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Cyanide-free alkaline copper electroplating composition and preparation method thereof

A composition and alkali copper technology, applied in the field of electroplating, can solve the problems of poor stability, brittle coating, easy to mold, etc., and achieve the effect of good stability of the plating solution, bright and flat coating, and good bonding force of the coating

Active Publication Date: 2018-01-19
广州睿邦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, citric acid or its salt copper plating solution is prone to mildew, and it is often necessary to add an antifungal agent, but the antifungal agent will be mixed into the copper plating layer during the electroplating process, thereby affecting the bonding force of the coating and making the coating brittle, etc., the existing citric acid Or its salt copper plating solution also has problems such as poor leveling and poor stability of the plating solution

Method used

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  • Cyanide-free alkaline copper electroplating composition and preparation method thereof

Examples

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preparation example Construction

[0064] As a preferred technical solution of the present invention, the preparation method of (1,2-benzisothiazolin-3-one)-propyne at least comprises the following steps:

[0065] a. Take o-aminothiophenol and urea, raise the temperature to 155-165° C., stop the reaction after stirring for 1 hour, and recrystallize the obtained product twice with hot water to obtain 1,2-benzisothiazolin-3-one. The molar ratio of the above-mentioned o-aminothiophenol and urea is 1:1.2;

[0066] b. Dissolve 1,2-benzisothiazolin-3-one in acetone, slowly add potassium carbonate, stir for 15 to 30 minutes, add 3-chloropropyne, heat and reflux for 4 hours, the 1,2- The molar ratio of benzisothiazolin-3-one, potassium carbonate, 3-chloropropyne and acetone is 1:1:1:3; then the mixture is cooled to 0°C, and 100 mL of ice-water mixture is poured into it, Control the temperature at 0-10°C and stir for 1 h; collect the formed precipitate, filter it with deionized water, and wash until the pH is neutral t...

Embodiment 1

[0091] Example 1 provides a cyanide-free alkali copper electroplating composition. The raw materials for the preparation of 1 L of cyanide-free alkali copper electroplating composition include: divalent copper ion: 15g; citric acid: 185g; potassium sodium tartrate: 50g; potassium nitrate: 5g; 1,2-cyclohexanediaminetetraacetic acid: 0.5g; wetting agent: 0.2g; brightener: 1.2g; leveling agent: 0.1g; add deionized water to 1L.

[0092] Described divalent copper ion is provided by basic copper carbonate;

[0093] Described wetting agent is polyethylene glycol 1000;

[0094] The brightener is 1,4-butynediol;

[0095] The leveling agent is (1,2-benzisothiazolin-3-one)-propyne.

[0096] The preparation method of the (1,2-benzisothiazolin-3-one)-propyne at least comprises the following steps:

[0097] a. Take o-aminothiophenol and urea, raise the temperature to 160° C., stop the reaction after stirring for 1 hour, and recrystallize the obtained product twice with hot water to obtai...

Embodiment 2

[0104] Example 2 provides a cyanide-free alkali copper electroplating composition. The raw materials for the preparation of 1 L of cyanide-free alkali copper electroplating composition include: divalent copper ion: 17g; citric acid: 195g; potassium sodium tartrate: 60g; potassium nitrate: 6.5g; 1,2-cyclohexanediaminetetraacetic acid: 1g; wetting agent: 0.3g; brightener: 1.6g; leveling agent: 0.15g; add deionized water to 1L.

[0105] The divalent copper ions are provided by copper citrate;

[0106] Described wetting agent is myristyl betaine;

[0107] Described brightener is thiourea;

[0108] The leveling agent is (1,2-benzisothiazolin-3-one)-propyne.

[0109] The preparation method of the (1,2-benzisothiazolin-3-one)-propyne is the same as in Example 1.

[0110] The preparation method of the cyanide-free alkali copper electroplating composition is the same as in Example 1.

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Abstract

The invention relates to the field of electroplating, in particular to a cyanide-free alkaline copper electroplating composition and a preparation method thereof. According to the cyanide-free alkaline copper electroplating composition, preparation raw materials of 1 L of the cyanide-free alkaline copper electroplating composition comprise 15-17 g of bivalent copper ions, 185-195 g of citric acid,50-60 g of seignette salt, 5-6.5 g of potassium nitrate, 0.5-1 g of 1, 2-cyclohexylenediamine tetraacetic acid, 0.2-0.3 g of a wetting agent, 1.2-1.6 g of a brightener, 0.1-0.15 g of a leveling agentand 1 L of deionized water.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a cyanide-free alkali copper electroplating composition and a preparation method thereof. Background technique [0002] Electroplating is a technology that deposits a layer of metal, alloy or composite material with a smooth surface and a firm bond with the substrate on the substrate by electrolysis. It is closely related to electrochemistry, coordination chemistry, organic chemistry, surface chemistry, crystallography, metal materials science, and electromechanical engineering. From the preparation of the plating solution to the formation of the plating layer, there are processes such as the formation of complexes, the electrode reduction of complex ions, and the electrocrystallization of metal atoms. Therefore, the composition of the electrolyte, such as complexing agents, additives, other auxiliary reagents and electroplating conditions (such as temperature, acidity, current den...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 施佳抄
Owner 广州睿邦新材料科技有限公司
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