Method adopting double-beam laser and TIG composite filler wire fusing-brazing for dissimilar materials
A dissimilar material and double-beam technology, applied in welding equipment, welding equipment, arc welding equipment, etc., can solve the problems of welding penetration, large heat input of MAG, etc., and achieve the effect of improving adaptability, improving thermal efficiency, and efficient connection
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specific Embodiment approach 1
[0028] Specific implementation mode one: combine figure 1 Description of this embodiment, a dual-beam laser-TIG composite wire-filling fusion brazing method for dissimilar materials, which is carried out according to the following steps:
[0029] Step 1: Before welding, process the parts to be welded into Y-shaped grooves, I-shaped grooves or asymmetrical grooves according to the plate thickness, and grind the processed grooves and the surfaces on both sides Or cleaning, fix the workpiece to be welded after grinding or cleaning on the welding fixture;
[0030] Step 2: Use the fixture to rigidly fix the laser head, TIG welding torch and wire feeding mechanism;
[0031] Step 3: Set welding process parameters:
[0032] The laser power is 1kW~4kW, the power ratio of the two laser beams is 1:1~1:10, the defocus range is -2~+10mm, the distance between the centers of the two laser beams is 2~6mm, and Ar gas is used for protection. 15L / min~50L / min; arc current 30~90A, welding speed...
specific Embodiment approach 2
[0035] Specific implementation mode two: combination figure 1 This embodiment is described. The difference between this embodiment and the first embodiment is that the dissimilar materials are steel and non-ferrous metal dissimilar materials or dissimilar non-ferrous metal materials. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0036] Specific implementation mode three: combination figure 1 Describe this embodiment, the difference between this embodiment and specific embodiment 1 is: the laser used in welding is CO 2 Gas laser, YAG solid-state laser, semiconductor laser or fiber laser. Others are the same as in the first embodiment.
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