High bending fatigue strength ceramic package outer lead and preparation method

A technology of bending fatigue strength and external lead installation. It is used in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices. It can solve problems such as bending and shedding, and achieve good electrical conductivity, high mechanical strength, and controllable grain size. Effect

Inactive Publication Date: 2017-12-15
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention is a method for preparing outer leads of high bending fatigue strength ceramic packages. reliability

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[0016] A method for preparing outer leads of ceramic packages with high bending fatigue strength, especially a method for preparing outer leads of digital, microwave, power electronics, optoelectronic devices and other ceramic packages with outer leads, comprising the following process steps:

[0017] a) Choose a material with good electrical conductivity and a thermal expansion coefficient (TEC) of 4.1 to 13×10 -6 K -1 , Metals or alloys with a thickness of 0.05 mm to 1.0 mm, such as copper, iron, nickel, iron-nickel, iron-cobalt-nickel metals or alloys;

[0018] b) According to the design requirements, use etching, cutting or punching to process the required shape;

[0019] c) Use N 2 , H 2 Or its mixed atmosphere protection, 300 ℃ ~ 1100 ℃ programmed temperature control heat treatment to remove material surface defects, and control the internal grain size at 1 ~ 80 μm;

[0020] d) Deposit metal or alloy on the surface by sputtering or plating process, such as zinc, chro...

Embodiment 1

[0025] a) Select the coefficient of thermal expansion to be 5.8×10 -6 K -1 , 0.3mm thick iron-nickel alloy sheet;

[0026] b) Process the required shape by chemical etching;

[0027] c) Clean with acetone and alcohol, and then 2 、H 2 Under protective atmosphere conditions, 1050°C, heat preservation for 30Min, eliminate pollution, oxide layer and internal stress generated during processing, and control the internal grain size at 30-80μm;

[0028] d) Assemble together according to the design requirements, such as figure 1 shown, using the N 2 , H 2 Mixed atmosphere protection, the temperature is 920 ℃ in the program temperature control furnace to complete the welding;

[0029] e) Post-soldering treatment, 10 minutes in an alkaline solution with a pH value of 10 to 12, 5 minutes in an acidic solution with a pH value of 2 to 4, and 5 minutes in a plasma surface cleaning device to remove the oxide layer or pollutants on the surface of the lead wire ;

[0030] f) Functional...

Embodiment 2

[0032] a) Select the coefficient of thermal expansion to be 5.8×10 -6 K -1 , 0.05mm thick iron-nickel alloy sheet;

[0033] b) Process the required shape by mechanical stamping, such as die stamping;

[0034] c) Clean with acetone and alcohol, and then 2 、H 2 Under protective atmosphere conditions, 1050°C, heat preservation for 30Min, eliminate pollution, oxide layer and internal stress generated during processing, and control the internal grain size at 30-80μm;

[0035] d) Assemble together according to the design requirements, such as figure 1 shown, using the N 2 , H 2 Mixed atmosphere protection, the temperature is 920 ℃ in the program temperature control furnace to complete the welding;

[0036] e) Post-soldering treatment, 10 minutes in an alkaline solution with a pH value of 10 to 12, 1 minute in an acidic solution with a pH value of 2 to 4, and 9 minutes in a plasma surface cleaning equipment to remove the oxide layer or pollutants on the surface of the lead wir...

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Abstract

The invention provides a high bending fatigue strength ceramic package outer lead and a preparation method. The method comprises the steps of (a) selecting a metal with good electrical conductivity and a thermal expansion coefficient matched with a ceramic, (b) processing the metal into a shape which meets requirements by using a mode of etching, cutting or stamping, (c) using N2, H2 or mixed atmosphere protection, and removing material surface detects by using program temperature controlled heat treatment, (d) using sputtering or plating process to deposit a protective and functional metal or alloy at a surface, (e) using vacuum, N2 or H2 protection, and completing welding in a program temperature control furnace, (f) processing the above material in alkaline and acidic solutions with different pH values to remove an oxide layer or pollutants at a lead surface, and (g) carrying out functional and protective coating deposition. The high bending fatigue strength ceramic package outer lead and the preparation method have the advantages that the processed ceramic package has higher lead bending fatigue strength and good conductivity, solderability and corrosion resistance performance, and the improvement of the stability and long-term reliability of a system is facilitated.

Description

technical field [0001] The invention relates to a high bending fatigue strength ceramic packaging outer lead and a preparation method thereof, in particular to a manufacturing method of digital, microwave, power electronics, optoelectronic devices and other ceramic packaging shells with an outer lead structure, belonging to the technical field of microelectronic packaging. Background technique [0002] With the continuous development of electronic equipment used in communications, aerospace, automobiles and consumer electronics, etc., towards miniaturization and digitalization, the requirements for high reliability of electronic components are becoming stronger and stronger. Due to its high structural strength, good chemical stability, high wiring density, excellent electrothermal performance and microwave performance, ceramic packaging shells have been widely used in the above fields. With the development in the direction of globalization, more and more applications require...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48
CPCH01L21/4889H01L23/49
Inventor 唐利锋程凯陈宇宁谢新根周昊钟明权王琛
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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