Humectant used for dipping root in seedling transplantation, and preparation method thereof
A humectant and root-dipping technology, which is applied in the direction of botany equipment and methods, biocides, disinfectants, etc., can solve the problems of poor root protection and afforestation effects, unsatisfactory moisturizing effects, and poor growth of seedlings, etc., to achieve shortening nutrition Insufficient supply, promote wound healing, increase surface area effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0043] A humectant for transplanting seedlings and roots, which is characterized in that the humectant comprises the following raw materials in parts by weight:
[0044] 15 parts of carboxymethyl cellulose,
[0045] 5 parts of humic acid,
[0046] 10 parts of benzimidazole fungicides,
[0047] 10 parts of potassium dihydrogen phosphate,
[0048] 15 parts of super absorbent resin,
[0049] 100 parts of starch grafted sodium acrylate,
[0050] 100 parts of sodium naphthaleneacetate,
[0051] 450 parts of talcum powder,
[0052] 300 parts of Streptomyces sphaeroides fermentation broth,
[0053] 200 parts of water.
[0054] The fermentation broth of Streptomyces sphaeroides is formed by aerobic cultivation of a liquid medium with a mass ratio of 4% corn meal and 2% fish meal for 75 hours.
[0055] The humic acid is fulvic acid powder.
[0056] The benzimidazole fungicide is 60% carbendazim powder.
[0057] The particle size of the super absorbent resin is 0.5 mm, and the super absorbent resin is a c...
Embodiment 2
[0065] A humectant for transplanting seedlings and roots, which is characterized in that the humectant comprises the following raw materials in parts by weight:
[0066] 26 parts of carboxymethyl cellulose,
[0067] 12 parts of humic acid,
[0068] 15 parts of benzimidazole fungicides,
[0069] 20 parts of potassium dihydrogen phosphate,
[0070] 30 parts of super absorbent resin,
[0071] 200 parts of starch grafted sodium acrylate,
[0072] 200 parts of sodium naphthaleneacetate,
[0073] 900 parts of talcum powder,
[0074] 600 parts of fermentation broth of Streptomyces sphaeroides,
[0075] 500 parts of water.
[0076] The fermentation broth of Streptomyces sphaeroides is formed by aerobic cultivation of a liquid medium with a mass ratio of 4% corn meal and 2% fish meal for 75 hours.
[0077] The humic acid is fulvic acid powder.
[0078] The benzimidazole fungicide is 60% carbendazim powder.
[0079] The particle size of the super absorbent resin is 0.8 mm, and the super absorbent resin is...
Embodiment 3
[0087] A humectant for transplanting seedlings and roots, which is characterized in that the humectant comprises the following raw materials in parts by weight:
[0088] 20 parts of carboxymethyl cellulose,
[0089] 9 parts of humic acid,
[0090] 12 parts of benzimidazole fungicides,
[0091] 15 parts of potassium dihydrogen phosphate,
[0092] 24 parts of super absorbent resin,
[0093] Starch grafted sodium acrylate 159 parts,
[0094] 143 parts of sodium naphthaleneacetate,
[0095] 680 parts of talcum powder,
[0096] 460 parts of fermentation broth of Streptomyces sphaeroides,
[0097] 380 parts of water.
[0098] The fermentation broth of Streptomyces sphaeroides is formed by aerobic cultivation of a liquid medium with a mass ratio of 4% corn meal and 2% fish meal for 75 hours.
[0099] The humic acid is fulvic acid powder.
[0100] The benzimidazole fungicide is 60% carbendazim powder.
[0101] The particle size of the super absorbent resin is 0.7 mm, and the super absorbent resin is a c...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com