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Treatment method of surface of oxygen-free copper

A treatment method, oxygen-free copper technology, applied in the direction of metal material coating process, coating, solid diffusion coating, etc., can solve the problems of employee safety hazards, difficult to remove, affecting product use and life, etc., to achieve a good combination force, good stability effect

Inactive Publication Date: 2018-05-25
DELTA ELECTRONICS COMPONENTS (WUJIANG) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Invention patent CN201310530753.9 Although a super-hydrophilic copper surface with a micro-nano structure is obtained, this technology uses electrochemical deposition, which brings safety hazards to employees during cleaning operations
At the same time, possible residues such as copper sulfate after cleaning are difficult to remove in subsequent sintering, which affects the further use and life of the product

Method used

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  • Treatment method of surface of oxygen-free copper
  • Treatment method of surface of oxygen-free copper
  • Treatment method of surface of oxygen-free copper

Examples

Experimental program
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Effect test

Embodiment 1

[0046] An oxygen-free copper surface oxidation-dissolution superhydrophilic treatment process, comprising the following steps:

[0047] (1) Preparation of treatment solution

[0048] Weigh a certain amount of oxalic acid solid, dissolve the oxalic acid solid in deionized water to form an oxalic acid solution, and then add an appropriate amount of oxidant hydrogen peroxide to the oxalic acid solution to obtain a mixed solution of 0.1 wt% oxalic acid and 0.2 wt% hydrogen peroxide as a treatment liquid.

[0049] (2) Oxygen-free copper surface pretreatment

[0050] The oxygen-free copper surface is pretreated by ultrasonic cleaning with a mixed solution of surfactant sodium dodecylsulfonate and strong alkali sodium hydroxide, and then cleaned with deionized water.

[0051] (3) Oxygen-free copper surface oxidation-dissolution treatment

[0052] Immerse the oxygen-free copper pretreated in step (2) into the treatment solution prepared in step (1), and perform ultrasonic cleaning ...

Embodiment 2

[0055] An oxygen-free copper surface oxidation-dissolution superhydrophilic treatment process, comprising the following steps:

[0056] (1) Preparation of treatment solution

[0057] Weigh a certain amount of acetic acid liquid, mix the acetic acid liquid in deionized water to form an acetic acid solution, then add a suitable amount of oxidant hydrogen peroxide and an appropriate amount of hydrogen peroxide stabilizer ethylene glycol to the acetic acid solution to obtain 4.5wt% concentration of acetic acid and hydrogen peroxide A mixed solution with a concentration of 5 wt% was used as a treatment solution.

[0058] (2) Oxygen-free copper surface pretreatment

[0059] The oxygen-free copper surface is pretreated with a mixed solution of surfactant polyvinyl alcohol and strong alkali potassium hydroxide, which is shaken and cleaned, and then cleaned with deionized water.

[0060] (3) Oxygen-free copper surface oxidation-dissolution treatment

[0061] Immerse the oxygen-free ...

Embodiment 3

[0064] An oxygen-free copper surface oxidation-dissolution superhydrophilic treatment process, comprising the following steps:

[0065] (1) Preparation of treatment solution

[0066] Take a certain amount of hydrochloric acid liquid, dissolve the hydrochloric acid liquid in deionized water to form a hydrochloric acid solution, then add an appropriate amount of oxidizing agent hypochlorous acid to the hydrochloric acid solution, and obtain the hydrochloric acid 0.1wt% concentration and the hypochlorous acid 0.1wt% concentration The mixed solution was used as a treatment solution.

[0067] (2) Oxygen-free copper surface pretreatment

[0068] The oxygen-free copper surface is pretreated by ultrasonic cleaning with a mixed solution of surfactant C9-11 alkanol polyether and alkali triethanolamine, and then cleaned with deionized water.

[0069] (3) Oxygen-free copper surface oxidation-dissolution treatment

[0070] The oxygen-free copper pretreated in step (2) is immersed in the...

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Abstract

A treatment method of the surface of oxygen-free copper comprises the following steps that (1), treating liquid is prepared from, by weight, 0.1-15% of acid and 0.1-20% of an oxidizing agent by usingdeionized water; (2) pretreatment is conducted on the surface of the oxygen-free copper by adopting a mixed solution of a surface active agent and an alkali compound, and then the surface of the oxygen-free copper is washed clearly by using the deionized water; and (3), the oxygen-free copper after being subjected to pretreatment in the step (2) is dipped with the prepared treating liquid in the step (1) so as to conduct oxidation-dissolution treatment on the surface of the oxygen-free copper, the surface of the oxygen-free copper is washed clearly by using the deionized water again, and thendrying is conducted. A layer of coppery oxide layer can be generated on the surface of the treated oxygen-free copper, and the oxide layer has a super-hydrophilicity property. The super hydrophilic oxide layer can improve the adhesion force in the follow-up sintering process of an oxygen-free copper pipe, and the follow-up heat dissipation requirements of the copper pipe can be met. The treatmentmethod can be used for replacing a traditional washing technology for copper by using a strong oxidant chromic acid. The technology is simple and controllable, the cost is low, and the technology is suitable for being widely promoted.

Description

technical field [0001] The invention relates to the field of liquid-phase treatment of metal surfaces, in particular to a treatment method for heat-dissipating oxygen-free copper surfaces. Background technique [0002] With the advancement of science and technology and the improvement of environmental protection requirements, more and more heavy polluting enterprises in the field of industrial production have been controlled and contained. Although the production technology in these enterprises has the advantages of low cost and good effect, it has caused huge pollution to the surrounding environment. It is not conducive to the sustainable development of enterprises, and does not meet the government's normative requirements. For example, in the manufacturing process of mobile phone cooling copper sheets, traditional enterprises use nitric acid, chromic acid and other highly polluting strong acids to clean copper pipes, causing pressure on these enterprises in terms of disch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C8/42C23F1/18
CPCC23C8/42C23F1/18
Inventor 于全耀王永元李柏霖
Owner DELTA ELECTRONICS COMPONENTS (WUJIANG) LTD
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