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Low-dielectric bismaleimide resin system and preparation method of low-dielectric bismaleimide resin system

A technology of bismaleimide resin and bismaleimide, applied in the field of low-dielectric bismaleimide resin system and its preparation, low-dielectric high-performance resin-based composite materials, can solve the problem of thermosetting Poor dielectric properties of the resin system, reduced resin system crosslinking density, strength, heat resistance, low moisture absorption, etc., to achieve excellent mechanical properties and thermal properties, good mechanical properties, and low dielectric properties

Active Publication Date: 2017-05-31
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyphenylene oxide (PPO) is an important high-performance thermoplastic resin, which has a high glass transition temperature (Tg=210°C), good heat resistance and dimensional stability, high toughness, low Moisture absorption rate, although the addition of PPO can reduce the dielectric properties of the thermosetting resin system to a certain extent, however, the addition of a higher content of PPO will reduce the crosslinking density or other properties of the resin system such as strength and heat resistance, etc., and used alone PPO is less effective in reducing the dielectric properties of thermosetting resin systems

Method used

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  • Low-dielectric bismaleimide resin system and preparation method of low-dielectric bismaleimide resin system
  • Low-dielectric bismaleimide resin system and preparation method of low-dielectric bismaleimide resin system
  • Low-dielectric bismaleimide resin system and preparation method of low-dielectric bismaleimide resin system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Completely dissolve 2g of polyphenylene ether (vinyl-terminated polyphenylene ether with a number average molecular weight of 1100 (PPO* MX9000-111)) in 25ml of toluene to obtain a polyphenylene ether solution, and then add 0.6g of mesoporous silica (UC-S-1), after stirring and dispersing, add it to 500ml aqueous solution of sodium lauryl sulfate surfactant with a mass concentration of 0.15% to form an oil-in-water system. Since polyphenylene ether is insoluble in water, with the gradual volatilization of toluene solvent, the precipitated polyphenylene ether will be deposited or adsorbed on the surface of mesoporous silica to seal the mesoporous pores. After stirring for 4 hours, the precipitate was washed, suction filtered, and vacuum-dried at 120°C for 4 hours to obtain a polyphenylene ether-filled and coated mesoporous silica material, wherein the mass ratio of polyphenylene ether to mesoporous silica raw material was 3.3: 1. figure 1 Scanning electron microscope (S...

Embodiment 2

[0036] Completely dissolve 2g of polyphenylene ether (vinyl-terminated polyphenylene ether with a number average molecular weight of 1100 (PPO* MX9000-111)) in 25ml of toluene to obtain a polyphenylene ether solution, and then add 1.0g of mesoporous silica (UC-S-1), after stirring and dispersing, add it to 500ml aqueous solution of sodium lauryl sulfate surfactant with a mass concentration of 0.2%, to form an oil-in-water system. Since polyphenylene ether is insoluble in water, with the gradual volatilization of toluene solvent, the precipitated polyphenylene ether will be deposited or adsorbed on the surface of mesoporous silica to seal the mesoporous pores. After stirring for 5 hours, the precipitate was washed, filtered, and vacuum-dried at 120°C for 5 hours to obtain a polyphenylene ether-filled and coated mesoporous silica material, wherein the mass fraction ratio of polyphenylene ether to mesoporous silica raw material was 2 :1. Figure 4 SEM photo of mesoporous silica ...

Embodiment 3

[0044] 2g of polyphenylene ether (Noryl* SA9000 with a number average molecular weight of 2200) was completely dissolved in 30ml of toluene to obtain a polyphenylene ether solution, and then 1.4g of mesoporous silica (UC- S-3), after stirring and dispersing, add to 500ml aqueous solution of potassium monododecyl phosphate surfactant with a mass concentration of 0.3%, to form an oil-in-water system. Since polyphenylene ether is insoluble in water, with the gradual volatilization of toluene solvent, the precipitated polyphenylene ether will be deposited or adsorbed on the surface of mesoporous silica to fill or seal the mesoporous pores. After stirring for 6 hours, the precipitate was washed, filtered, and vacuum-dried at 120°C for 6 hours to obtain a polyphenylene ether-filled and coated mesoporous silica material, wherein the mass fraction ratio of polyphenylene ether to mesoporous silica raw material was 1.43 :1.

[0045] Stir and heat 50g of bismaleimide diphenyl ether and ...

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Abstract

The invention discloses a low-dielectric bismaleimide resin system and a preparation method of the low-dielectric bismaleimide resin system. The low-dielectric bismaleimide resin system takes bismaleimide, an allyl compound, mesoporous silicon dioxide and polyphenylene ether as raw materials; the mesoporous silicon dioxide coated with the polyphenylene ether is prepared and is applied to the bismaleimide resin system to prepare the low-dielectric and high-performance bismaleimide resin system; the method disclosed by the invention has the characteristics of simple process, wide applicability and the like; the prepared material has a wide application potential in the fields of aviation, aerospace and electronics.

Description

technical field [0001] The invention belongs to the technical field of high-performance resin matrix, and relates to a low-dielectric high-performance resin-based composite material, in particular to a low-dielectric bismaleimide resin system and a preparation method thereof. Background technique [0002] Bismaleimide resin system is a typical high-performance thermosetting resin with excellent mechanical properties, thermal properties and electrical properties, etc. It has outstanding application potential in the field of aviation and aerospace electronic materials. With the rapid development of microelectronics technology, the performance of the existing bismaleimide resin system materials can no longer meet the development of high-integration, lower power consumption and high-performance electronic products, which requires the development of low dielectric materials with better performance. Electrically high performance bismaleimide resin system. Modification of bismalei...

Claims

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Application Information

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IPC IPC(8): C08G73/12C08K9/10C08K3/36C08K7/26
CPCC08G73/12C08G73/124C08K3/36C08K7/26C08K9/10C08K2201/011
Inventor 袁莉顾嫒娟梁国正
Owner SUZHOU UNIV
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