A vitrified bond, vitrified disc and preparation method thereof
A ceramic bond and grinding disc technology, which is applied in grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of complex design and manufacture of grinding wheels, less research on grinding effects, low durability of grinding discs, etc., to improve self-sharpening. performance, reduce material costs, and improve durability and longevity
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[0022] A method for preparing a vitrified bond grinding disc, comprising the following steps:
[0023] (1) Mix vitrified bond with whiskers, then add CBN or diamond, white corundum and mix evenly, use resin liquid or dextrin liquid as wetting agent, press molding, the pressing pressure is 10-20MPa, and the pressing time is 10s;
[0024] (2) The molded product obtained in step (1) is sintered and solidified at 600-700°C for 2 hours, and the obtained grinding layer is bonded to the grinding wheel base by epoxy resin;
[0025] (3) After uniformly mixing silicon carbide, wollastonite, graphite and thermosetting resin, casting at 50°C on the grinding wheel substrate bonded with the grinding layer obtained in step (2), and then grinding and processing.
Embodiment 1
[0027] Vitrified bond grinding disc, including grinding layer and filling layer, the grinding layer is composed of the following raw materials in volume percentage: 800# cubic boron nitride 30%, 300# white corundum 20%, 5-10μm vitrified bond 15 %, 3.5% aluminum borate whiskers with an aspect ratio of 4:1, and the balance is a wetting agent; the filling layer is composed of the following raw materials in volume percentage: 10-12μm silicon carbide 40%, 5-6μm graphite 20% , 30-32μm wollastonite 10%, thermosetting resin 30%; wherein, the ceramic bond is composed of the following raw materials in parts by weight: SiO 2 60 copies, B 2 o 3 20 copies, Al 2 o 3 15 copies, Li 2 O 4 parts, Bi 2 o 3 7 copies, P 2 o 5 10 parts, TiO 2 1.0 parts, Sb 2 o 5 0.5 servings.
[0028] The preparation method of the vitrified bond grinding disc of the present embodiment comprises the following steps:
[0029] (1) Mix vitrified bond with aluminum borate whiskers, then add CBN and whi...
Embodiment 2
[0034] Vitrified bond grinding disc, including grinding layer and filling layer, the grinding layer is composed of the following raw materials in volume percentage: 180# diamond 45%, 400# white corundum 22%, 10-30μm vitrified bond 13%, long Potassium titanate whiskers with a diameter ratio of 5:1 are 4%, and the rest is a wetting agent; the filling layer is composed of the following raw materials in volume percentages: 25-30μm silicon carbide 60%, 8-10μm graphite 15%, thermosetting Resin 25%; Wherein, vitrified agent is made up of each raw material of following weight part: SiO2 36 copies, B 2 o 3 22 parts, Al 2 o 3 20 copies, Li 2 O 3 parts, Bi 2 o 3 6 copies, P 2 o 5 12 parts, TiO 2 0.7 parts, Sb 2 o 5 2 servings.
[0035] The preparation method of the vitrified bond grinding disc of the present embodiment comprises the following steps:
[0036] (1) Mix vitrified bond with potassium titanate whiskers, then add diamond and white corundum, mix evenly in a thr...
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