Method for recovering high-purity silicon powder from crystal silicon cutting waste material slurry
A technology for cutting waste and high-purity silicon powder, applied in chemical instruments and methods, silicon compounds, inorganic chemistry, etc., can solve problems such as harsh operating environment, increased cost of silicon powder, and difficulty in recycling waste slurry, so as to reduce environmental pollution, Reduced separation time and less contamination
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0053] A method for reclaiming high-purity silicon powder from the cutting waste slurry of crystalline silicon, comprising the following steps:
[0054] Step 1, preparation before cutting
[0055] (1) The cutting wire of the multi-wire cutting machine adopts resin diamond wire;
[0056] (2) The holding material of crystalline silicon adopts epoxy resin board;
[0057] Step 2, waste slurry treatment
[0058] (1) Cut crystalline silicon with a multi-wire cutting machine, collect the cutting waste slurry, the composition and mass percentage of the cutting waste slurry are: 40% water-based cooling liquid, 58% silicon powder, and 1% metal impurities , 1% small diamond particles;
[0059] (2) Add 5kg of starch to the 500kg diamond wire cutting crystalline silicon waste slurry, settling and stratifying, the upper layer is the supernatant, and the lower layer is the sedimentation material, carry out a solid-liquid separation, and the supernatant of the upper layer returns to the cr...
Embodiment 2
[0064] A method for reclaiming high-purity silicon powder from the cutting waste slurry of crystalline silicon, comprising the following steps:
[0065] Step 1, preparation before cutting
[0066] (1) The cutting wire of the multi-wire cutting machine adopts electroplated diamond wire;
[0067] (2) The holding material of crystalline silicon adopts epoxy resin board;
[0068] Step 2, waste slurry treatment
[0069] (1) Cut crystalline silicon with a multi-wire cutting machine, collect the cutting waste slurry, the composition and mass percentage of the cutting waste slurry are: 50% water-based cooling liquid, 47% silicon powder, and 1.5% metal impurities , 1.5% small diamond particles;
[0070] (2) Add 12kg of polyacrylamide to 600kg of diamond wire cutting crystalline silicon waste slurry, settling and stratifying, the upper layer is the supernatant, and the lower layer is the sedimentation material, perform a solid-liquid separation, and the upper layer of the supernatant...
Embodiment 3
[0075] A method for reclaiming high-purity silicon powder from the cutting waste slurry of crystalline silicon, comprising the following steps:
[0076] Step 1, preparation before cutting
[0077] (1) The cutting wire of the multi-wire cutting machine adopts resin diamond wire;
[0078] (2) The holding material of crystalline silicon adopts graphite plate;
[0079] Step 2, waste slurry treatment
[0080] (1) Cut crystalline silicon with a multi-wire cutting machine, collect the cutting waste slurry, the composition and mass percentages of the cutting waste slurry are: 50% water-based cooling liquid, 45% silicon powder, and 2% metal Impurities, 3% small diamond particles;
[0081] (2) Add 15kg of polyethyleneimine to 650kg of diamond wire cut crystalline silicon waste slurry, settling and stratifying, the upper layer is the supernatant, and the lower layer is the sedimentation material, perform a solid-liquid separation, and the supernatant of the upper layer returns to the ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com