Heat-conducting film and application

Abstract

The invention discloses a heat-conducting film and application. The heat-conducting film is prepared from the following raw materials in parts by weight: 80-160 parts of ethyl acetate, 10-80 parts of a polyimide emulsion, 80-120 parts of an acrylic ester adhesive, 0.05-0.5 part of a cross-linking agent, 10-110 parts of graphene, 0.1-2 parts of a coupling agent, 0-8 parts of a dispersing agent, 110-180 parts of butanone, 0.1-2 parts of an additive and 110-170 parts of toluene. The heat-conducting film is prepared through the steps of weighing ethyl acetate, the polyimide emulsion, the acrylic ester adhesive, cross-linking agent, graphene, the coupling agent, the dispersing agent, butanone, the additive and toluene according to parts by weight; and sintering in a nitrogen condition at a high temperature of 800-3,000 DEG C. The prepared heat-conducting film is light in weight, small in thickness, good in toughness and excellent in heat-conducting property, and can be widely applied to the fields of a smart phone, a tablet computer, LED lighting equipment, a smart television, semiconductor manufacturing equipment and automotive electronic equipment. The used raw materials are wide in source, simple and controllable in preparation, extremely low in production cost and suitable for industrial production.

Description

technical field [0001] The invention relates to the technical field of thin films, in particular to a thermally conductive thin film and its application. Background technique [0002] In recent years, with the rapid development of science and technology, the design of instruments and equipment has become more and more obvious in the characteristics of lightness, thinness, shortness, smallness and high efficiency. However, at the same time, an important problem is that the equipment generates a lot of heat during operation. If the heat is not removed in time, it will seriously affect the working stability, safety and reliability of electronic devices. Traditional heat dissipation materials are mainly metal materials (such as: silver, copper, aluminum), these materials have high density, high thermal expansion coefficient, and insufficient thermal conductivity (among them, the three metals with high thermal conductivity, silver, copper, and aluminum The thermal conductivity i...

AI Technical Summary

Problems solved by technology

However, at the same time, an important problem is that the equipment generates a lot of heat during operation. If the heat is not removed in time, it will seriously affect the working stability and safety reliability of electronic devices.