Unlock instant, AI-driven research and patent intelligence for your innovation.

Thermal conductive malleable epoxy resin pouring sealant for electronic products and preparation method of thermal conductive malleable epoxy resin pouring sealant

A technology of tough epoxy resin and electronic products, which is applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc. It can solve the problem that mechanical stress is easy to strain electronic components and cannot meet the use of potting glue Requirements, poor thermal conductivity of potting glue, etc., to achieve the effects of anti-leakage and chemical medium resistance, good impact resistance, and strong adhesion

Inactive Publication Date: 2018-04-03
SUZHOU KEMAO ELECTRONICS MATERIALS TECH
View PDF1 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Epoxy resin potting glue has good adhesion to materials, good insulation, and high cost performance, so it has been widely used. However, after curing, the epoxy resin potting glue has high hardness and brittle colloid, which is relatively High mechanical stress is easy to strain electronic components; and the existing epoxy potting glue has poor thermal conductivity, which cannot meet the requirements of the prior art for potting glue

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: thermally conductive tough epoxy resin potting glue for electronic products, which is composed of A component and B component;

[0019] The A component is composed of the following raw materials in parts by weight: 100 parts of bisphenol A epoxy resin, 30 parts of liquid coumarone-indene resin, 30 parts of melamine formaldehyde resin, 20 parts of dodecafluoroheptyl methacrylate 1 part, 22 parts of inorganic modification additives, 1 part of antimony pentoxide, 1 part of silane coupling agent;

[0020] The B component is composed of the following raw materials in parts by weight: 5 parts of neopentyl glycol diglycidyl ether, 15 parts of tert-butyl peroxybenzoate, and 3 parts of 4-methyltetrahydrophthalic anhydride.

[0021] Further, the inorganic modifying additive is fumed titanium dioxide and sodium polyacrylate, and the mass part ratio is 1:3.

[0022] The preparation method of the thermally conductive tough epoxy resin encapsulant for electronic produc...

Embodiment 2

[0028] Embodiment 2: Thermally conductive tough epoxy resin potting glue for electronic products, which is composed of A component and B component; the A component is composed of the following raw materials in parts by weight: bisphenol A epoxy resin 100 20 parts, 20 parts of liquid coumarone-indene resin, 20 parts of melamine formaldehyde resin, 10 parts of dodecafluoroheptyl methacrylate, 15 parts of inorganic modification additive, 0.5 part of antimony pentoxide, 0.5 part of silane coupling agent; The B component is composed of the following raw materials in parts by weight: 3 parts of neopentyl glycol diglycidyl ether, 10 parts of tert-butyl peroxybenzoate, 2 parts of 4-methyltetrahydrophthalic anhydride; the inorganic The modification additive is gas-phase titanium dioxide and sodium polyacrylate, and the mass ratio is 1:2.

[0029] The preparation method of the thermally conductive tough epoxy resin encapsulant for electronic products comprises the following steps:

[0...

Embodiment 3

[0035] Embodiment 3: Thermally conductive tough epoxy resin potting glue for electronic products, which is composed of A component and B component; the A component is composed of the following raw materials in parts by weight: bisphenol A epoxy resin 100 40 parts, 40 parts of liquid coumarone-indene resin, 40 parts of melamine formaldehyde resin, 30 parts of dodecafluoroheptyl methacrylate, 30 parts of inorganic modification additives, 1.5 parts of antimony pentoxide, 1.5 parts of silane coupling agent; The B component is composed of the following raw materials in parts by weight: 7 parts of neopentyl glycol diglycidyl ether, 20 parts of tert-butyl peroxybenzoate, 5 parts of 4-methyltetrahydrophthalic anhydride; the inorganic Modification additives are fumed titanium dioxide and sodium polyacrylate, the mass ratio of which is 1: 4.

[0036] The preparation method of the thermally conductive tough epoxy resin encapsulant for electronic products comprises the following steps:

...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a thermal conductive malleable epoxy resin pouring sealant for electronic products. The pouring sealant comprises a component A and a component B, wherein the component A comprises the following components: 100 parts of bisphenol A epoxy resin, 20 to 40 parts of liquid coumarone-indene resin, 20 to 40 parts of melamine formaldehyde resin, 10 to 30 parts of dodecafluoroheptyl methacrylate, 15 to 30 parts of an inorganic modified additive, 0.5 to 1.5 parts of antimony pentoxide, and 0.5 to 1.5 parts of a silane coupling agent; the component B comprises the following components: 3 to 7 parts of neopentyl glycol diglycidyl ether, 10 to 20 parts of tert-butyl peroxybenzoate, and 2 to 5 parts of 4-methyl tetrahydrophthalic anhydride. The pouring sealant is applicable to insulation heat conduction pouring during the processing of electronic products, has excellent thermal conductivity and flame resistance, and is relatively soft rubbery after being cured; and comparedwith the existing epoxy resin pouring sealants, the pouring sealant has the characteristics of good impact resistance, high adhesive force, and excellent insulation, shock resistance, moisture protection, corona resistance, electric leakage resistance and chemical medium resistance.

Description

technical field [0001] The invention relates to the technical field of electronic product processing materials, in particular to a thermally conductive tough epoxy resin potting glue for electronic products and a preparation method thereof. Background technique [0002] In recent years, potting adhesives have been widely used in electronic circuits, LEDs, capacitor potting, etc., mainly for bonding, sealing, potting and coating protection of electronic components, and the usage is increasing year by year. Electronic potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the performance, material, and production process of the product. After the potting glue is completely cured, its use value can be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, sealing, anti-corrosion, temperature-resistant, and shock-proof. At present, there are many types of electronic potting adhesives...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02C09J11/04C09J11/06C09J11/08
CPCC09J4/06C09J11/04C09J11/06C09J11/08C08F283/10
Inventor 邹黎清
Owner SUZHOU KEMAO ELECTRONICS MATERIALS TECH