Wear-resistant graphite fiber AlSiC composite for electronic packaging and preparing method thereof

Abstract

The invention discloses a wear-resistant graphite fiber AlSiC composite for electronic packaging. The wear-resistant graphite fiber AlSiC composite is prepared from the following raw materials in parts by weight: 11-13 of graphite fibers, 75-78 of SiC, 95-100 of 6061 aluminum alloy, 0.4-0.6 of aluminum oxide, 4-4.3 of phosphoric acid, 13-14 of a pore forming agent, 2-2.5 of PVP, a proper quantity of dichloromethane, a proper quantity of DMF, 1.3-1.5 of nanometer lanthanum borate, 1.3-1.5 of aluminum nitride, 0.6-0.8 of bi(ferrocenylacetylene), 1.3-1.5 of aluminum glycinate and 43-45 of ethanol. By adding the graphite fibers, a linear heat radiating path is formed. Compared with the individual point contact of the SiC, the heat radiating property is improved. By gluing the nanometer lanthanum borate to the graphite fibers, heat conducting anisotropy is reduced, and the heat radiating property is stable. By using the aluminum nitride, the bi(ferrocenylacetylene) and the aluminum glycinate, the wear resistance and the oxidation resistance of the material are improved, and the machinability is great.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic packaging, in particular to a graphite fiber AlSiC composite material for wear-resistant electronic packaging and a preparation method thereof. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. AlSiC composite materials have outstanding advantages such as cheap raw materials, high thermal conductivity, and adjustable thermal expansion coefficient, and have been more and more widely used in the field of electronic packaging. In the experiment, ɑ-SiC particles were used as reinforcement, aluminum alloy as matrix, pore forming agent and binder to prepare AlSiC composite materials. The preparation process adopts the process of combining the molding method and the vacuum pressure...

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Problems solved by technology

[0003] The obtained AlSiC composite material has good thermal conductivity and small thermal expansion coefficient, but the interface compatibility between SiC and aluminum is not good, and it is easy to separate, so that the performance of the material cannot be stable for a long time. Moreover, the pure granular SiC has a small contact point area and thermal conductivity. Reached the best, need to improve, also need to improve the wear resistance of the material