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Modified composite bismaleimide resin prepolymer, resin composition, and semi-cured sheet and laminated board produced therewith

A composite bismaleimide resin, composite bismaleimide technology, applied in synthetic resin layered products, applications, household appliances and other directions, can solve the problem of the distribution of diphenylmethane bismaleimide resin. It can solve the problems of uniformity, fast reaction and poor manufacturability, so as to achieve the effect of solving the problems of reaction control and manufacturability.

Active Publication Date: 2018-06-29
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the contriver finds: propenyl phenoxy compound modified diphenylmethane bismaleimide resin manufacturability is poor, because reaction is too fast, diphenylmethane bismaleimide resin has just gelled before melting, That is to say, there is also a lot of unmelted diphenylmethane bismaleimide resin in the reaction system; therefore there are the following problems: (1) the reaction is too fast and difficult to control; (2) there is unmelted diphenylmethane bismaleimide resin in the system The imide resin will cause uneven distribution of diphenylmethane bismaleimide resin in the system, resulting in unstable performance of the substrate; (3) the prepolymer needs to be dissolved with a high boiling point solvent such as DMF, resulting in More solvent remains in the produced prepreg, which leads to unstable product performance

Method used

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  • Modified composite bismaleimide resin prepolymer, resin composition, and semi-cured sheet and laminated board produced therewith
  • Modified composite bismaleimide resin prepolymer, resin composition, and semi-cured sheet and laminated board produced therewith
  • Modified composite bismaleimide resin prepolymer, resin composition, and semi-cured sheet and laminated board produced therewith

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example

[0060] Add a certain amount of N,N-dimethylformamide (or N,N-dimethylacetamide) solvent into a flask equipped with a thermometer, a reflux condenser, a vacuum concentration device and a stirring device, and then three The molar ratio of functional fluoroketone and allylphenol is 1:(3-4) and a certain amount of accelerator are respectively added to the flask and mixed. Then the temperature of the solution was raised to 160-170° C., and the reaction was maintained at this temperature for 5-10 hours to obtain a crude product, which was filtered. Then the filtrate is cooled and precipitated, filtered, washed with water, and then dried to obtain the desired tripenylphenoxy compound.

[0061] The tripenylphenoxy compounds of the structural formulas (4), (5) and (6) were synthesized by the above method respectively.

[0062]

[0063] The structural formula (1) described in the following examples and comparative examples and (a) to (g) in the structure all refer to the chemical fo...

Embodiment 1

[0069] Take structure (a) and (d) bismaleimide (wherein the mass ratio of structure (a) and (d) is 50:30) 100g in structural formula (1), propenyl phenoxy compound (structural formula (4)) 60g, put into a 500ml beaker, and react at 145°C for 1.5h to obtain a modified composite bismaleimide prepolymer. Get this bismaleimide prepolymer of 60g after cooling and add appropriate amount of acetone to dissolve. After the modified bis-horse resin is completely dissolved, add 15g of cyanate (the selected cyanate resin is: BA-3000S or CE01PS), 15g of biphenyl epoxy resin (NC3000H, epoxy equivalent 288g / mol), 10g containing Phosphorus phenolic resin (XZ92741), 0.05g 2-methyl-4-ethylimidazole, 100g spherical silica (average particle size 0.7 micron, SFP-30M, DENKA), stirred and mixed evenly to obtain glue.

[0070] The glue is dipped and coated on E glass fiber cloth (2116, unit weight is 104g / m 2 ) and baked in an oven at 160°C for 5 minutes to obtain a prepreg with a resin content of ...

Embodiment 2

[0075] Take structure (a) and (d) bismaleimide (wherein the mass ratio of structure (a) and (d) is 50:15) 100g in structural formula (1), propenyl phenoxy compound (structural formula (4)) 60g, put into a 500ml beaker, and react at 145°C for 2.0h to obtain a modified composite bismaleimide prepolymer. Get this bismaleimide prepolymer of 60g after cooling and add appropriate amount of acetone to dissolve. After the modified bis-horse resin is completely dissolved, add 15g of cyanate (the selected cyanate resin is: BA-3000S or CE01PS), 15g of biphenyl epoxy resin (NC3000H, epoxy equivalent 288g / mol), 10g containing Phosphorus phenolic resin (XZ92741), 0.05g 2-methyl-4-ethylimidazole, 100g spherical silica (average particle size 0.7 micron, SFP-30M, DENKA), stirred and mixed evenly to obtain glue.

[0076] The preparation methods of the prepreg and the copper-clad laminate are the same as in Example 1. The preparation method of the interlayer insulating film is the same as

[...

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Abstract

The invention discloses a modified composite bismaleimide resin prepolymer, which is a prepolymer prepared from composite bismaleimide resin and a propenyl phenoxyl compound. The weight ratio of the composite bismaleimide resin to the propenyl phenoxyl compound is 100:50-120. In the invention, some special bismaleimide structures are employed for composition, wherein the structures can control reaction speed due to a steric effect, so that the bismaleimide can be completely hot-melted and reacted with the propenyl phenoxyl compound. The technology solves a problem that a reaction on the bismaleimide in the prior art cannot be controlled and other processing problems are also solved.

Description

technical field [0001] The invention relates to a prepolymer of a modified composite bismaleimide resin, a resin composition and a prepreg and a laminate made using the same, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the rapid development of mobile Internet technology, high-density interconnection (HDI) electronic products have put forward higher requirements for their printed circuit board substrates, in addition to requiring them to have high heat resistance, peeling resistance and In addition to excellent flame retardancy, it is also required to have lower water absorption, dielectric constant / loss value and thermal expansion coefficient. [0003] In the prior art, bismaleimide resin has excellent heat resistance, peel resistance and high modulus, so it is widely used in high-performance printed circuit boards. However, the currently commonly used bismaleimide resins are diamine-modified or allyl-modifie...

Claims

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Application Information

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IPC IPC(8): C08G73/12C08L79/08C08L79/04C08L63/00C08L61/06C08K7/18C08K5/3445C08K7/14B32B15/08B32B15/092B32B15/098B32B27/18B32B27/28
CPCB32B15/08B32B15/092B32B15/098B32B27/18B32B27/28B32B2270/00B32B2457/08C08G73/126C08L79/08C08L2205/02C08L2205/035C08L79/04C08L63/00C08L61/06C08K7/18C08K5/3445C08K7/14
Inventor 谌香秀黄荣辉崔春梅戴善凯任科秘
Owner SHENGYI TECH SUZHOU
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