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A kind of photosensitive resin composition and its application

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of high hardness and brittleness of the coating film of insulating flattening film, poor adhesion, etc., and achieve excellent adhesion and thermal stability Effect

Active Publication Date: 2020-05-08
QINGDAO LANFAN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of high hardness and brittleness and poor adhesion of the coating film of the existing integrated circuit insulation planarization film, we proposed a photosensitive resin composition, which has the advantages of sensitivity, smoothness, adhesion and thermal stability. Excellent, suitable for forming insulating planarization film of semiconductor integrated circuits

Method used

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  • A kind of photosensitive resin composition and its application
  • A kind of photosensitive resin composition and its application
  • A kind of photosensitive resin composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Synthesis of Alkali-Soluble Resin:

[0047] In a 1L three-necked flask, add 10g 22' azo (2.4 dimethylvaleronitrile) and 500g tetrahydrofuran, 25g methacrylic acid, 25g hydroxypropyl methacrylate, 25g styrene and 25g n-butyl methacrylate, after nitrogen replacement , stirred slowly at 62°C for 10 hours, precipitated in diethyl ether, removed the solvent by vacuum filtration, and dried in vacuum below 30°C to obtain the alkali-soluble resin R. The weight-average molecular weight is MW10000 when converted to styrene by GPC detection.

[0048] Manufacture of 1,2 naphthoquinone diazide compound PAC1:

[0049] The structure is 44'-(1(4(1(4-hydroxyphenyl)1-methylethyl)phenyl)ethylene)bisphenol 1.2-diazinaphthoquinone-5-sulfonate, passed through 1 mole Condensation of 44'-(1(4(1(4-hydroxyphenyl)1-methylethyl)phenyl)ethylene)bisphenol with 2 moles of 1.2-diazinaphthoquinone-5-sulfonyl chloride Response gets.

[0050] Manufacture of epoxy-containing polyvinyl acetal resin:

...

Embodiment 2

[0056] The synthesis of the alkali-soluble resin and the production of the 1,2naphthoquinone diazide compound PAC1 are basically the same as in Example 1.

[0057] Manufacture of epoxy-containing polyvinyl acetal resin:

[0058] Weigh 7.5g of PVA-103 (Kuraray, Japan) and add it to a 250ml three-necked flask, add 100g of dimethyl sulfoxide under stirring, heat up to 80°C to dissolve, cool down to 60°C, add 1g of p-toluenesulfonic acid, n-butyraldehyde 3.06g, 2.08g of p-hydroxybenzaldehyde, reacted at 70°C for 5 hours, diluted with 20g of DMSO, dispersed in 2 liters of water to obtain a white powder, filtered and washed with hot air at 60°C to obtain PCB2 polyvinyl acetal 11.81 g.

[0059] Weigh 11g of polyvinyl acetal resin, 30ml of epichlorohydrin and 0.15g of tetrabutylammonium chloride into a 100ml three-neck flask, react at 100°C for 3 hours, then cool to 60°C, within 1.5 hours, use Add 25ml of 10% sodium hydroxide aqueous solution dropwise to the separatory funnel, react...

Embodiment 3

[0062] The synthesis of the alkali-soluble resin and the production of the 1,2naphthoquinone diazide compound PAC1 are basically the same as in Example 1.

[0063] Manufacture of epoxy-containing polyvinyl acetal resin:

[0064] Weigh 7.5g of PVA-103 (Kuraray, Japan) and add it to a 250ml three-necked flask, add 100g of dimethyl sulfoxide under stirring, heat up to 80°C to dissolve, cool down to 60°C, add 1g of p-toluenesulfonic acid, n-butyraldehyde 3.06g, 2.6g of 2.6 dimethyl 4-hydroxybenzaldehyde, reacted at 70°C for 5 hours, diluted with 20g of DMSO, dispersed in 2 liters of water to obtain a white powder, filtered and washed with hot air at 60°C to obtain PCB3 polymer Vinyl acetal 11.31 g.

[0065] Weigh 11g of polyvinyl acetal resin, 30ml of epichlorohydrin and 0.15g of tetrabutylammonium chloride into a 100ml three-neck flask, react at 100°C for 3 hours, then cool to 60°C, within 1.5 hours, use Add 25ml of 10% sodium hydroxide aqueous solution dropwise to the separato...

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Abstract

The invention discloses a photosensitive resin composite and an application thereof. The composite comprises the following components: a) alkali-soluble resin, b) a 1,2-quinone-bi-azide compound, c) a polyvinyl acetal compound containing an epoxy group, and d) a solvent. The composite has the benefits that the sensitivity, the smoothness, the adhesivity and the thermal stability are excellent; the composite is suitable for forming an insulated smooth film of a semiconductor integrated circuit.

Description

technical field [0001] The invention relates to the field of photosensitive resin compositions, in particular to a photosensitive resin composition for forming an insulating planarized film of a semiconductor integrated circuit and an application thereof. Background technique [0002] In the wide application of producing semiconductor integrated circuits, photolithography technology has been used to form micro components or perform fine processing. With the increase of integrated circuit speed and integration density, the design requirements of integrated circuits are getting higher and higher. In recent years The formation technology of interlayer insulating planarization film used in photolithography technology is attracting attention as a new application, especially in the market demand for high precision and micro technology of FPD display panel is very strong, because in order to achieve such high precision And micro technology, highly transparent insulating film is a n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004H01L23/29
CPCG03F7/004H01L23/293
Inventor 于成华
Owner QINGDAO LANFAN NEW MATERIAL