The invention provides a preparation method of a
nanoparticle interconnecting material with a core-shell structure. The preparation method of the
nanoparticle interconnecting material with the core-shell structure comprises the steps of (A) mixing nano-
copper particles and a protection agent, and obtaining a nano-
copper solution; (B) mixing a shell layer precursor and the nano-
copper solution, reacting, and centrifugally washing to obtain core-shell dual-
metal nanoparticles; and (C) dispersing the core-shell dual-
metal nanoparticles into a
solvent, and defoaming to obtain the
nanoparticle interconnecting material with the core-shell structure. The shell layer prepared through the invention is compact in
metal form, uniform and controllable in size, and easy to generate
atomic diffusion ata lower temperature, and is connected with the nano-copper particles to form a three-dimensional interconnecting
system, so that not only are the inoxidizability and the stability of the core layer nano-copper particles improved, but also an interconnecting temperature and an interconnecting condition are greatly reduced. A
chip and a substrate can be interconnected under a low-temperature non-pressure condition, and a
semiconductor device is connected and packaged, so that the nanoparticle interconnecting material with the core-shell structure can be better applied to the fields of
semiconductor device manufacturing and microelectronic packaging,
power electronics packaging and the like.