermosetting phenolic foam boards such as poor toughness, low cohesive energy, high slag dropping rate, and low mechanical strength, the object of the present invention is to prepare an in-situ compatibilization and polymerization-enhanced phenolic foam board, which uses resole phenolic resin as the foaming material. Resin main agent, methylol polyamide resin as chain extender and toughening component, improve molecular weight, cohesive energy and molecular chain toughness of resole phenolic resin, modified filler silica and asbestos fiber Compatible polymerization reinforcement components, forming skeleton filling and fiber reinforced composite compatibility system, improving the compressive and tensile strength of thermosetting phenolic resin, adding curing agent, emulsifier, foaming agent, heat stabilizer, ultraviolet absorber, etc. to improve phenolic resin Stability and aging resistance of foam board