Adhesive for forming and processing of 3D (three-dimensional) printing
A molding processing and 3D printing technology, applied in the direction of adhesives, adhesive additives, lignocellulosic material adhesives, etc., can solve the problems of the versatility of 3D printing operations, the influence of reliability and flexibility, the influence of the safety and reliability of processed workpieces, and the flexibility of use. problems such as poor performance and reliability, to achieve the effect of improving the flexibility and scope of use, the production efficiency of effective adhesives, and the ease of obtaining
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Embodiment 1
[0019] Such as figure 1 As shown in —2, an adhesive for molding processing for 3D printing is composed of the following parts by mass: bisphenol A epoxy resin: 25%, plant fiber: 3.5%, nylon fiber: 4%, graphene fiber : 8%, phenol: 1.5%%, 300 mesh ceramic powder: 6%, ethylenediamine curing agent: 3.5%, trimellitic acid crosslinking agent: 4%, γ-propyltrimethoxysilane: 3.5%, poly Sulfur rubber: 0.5%-1.5%, the balance is 1,6 hexanediol diglycidyl ether.
[0020] Wherein, the epoxy value of the bisphenol A epoxy resin is 0.4.
Embodiment 2
[0022] Such as figure 1 As shown in —2, an adhesive for molding processing for 3D printing is composed of the following parts by mass: bisphenol A epoxy resin: 40%, plant fiber: 8%, nylon fiber: 7.5%, graphene Fiber: 6.5%, amino modified silicone oil: 1.5%, resorcinol: 2.5%, 200 mesh oxide particles: 3.3%, triethylenetetramine: 1.5%, methyl acetoacetate: 10%, γ-ammonia Propyl triethoxysilane: 4.7%, polyamide resin: 0.5%, the balance is 1,4-butanediol diglycidyl ether.
[0023] In addition, the epoxy value of bisphenol A epoxy resin is 0.5.
Embodiment 3
[0025] Such as figure 1 As shown in —2, an adhesive for 3D printing molding and processing is composed of the following parts by mass: bisphenol A epoxy resin: 35%, plant fiber: 4.7%, nylon fiber: 5.6%, graphene fiber : 5.5%, salicylic acid: 2.5%, 800 mesh metal element: 4.3%, maleic anhydride: 3.7%, trimellitic acid: 8.5%, chromium complex coupling agent: 6.5%, tertiary polyvinyl alcohol Butyraldehyde: 1%, the balance is ethylene glycol diglycidyl ether.
[0026] The epoxy value of the bisphenol A epoxy resin is 0.5.
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