A polarization-sensitive uncooled infrared detector and its preparation method
An uncooled infrared and polarization-sensitive technology, applied in electric radiation detectors, radiation pyrometry, instruments, etc., can solve the problems of complex optical path system, complex optical components, and difficult design, so as to simplify the optical system and reduce optical Components, Difficulty Reducing Effects
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Embodiment 1
[0046] A method for preparing a polarization-sensitive uncooled infrared detector, comprising the steps of:
[0047] Step 1: Provide an existing uncooled infrared detector without structural release, deposit a second layer of sacrificial layer 10 and a grating support layer sequentially on the protective layer of the existing detector, and the grating support layer includes the first grating The supporting layer 11 and the second grating supporting layer 12 arranged on the first grating supporting layer 11, the first grating supporting layer 11 is a silicon nitride layer, the silicon nitride layer is deposited first, and then the silicon nitride layer is deposited A silicon oxide layer is deposited on it;
[0048] Step 2: Prepare a metal grating structure on the grating support layer. First, use physical vapor deposition or sputtering to deposit or sputter a layer of metal film on the support layer, and then use a dry etching process to etch the grating pattern, so that adjace...
Embodiment 2
[0051] The preparation method of the polarization-sensitive uncooled infrared detector is different from the first embodiment: in step 2, a metal grating structure is prepared on the grating support layer, and photoresist or PI is first spin-coated on the grating support layer. Photolithography technology obtains a grating pattern on the photoresist coating or PI coating, the grating interval is 10-500nm, and then deposits or sputters on the photoetched photoresist or PI coating by physical vapor deposition or sputtering The metal film, and finally, the photoresist or PI coating is removed using a stripping process, and the excess metal film is stripped. Step 1 and step 3 are the same as the preparation method in Example 1.
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