Normal-temperature curing organic and inorganic compound high-temperature-resistant adhesive and preparation method thereof

A room temperature curing, high temperature resistant technology, applied in the direction of inorganic adhesives, adhesives, adhesive types, etc., can solve the problems of high bonding strength, poor acid and alkali resistance, water resistance, high residual carbon, and achieve good bonding strength , Improve the curing speed, improve the effect of bonding strength

Active Publication Date: 2018-06-12
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Phenolic resin is the earliest industrialized synthetic resin. As an adhesive, it has the advantages of high bonding strength and high carbon residue. Its oxidation resistance is insufficient, and it is easily oxidized when it exceeds 400 ° C. Therefore, it cannot be used as a single component for high temperature resistant adhesives. agent field
Although inorganic adhesives have excellent high temperature resistance, they are generally resistant to 900-1000 °C, have small shrinkage, good aging resistance, and low raw materials. The disadvantages are poor acid and alkali resistance and water resistance, high brittleness, impact resistance, and low temperature. Generally, the bond strength is not high
Limited to the inherent defects of organic adhesives and inorganic adhesives, it is difficult to have a fundamental breakthrough in their performance, and it is difficult to meet the needs of technological development for the use of adhesives

Method used

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  • Normal-temperature curing organic and inorganic compound high-temperature-resistant adhesive and preparation method thereof
  • Normal-temperature curing organic and inorganic compound high-temperature-resistant adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A room temperature curing organic-inorganic composite high-temperature-resistant adhesive contains the following components by weight:

[0035] 50-100 parts of modified aluminum dihydrogen phosphate, 20-50 parts of phenolic resin containing active end groups, 5-30 parts of silane coupling agent, 38-80 parts of curing cross-linking agent, 2-5 parts of curing accelerator, 15-30 parts of high-temperature filler and 50-100 parts of filler;

[0036]The modified aluminum dihydrogen phosphate is aluminum dihydrogen phosphate modified by magnesium oxide, and the specific preparation method is as follows: put 100 parts by mass of 85% phosphoric acid solution and 30 to 40 parts of aluminum hydroxide solid powder into the heating In the stirred reactor, stir at a temperature of 85-95°C at a speed of 100r / min for 1 hour to obtain aluminum dihydrogen phosphate, then add 5-10 parts of magnesium oxide to the reactor, and continue to stir at 85-95°C Stirring at a speed of 100r / min for...

Embodiment 2

[0050] A room temperature curing organic-inorganic composite high-temperature-resistant adhesive contains the following components by weight:

[0051] 70 parts of modified aluminum dihydrogen phosphate, 30 parts of thermosetting phenolic resin containing active end groups, 15 parts of γ-aminopropyltriethoxysilane, 42 parts of aluminum oxide, 12 parts of curing paste with a polyvinyl alcohol concentration of 6% , 3 parts of aluminum nitride, 7 parts of titanium carbide, 7 parts of zirconia, 7 parts of yttrium oxide, 30 parts of iron oxide and 40 parts of talcum powder;

[0052] The modified aluminum dihydrogen phosphate is aluminum dihydrogen phosphate modified by magnesium oxide, and the specific preparation method is as follows: 100 parts by mass of 85% phosphoric acid solution and 35 parts of aluminum hydroxide solid powder are put into heating and stirring reaction In the kettle, stir at a temperature of 90°C at a speed of 100r / min for 1h to obtain aluminum dihydrogen phosp...

Embodiment 3

[0066] A room temperature curing organic-inorganic composite high-temperature-resistant adhesive contains the following components by weight:

[0067] 70 parts of modified aluminum dihydrogen phosphate, 30 parts of silicone-modified phenolic resin containing active end groups, 15 parts of γ-aminopropyltriethoxysilane, 42 parts of aluminum oxide, and 6% polyvinyl alcohol concentration 12 parts of paste, 3 parts of aluminum nitride, 7 parts of titanium carbide, 7 parts of zirconia, 7 parts of yttrium oxide, 30 parts of iron oxide and 40 parts of talcum powder;

[0068] The modified aluminum dihydrogen phosphate is aluminum dihydrogen phosphate modified by magnesium oxide, and the specific preparation method is as follows: 100 parts by mass of 85% phosphoric acid solution and 35 parts of aluminum hydroxide solid powder are put into heating and stirring reaction In the kettle, stir at a temperature of 90°C at a speed of 100r / min for 1h to obtain aluminum dihydrogen phosphate, then...

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Abstract

The invention belongs to the technical field of adhesives, and particularly relates to a normal-temperature curing organic and inorganic compound high-temperature-resistant adhesive and a preparationmethod thereof. The normal-temperature curing organic and inorganic compound high-temperature-resistant adhesive comprises, by weight, 50-100 parts of modified aluminum dihydrogen phosphate, 20-50 parts of phenolic resin with activity end groups, 5-30 parts of silane coupling agents, 38-80 parts of curing cross-linking agents, 2-5 parts of curing accelerators, 15-30 parts of high-temperature-resistant filling agents and 50-100 parts of fillers. The normal-temperature curing organic and inorganic compound high-temperature-resistant adhesive shows excellent adhesive performance of an organic matter at the temperature of 400 DEG C or less and shows heat resistance of an inorganic matter at high temperature of 400 DEG C or more, normal-temperature curing can be achieved, raw materials used inthe preparation method of the adhesive are low in cost, the method is simple in process and easy to operate, the prepared adhesive has high curing environmental adaptability and is low in operation requirement and convenient to use, components of the adhesive are uniformly mixed, and the adhesive can be normally coated.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a normal-temperature curing organic-inorganic composite high-temperature-resistant adhesive and a preparation method thereof. Background technique [0002] High temperature resistant adhesives include organic adhesives and inorganic adhesives. Organic high temperature resistant adhesives mainly include silicone resin, silicone rubber, polyimide, phenolic, epoxy resin, etc., while inorganic high temperature resistant adhesives Agents mainly include silicates, alkali metal phosphates and silica sol. There are many types of organic adhesives, and the bonding strength to materials is generally high. However, because organic matter is easy to decompose at high temperatures, the general temperature resistance level is not high, and the temperature resistance generally does not exceed 350°C. Phenolic resin is the earliest industrialized synthetic resin. As an adhesive, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/06C09J11/04C09J1/00C09J11/06C09J11/08
CPCC08L2201/08C08L2205/02C09J1/00C09J11/04C09J11/06C09J11/08C09J161/06C09J161/14C08L61/14C08K13/06C08K9/02C08K3/32C08K5/544C08L61/06
Inventor 王勃关悦瑜张广艳刘文仓刘士琦鞠春红薛健庞杨赵毅磊王洁莹
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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