Device and method for ultrafast laser processing of micro inverted cone hole

An ultra-fast laser and inverted taper hole technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of destroying hole shape accuracy, affecting hole shape accuracy, poor surface quality, etc., to meet high-precision requirements. requirements, saving production costs, reducing the effect of energy loss

Inactive Publication Date: 2017-10-20
WENZHOU UNIVERSITY
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  • Application Information

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Problems solved by technology

Electrode deflection mechanism or forming electrode is required to obtain inverted taper hole by micro EDM. Although the forming efficiency is high, the loss of tool electrode is unavoidable, which affects the shape accuracy of the hole, and it is impossible to realize the micro hole on non-metallic materials. processing
Although abrasive flow extrusion grinding can help reduce surface roughness and improve surface quality, abrasive flow will destroy the shape accuracy of the hole, and it is difficult to clean the remaining abrasive particles in the hole
[0004] The patent publication number is CN201110144408.2, which discloses a method and device for electrolytic machining of micro-inverted cone holes. The process is to drill or EDM a through hole on the workpiece in advance, and then electrolytically process the inverse cone on the basis of the t...

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  • Device and method for ultrafast laser processing of micro inverted cone hole
  • Device and method for ultrafast laser processing of micro inverted cone hole
  • Device and method for ultrafast laser processing of micro inverted cone hole

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Embodiment Construction

[0021] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific implementations are now described in detail.

[0022] like figure 1 As shown, the device for ultrafast laser machining of micro-inverted taper holes includes a laser transmission module and an optical processing module. The laser transmission module includes a picosecond laser 1, a frequency doubling module 2, and a polarizer 3 arranged in sequence along the transmission direction of the optical path. And the beam expander 4, the optical processing module includes a rotary cutting module 5 and a light exit nozzle 6 arranged in sequence along the transmission direction of the optical path, and the output end of the beam expander 4 is connected to the rotary cutting module 5.

[0023] Among them, picosecond laser 1 is a solid-state picosecond laser with a wavelength of 1030nm, which has a high repetition rate and average power, especially when it int...

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Abstract

The invention discloses a device and method for ultrafast laser machining of micro-inverted taper holes. The laser transmission module includes a picosecond laser, a frequency doubling module, a polarizer and a beam expander arranged in sequence along the transmission direction of the optical path. The optical processing module includes a The rotary cutting module and the optical nozzle are arranged in sequence in the transmission direction of the optical path, and the output end of the beam expander is connected to the rotary cutting module; the picosecond laser outputs laser light, which is converted by the frequency doubling module to output base frequency light, double frequency light or triple frequency light Light, the laser beam output by the frequency doubling module passes through the polarizer to convert the output wave form linearly polarized laser beam into a wave form circularly or elliptically distributed circularly polarized laser beam, and then the beam is transmitted into the beam expander for amplification , to obtain a wider parallel beam, the enlarged parallel beam is transmitted to the rotary cutting module, the rotary cutting module adjusts the deflection angle of the beam, controls the aperture size and taper of the processing hole, and finally outputs it through the light nozzle. It is easy to realize the processing of fine reverse taper hole.

Description

technical field [0001] The invention relates to a laser processing method, in particular to a device and method for ultrafast laser processing micro-inverted taper holes, and belongs to the technical field of laser micro-special processing. Background technique [0002] Under the trend of miniaturization and precision of the structure of mechanical parts, micro-inverted taper holes with high depth-to-diameter ratio are more and more used in aerospace, aerospace turbine blades, engine fuel injectors and precision instruments, and the precision requirements are also increasing. higher. For example, the fine inverted cone nozzle hole on the diesel engine nozzle can effectively improve the fuel combustion efficiency and reduce exhaust emissions, and the rounded corners at the inlet of the fuel injection can further improve the flow coefficient of the fuel. With the continuous improvement of the size, shape and accuracy requirements of the inverted taper hole, the difficulty of ...

Claims

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Application Information

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IPC IPC(8): B23K26/384B23K26/06
CPCB23K26/384B23K26/0652
Inventor 冯爱新刘勇贾天代陈欢赵莹程好杨海华
Owner WENZHOU UNIVERSITY
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