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No-clean liquid aluminum soldering flux and preparation method thereof

A liquid aluminum and flux technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of large welding residual corrosion, insufficient welding activity, aluminum exposed on the tin surface, etc., achieving less residue, good solderability, little splash effect

Inactive Publication Date: 2018-06-26
QINGDAO XIANGZHI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inventor provides a no-cleaning liquid aluminum flux, which solves the problems of less hanging tin, exposed aluminum on the tin surface, insufficient soldering activity, and large soldering residual corrosion.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0024] The preparation method of described hydroxylamine fluoride, comprises the following steps:

[0025] 1) In terms of weight percentage, take 1-5% of ethylenediamine, 3-30% of ethanolamine, 20-90% of diethanolamine and 5-80% of triethanolamine, and mix them uniformly to obtain a mixture;

[0026] 2) The resulting mixture is neutralized to a pH value of 6.5-8 with hydrofluoric acid;

[0027] 3) Evaporate the above neutralized product at a temperature of 140-160° C. for 3.5-4.5 hours.

[0028] The metal active salt is one or more of tin fluoride, stannous fluoride, stannous fluoroborate, stannous chloride, zinc fluoride, zinc fluoroborate, zinc chloride and bismuth chloride combination.

[0029] The activator is one or a combination of diethylamine hydrochloride, triethylamine hydrochloride, lithium fluoride, sodium fluoride, magnesium fluoride and aluminum fluoride.

[0030] The solvent is one or a combination of water, ethanol, isopropanol, ethylene glycol, and propylen...

Embodiment 1

[0040] The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0041] 1) According to weight percentage, take ethylenediamine 1%, ethanolamine 30%, diethanolamine 64% and triethanolamine 5%, mix and stir evenly to obtain a mixture;

[0042] 2) the resulting mixture is neutralized to a pH value of 6.5 with hydrofluoric acid;

[0043] 3) Evaporate the neutralized product above for 4.5 hours at a temperature of 140° C. to remove moisture therein and prevent subsequent welding spatter.

Embodiment 2

[0045] The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0046] 1) Take 5% of ethylenediamine, 3% of ethanolamine, 84% of diethanolamine and 8% of triethanolamine according to weight percentage, mix and stir evenly to obtain a mixture;

[0047] 2) the resulting mixture is neutralized to a pH value of 7 with hydrofluoric acid;

[0048] 3) Evaporate the neutralized product above for 3.5 hours at a temperature of 160° C. to remove moisture therein and prevent subsequent welding spatter.

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PUM

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Abstract

The invention relates to no-clean liquid aluminum soldering flux and a preparation method thereof. The preparation method comprises the following steps that (1) 60-85% of hydroxylamine fluoride, 5-30%of metal active salt, 1-5% of an active agent and 0.1-5% of a corrosion inhibitor are weighed by weight and uniformly mixed, and an active material is obtained for standby application; (2), 15-30% ofthe active material and 70-85% of a solvent are weighed by weight for standby application; and (3) the weighed solvent and the weighed active material are mixed, continuously stirred in the mixing process, then heated to the temperature of 50-60 DEG C, stirred for 8-12 min and placed into a sealed plastic container to be stored, and the no-clean liquid aluminum soldering flux is obtained. The no-clean liquid aluminum soldering flux is good in weldability and high in welding efficiency, spatters during welding are small, almost no spatter exist, and solder is saved; and the quantity of residues is small after welding, welding spots do not need to be cleaned, and the service life is long.

Description

technical field [0001] The invention relates to a flux, in particular to a no-cleaning liquid aluminum flux for aluminum soft soldering products in the electronic industry field and a preparation method thereof. Background technique [0002] At present, the rapid development of the electronic and electrical industry has put forward higher requirements for the matching soldering materials. At the same time, the importance of human health has been paid more and more attention to. A series of measures are used to improve the earth's environment on which human beings depend. The United Nations Environmental Protection Agency has also proposed a deadline to change substances harmful to the atmospheric environment. However, due to the high reliability requirements of some products in the electronic and electrical industry, the existing fluxes must be cleaned after welding to ensure the performance of the products due to performance reasons. Most of the cleaning agents used now are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/362B23K35/3612
Inventor 不公告发明人
Owner QINGDAO XIANGZHI ELECTRONICS TECH CO LTD