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Method for chemically plating nickel-palladium alloy on PCB board

A technology for PCB board and electroless nickel plating, which is applied in the field of electroless nickel-palladium alloy plating, can solve problems such as complex processes, and achieve the effects of simple electroplating process, excellent physical properties, and easy expansion of production.

Inactive Publication Date: 2017-05-31
JIANGSU AOGUANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first four surface treatments all have certain defects. In recent years, the popular chemical nickel-palladium-gold process has been widely used because the coating has good wear resistance and corrosion resistance and can be welded. However, the expensive precious metal Au is used, and the process slightly complicated

Method used

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  • Method for chemically plating nickel-palladium alloy on PCB board
  • Method for chemically plating nickel-palladium alloy on PCB board
  • Method for chemically plating nickel-palladium alloy on PCB board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for the electroless nickel-palladium alloy plating of PCB, comprising the steps:

[0025] (1) Degreasing: Put the PCB board into the degreasing agent and ultrasonically treat it for 10-15 minutes;

[0026] (2) Micro-etching: Put the PCB board into the micro-etching solution and let it stand for 1-2 hours;

[0027] (3) Activation: Put the PCB board into the palladium activation solution for activation, the activation temperature is 25-30°C;

[0028] (4) electroless nickel-palladium plating: wire PCB board is put into electroplating in nickel-palladium alloy bath, and described nickel-palladium alloy bathing liquid comprises following components:

[0029] Nickel sulfamate 0.3~0.5mol / L, palladium tetraammine dichloride 0.3~0.6mol / L, sodium ethylenediamine diacetate 0.01~0.05mol / L, ammonium chloride 0.1~0.5mol / L, boric acid 0.002~ 0.003mol / L, sodium sulfate 0.0001~0.0002mol / L, phenylpropanamide 0.002~0.004mol / L, glutaraldehyde 0.0002~0.0003mol / L, brightener, comp...

Embodiment 2

[0036] Example 2: Effect of pH on coating composition and current efficiency.

[0037] Electroplating solution is composed as follows, and other conditions are with embodiment 1:

[0038] Nickel sulfamate 0.3mol / L, tetraammine palladium dichloride 0.3mol / L, sodium ethylenediaminediacetate 0.01mol / L, ammonium chloride 0.1mol / L, boric acid 0.002mol / L, sodium sulfate 0.0001mol / L L, phenylpropanamide 0.002mol / L, glutaraldehyde 0.0002mol / L, 1,10-phenanthroline 0.004mol / L, acetylacetone 0.024mol / L, triethanolamine 0.015mol / L, polydisulfide Sodium sulfonate 0.006mol / L, sodium phenyldithiopropane sulfonate 0.06mol / L, pH7.5~8.5, solvent is water;

[0039] Plating method:

[0040] Put the cleaned copper sheet into the palladium ferry solution with a current density of 0.5A / dm -2 , the temperature of the liquid is 28°C, and the tank pressure is 4V.

[0041] Electroplating effect: It can be seen from Table 1 that the electroplating effect is between pH 7.5 and 9.5.

[0042] Table 1 E...

Embodiment 3

[0046] Electroplating solution is composed as follows, and other conditions are with embodiment 1:

[0047] Nickel sulfamate 0.3~0.5mol / L, palladium tetraammine dichloride 0.3~0.6mol / L, sodium ethylenediamine diacetate 0.01~0.05mol / L, ammonium chloride 0.1~0.5mol / L, boric acid 0.002~ 0.003mol / L, sodium sulfate 0.0001~0.0002mol / L, phenylpropanamide 0.002~0.004mol / L, glutaraldehyde 0.0002~0.0003mol / L, 1,10-phenanthroline 0.001~0.005mol / L, acetyl Acetone 0.02~0.03mol / L, triethanolamine 0.01~0.02mol / L, sodium polydithiodipropanesulfonate 0.005~0.008mol / L, sodium phenyldithiopropanesulfonate 0.05~0.08mol / L, pH7.5 ~8.5, the solvent is water.

[0048] Electroplating method: put the cleaned copper alloy into the palladium solution, and the current density is 0.1~0.5.A / dm -2 , The temperature of the liquid is 35°C, and the tank pressure is 4V.

[0049] Electroplating effect: It can be seen from Table 2 that the electroplating effect is the best when the current density is between 0....

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PUM

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Abstract

The invention discloses a method for chemically plating a nickel-palladium alloy on a PCB board. The method is characterized by comprising the following steps of: (1) removing oil: putting the PCB board into an oil removing agent, and performing ultrasonic treatment for 10-15 minutes; (2) performing micro-etching: putting the PCB board into a micro-etching solution, and standing for 1-2 hours; (3) activating: putting the PCB board into an activating solution to activate at an activating temperature being 25-30 DEG C; (4) chemically plating nickel and palladium; and (5) performing washing and drying: washing the surface of a circuit board with water, and drying at a temperature from 55 DEG C to 65 DEG C. Content of palladium in the coating is about 80%, and the coating is fine in texture, is free of cracks, is uniform in color, is free of peeling and bubbling phenomena, and is good in adhesion force.

Description

technical field [0001] The invention belongs to the technical field of metal plating solutions, and in particular relates to a method for electroless nickel-palladium alloy plating on PCB boards. Background technique [0002] Gold plating is widely used in the electronics industry, jewelry and watch industry. With the development of the electronic industry and the improvement of people's living standards, the amount of gold required is increasing. In order to save resources and reduce product costs, countries around the world have taken many measures to save gold. The selection of gold-substituting materials has attracted people's attention abroad, such as electroplating silver, tin, lead-tin alloy, tin-nickel alloy, palladium, palladium-nickel alloy and other coatings instead of gold or part of the gold coating. Moreover, some alternative coatings have been used in production. For example, for connectors with higher requirements for coating quality, palladium or palladium...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D5/56C25D7/00
CPCC25D3/567C25D5/56C25D7/00
Inventor 何爱芝彭红军袁小菊丁荣军丁会梅
Owner JIANGSU AOGUANG ELECTRONICS
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