Method for manufacturing release film for chip component manufacturing process and release film obtained therefrom

A manufacturing method and release film technology, applied in the direction of chemical instruments and methods, synthetic resin layered products, coatings, etc., can solve the problem of poor adhesion between the release agent coating layer and the base film, and the release agent coating layer Large contact angle, poor surface flatness and other problems, to achieve the effect of uniform appearance, improved residual bonding rate, and low surface contact angle

Active Publication Date: 2020-10-27
ZHEJIANG JIEMEI ELECTRONICS & TECH
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But this release film has poor surface flatness, large surface roughness, large thermal deformation of the base film and large contact angle of the release agent coating layer; poor adhesion between the release agent coating layer and the base film, and more Can not meet the high capacity, high stability and light, thin, small, single-layer ceramic thickness ≤ 3 micron chip components manufacturing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing release film for chip component manufacturing process and release film obtained therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A method for manufacturing a release film for a chip component manufacturing process, comprising:

[0032] 1. Preparation of PET base film:

[0033] Add 1600ppm of additive particles with a particle size of 500~800nm ​​in the PET chip, and the additive particles can be selected as one or more powder particles such as silicon dioxide, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, aluminum oxide, and titanium oxide. First, magnesium carbonate is used in this embodiment, and after mixing evenly, it undergoes high-temperature melting, screw mixing, extrusion casting, stretching (horizontal stretching and longitudinal stretching), slitting and winding to obtain a base film with a thickness of 75 μm;

[0034] 2. Preparation of release agent:

[0035] Mix the components of the release agent according to the following percentages: vinyl-terminated silicone resin 15%, butynol 0.8%, silane coupling agent 0.05%, platinum complex 0.15%, solvent 84%, sti...

Embodiment 2

[0039] A method for manufacturing a release film for a chip component manufacturing process, comprising the following steps:

[0040] 1. Add 1000ppm of additive particles with a particle size of 1000~1500nm to the PET chip. The additive particles can be a mixture of silicon dioxide, barium carbonate, and titanium oxide. The mixing percentage is: silicon dioxide 80%, barium carbonate 10%, Titanium oxide 10%, mixed evenly, through melting, screw mixing, extrusion casting, stretching (horizontal stretching and longitudinal stretching), slitting and winding to obtain a release film base film with a thickness of 50 μm;

[0041] 2. Mix the components of the release agent according to the following percentages: 8% vinyl-terminated silicone resin, 0.5% butynol, 0.05% silane coupling agent, 0.25% platinum complex, 91.2% solvent, and stir Evenly, spare. Wherein, the solvent may be one or more of No. 120 solvent naphtha, butanone, D30 solvent naphtha, ethyl acetate, and isopropanol. In ...

Embodiment 3

[0044] A method for manufacturing a release film for a chip component manufacturing process, comprising the following steps:

[0045] 1. Add 1200ppm of additive particles with a particle size of 800~1200nm to the PET chip. The additive particles can be a mixture of silicon dioxide, barium carbonate and titanium oxide. The mixing percentage is: silicon dioxide 95%, barium carbonate 1%, Titanium oxide 4%, mixed evenly, through melting, screw mixing, extrusion casting, stretching (horizontal stretching and longitudinal stretching), slitting and winding to obtain a release film base film with a thickness of 25 μm;

[0046] 2. Mix the components of the release agent according to the following percentages: 2% vinyl-terminated silicone resin, 0.1% butynol, 0.5% silane coupling agent, 0.4% platinum complex, 97% solvent, and stir Evenly, spare. Among them, the solvent used in this embodiment is a mixed solvent: 30% of No. 120 mineral spirits, 22% of butanone, 15% of D30 mineral spirit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention relates to a method for manufacturing a release film for a chip component manufacturing process and the prepared release film. The manufacturing method includes steps: (1) Preparation of a base film: adding 1000-1600ppm of added particles to the base material, Obtaining a base film with a thickness of 20-75 μm, the added particles are one or more of silicon dioxide, calcium carbonate, magnesium carbonate, barium carbonate, barium sulfate, aluminum oxide, titanium oxide, and the particle size of the added particles is (2) Preparation of release agent; (3) Preparation of release film: coating the release agent on the base film to obtain a release film. The prepared release film has a surface roughness Ra≤0.25 μm; the thickness of the release agent coating is 60-300nm, and the release force is 2-40g / inch; the residual adhesion rate of the release film is ≥90%, preferably 96 %.

Description

technical field [0001] The invention relates to the field of release film preparation, in particular to a method for manufacturing a release film used in the manufacturing process of chip components and the prepared release film. Background technique [0002] At present, the usual manufacturing method of the release film is to coat a layer of release agent (vinyl silicone oil resin) on the surface of the PET base film, and obtain it by cross-linking and curing under the action of a complex catalyst such as platinum or tin. [0003] For example, the patent No. CN102582174A discloses a release film with excellent antistatic performance and its manufacturing method. The obtained release film has good release properties such as release force and residual adhesive rate, and has excellent antistatic performance. Not only can it be used for general industrial adhesive tapes (or adhesive tapes) for the purpose of protecting the adhesive (adhesive) layer, but it can also be effective...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C08L67/02C08K3/26C08K3/36C08K3/22C09D183/07C09D5/20
CPCC08J5/18C08J7/04C08J2367/02C08J2483/07C08K3/22C08K3/26C08K3/36C08K5/05C08K5/54C08K2003/2237C08K2003/265C08K2003/267C08K2201/003C08K2201/011C08L2203/16C09D5/20C09D183/04C08L67/02B32B7/06B32B27/18B32B27/283B32B37/24B32B37/26B32B2037/243B32B2037/268B32B2038/0076B32B2309/02B32B2309/04
Inventor 梁仁调郭庆超肖飞
Owner ZHEJIANG JIEMEI ELECTRONICS & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap