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Sinterable bonding material and semiconductor device using the same

A technology of adhesive materials and silver fillers, which is applied in semiconductor devices, adhesive heating bonding methods, semiconductor/solid-state device manufacturing, etc., can solve problems such as peeling off of bonded parts and cracks, and achieve excellent long-term reliability Effect

Active Publication Date: 2018-02-23
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the bonding method using the metal particle sintering phenomenon described in Patent Document 1, shrinkage stress is generated by sintering shrinkage caused by the sintering reaction, and the shrinkage stress remains in the bonded part
In addition, when the thermal expansion coefficients of the components to be bonded differ greatly, higher thermal stress is applied to the bonded parts during the cooling-heating cycle when operating the semiconductor device, which causes problems such as Cracks in bonded parts, or peeling of bonded parts

Method used

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  • Sinterable bonding material and semiconductor device using the same
  • Sinterable bonding material and semiconductor device using the same
  • Sinterable bonding material and semiconductor device using the same

Examples

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preparation example Construction

[0059] Examples of the preparation method of the silver filler whose surface is coated with an organic substance include, but are not limited to, a method of preparing the silver filler by a reduction method in the presence of an organic solvent. Specifically, for example, the silver filler can be obtained by mixing a silver carboxylate salt with a primary amine, and depositing the silver filler using a reducing agent in the presence of an organic solvent, as described in Japanese Patent Laid-Open Nos. 2006-183072 and 2011-153362, etc. . In addition, the silver filler can be obtained by the method described in Japanese Patent Laid-Open No. 2014-196527, which includes the step of dispersing silver oxalate using a carrier medium such as water or alcohol and a dispersion medium such as glycols, followed by applying heat and / or stress. The foregoing applications are hereby incorporated by reference in their entireties.

[0060] It is also preferred to disperse the obtained silve...

Embodiment 1

[0202]

[0203] Silver fillers, resin particles, additives, and solvents were mixed in the proportions shown in Table 1 to prepare an adhesive material.

[0204]

[0205] The obtained adhesive material was printed on a substrate (silver-plated copper lead frame, 25×25 mm, thickness 0.3 mm) at a thickness of 100 μm. A semiconductor chip (silver-plated backside Si die, 10×10 mm) was mounted on the substrate. The substrate with the chip was dried at 90° C. for 30 minutes, and heated in an oven under the conditions of 300° C. / 5 minutes / 10 MPa to obtain a sample for evaluation. The thickness of the bonding layer after sintering is about 40 to 60 μm.

[0206] Warpage generated during sintering was measured using a three-dimensional length measuring machine (KS-1100, manufactured by Keyence Corporation).

[0207]

[0208] The obtained adhesive material was printed at a thickness of 100 μm between two substrates (500 μm thick, silver-plated copper of 5 mmΦ). The two substrate...

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Abstract

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200DEG or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has improved stress relaxation ability.

Description

technical field [0001] The invention relates to an adhesive material, in particular to a sinterable adhesive material with excellent stress relaxation ability and a preparation method thereof. The present invention also relates to a semiconductor device prepared using the adhesive material and a method for preparing the same. Background technique [0002] As electronic devices decrease in size and weight and improve in performance, heat generated by semiconductor devices tends to increase. In recent years, in the field of motor control, power semiconductors with large band gaps, such as silicon carbide or gallium nitride, have been developed for applications requiring high voltage or high current, such as electric equipment, vehicles or machine tools. Such power semiconductors can be operated at higher temperatures than conventional silicon semiconductors due to the high heat resistance of the semiconductor components themselves. [0003] In order to take advantage of such...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52H05K1/02H05K3/32B22F1/068B22F1/10B22F1/107
CPCH05K3/32H05K2203/1131H01L2224/2939H01L2224/83411B23K35/0244H01L24/29H01L2224/04026H01L2224/05639H01L2224/05644H01L2224/05647H01L2224/05655H01L2224/29339H01L2224/29499H01L2224/32225H01L2224/32245H01L2224/83439H01L2224/83444H01L2224/83455H01L2224/8384B22F2007/047B22F3/22B22F7/04B22F7/064B22F7/08H01L2224/2949H01L24/83B22F1/068B22F1/107B22F1/10H01L2924/00014C09J11/04C09J115/02C09J5/06H01L21/185C09J2301/312C09J2203/326H01L2224/29139H01L2224/2969H01L2224/83222
Inventor 井上一高野正
Owner HENKEL KGAA
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