Nuclear shell structure nano-metal interconnection process

A core-shell structure and nano-metal technology, applied in metal processing equipment, nanotechnology, nanotechnology, etc., can solve problems such as high interconnection temperature, high energy environment, device damage, etc., achieve compact morphology and reduce interconnection temperature and interconnection conditions, the effect of improving oxidation resistance and stability

Active Publication Date: 2018-07-03
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the high interconnection temperature will pose severe challenges to the heat resistance of interconnection equipment, electronic components and substrate materials. For some electronic devices with poor heat resistance, it is easy to cause device damage at high interconnection temperatures; and, for Some special electronic products such as solar film, LED, L

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  • Nuclear shell structure nano-metal interconnection process

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preparation example Construction

[0035] The preparation method of the core-shell structured nanoparticle interconnection material provided by the present invention includes:

[0036] a) The nano copper particles are mixed with the protective agent to obtain a nano copper solution;

[0037] b) The shell precursor and the nano copper solution are mixed, reacted, centrifuged and washed to obtain core-shell bimetallic nanoparticles;

[0038] c) Dispersing the core-shell bimetallic nanoparticles in a solvent and degassing to obtain a core-shell structured nanoparticle interconnection material.

[0039] The preparation method of the core-shell structure nano particle interconnection material provided by the present invention firstly mixes the nano copper particles and the protective agent to obtain a nano copper solution. The preferred specific is:

[0040] The nano copper particles and the protective agent are dispersed in a solvent, and magnetically stirred at room temperature to form a uniformly dispersed nano copper sol...

Embodiment 1

[0077] Add nano-copper particles with a size of 20nm and protective agent polyacrylamide in ethylene glycol solvent, wherein the molar ratio of protective agent to nano-copper particles is 2:1; magnetically stir at room temperature for 30 minutes to form uniformly dispersed nano-copper Solution; Add chloroauric acid to the nano-copper solution, where the molar ratio of chloroauric acid to nano-copper particles is 0.01:1, and the mixed solution is stirred and reacted at room temperature for 90 minutes, and deionized water and water are used at 5000r / min Anhydrous ethanol was centrifuged and washed 4 times each to obtain bimetallic core-shell structured nanoparticles; the core-shell nanoparticles were dispersed in a solvent of diethylene glycol and ethylene glycol butyl ether, and subjected to a vacuum degassing mixture treatment at 2000r / min After 5 minutes, the core-shell nanoparticle interconnecting material is obtained, and the mass ratio of the core-shell nanoparticle powder ...

Embodiment 2

[0080] Add nano-copper particles with a size of 300nm and protective agent polyvinylpyrrolidone into the glycerol solvent, wherein the molar ratio of the protective agent to the nano-copper particles is 5:1; magnetically stir at room temperature for 30 minutes to form uniformly dispersed nano-copper Solution: Add palladium acetate to the nano-copper solution, where the molar ratio of palladium acetate to nano-copper particles is 0.005:1, and the mixed solution is stirred and reacted at room temperature for 120 minutes, and deionized water and anhydrous at 7000r / min Ethanol was centrifuged and washed 4 times each to obtain bimetallic core-shell structured nanoparticles. The core-shell nanoparticles were dispersed in a solvent of ethylene glycol and ethylene glycol methyl ether, and subjected to a vacuum degassing mixing treatment of 3000 r / min for 5 minutes to obtain a core-shell nanoparticle interconnecting material. The core-shell nanoparticle powder accounted for the interconn...

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Abstract

The invention provides a nuclear shell structure nano-metal interconnection process. The nuclear shell structure nano-metal interconnection process comprises the steps that (A), nuclear shell structure nano-particle interconnection materials are printed on a base plate, the nuclear shell structure nano-particle interconnection materials comprise nano-copper particles wrapped by a metal shell layer, and the metal is one or several kinds selected from gold, silver, tin, platinum and palladium; (B), a chip is covered on the surface of the nano-particle interconnection materials, and a whole device is obtained; (C), the whole device is sintered, and an interconnection device is obtained. According to the nuclear shell structure nano-metal interconnection process, the shell layer metal in the nano-copper particles wrapped by the metal shell layer is compact in form, uniform and controllable in size, prone to generate atomic diffusion at low temperature and is connected with the nuclear layer nano-copper particles together to form a three-dimensional interconnection system, the oxidation resistance and stability of nano copper are improved, the interconnection temperature and interconnection condition are further greatly lowered, by means of the nuclear shell structure nano-metal interconnection process, the chip can be interconnected with the base plate at low temperature without pressure, and connection and packaging of electronic devices are finished.

Description

Technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a core-shell structure nano metal interconnection process. Background technique [0002] Electronic packaging technology is an extension of electronic manufacturing technology. The speed of its development and the technical level and production scale reached directly affect the development of the whole product or electronic system. The development power of electronic packaging technology comes from the upgrading of electronic products. One generation of products creates a new generation of technology. With the development trend of light, thin, short and small electronic products and the continuous update of microelectronics technology, electronic packaging technology is characterized by its high density and The characteristics of high performance are gradually entering a period of ultra-high-speed development, which also puts forward higher requirements for the interconne...

Claims

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Application Information

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IPC IPC(8): B22F1/02H01L23/532B82Y30/00B82Y40/00
CPCH01L23/53228B82Y30/00B82Y40/00B22F1/17
Inventor 张昱崔成强陈新
Owner GUANGDONG UNIV OF TECH
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