Ce2O3 containing fluorine-free low-dielectric glass fiber and preparation method thereof

A glass fiber, low dielectric technology, applied in glass manufacturing equipment, manufacturing tools, etc., can solve the problems of easy peeling, high hardness of multi-layer substrates, and large dielectric loss.

Inactive Publication Date: 2018-07-24
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

E glass fiber has good water resistance and processability, and the price is low, but its dielectric constant is high, generally greater than 6.5, and the dielectric loss is relatively large, generally higher than 10 -3 , it is difficult to meet the needs of high-density PCB boards and high-speed information processing
In this regard, experts have developed a new type of glass fiber - D glass fiber, the dielectric constant of this fiber can reach about 4.1, and the loss can be as low as 8×10 -4 , excellent dielectric properties, but also has great limitations: First, compared with E glass fiber, its SiO 2 The higher the content of the glass, the higher the melting temperature of the glass, the poorer the melting property, and the defects such as air bubbles are prone to occur in the production, resulting in the difficulty of wire drawing and the problems of broken wires in the textile process; secondly, the D glass fiber-reinforced multilayer The substrate has high hardness and poor drilling performance, which is not conducive to subsequent production and processing; moreover, its water resistance is poor, it is not firmly bonded to the resin substrate, and it is easy to peel off

Method used

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  • Ce2O3 containing fluorine-free low-dielectric glass fiber and preparation method thereof
  • Ce2O3 containing fluorine-free low-dielectric glass fiber and preparation method thereof

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Embodiment 1~7

[0029] The raw material of the present invention can be made into glass or glass fiber. The method of preparing glass is to cast and anneal the glass liquid formed by melting the raw materials; the method of preparing glass fiber is to draw the prepared glass liquid on the basis of the wire drawing process. Since some test items cannot directly use glass fiber, in order to test various properties of glass fiber more conveniently, glass with the same formula is prepared for testing.

[0030] Remark:

[0031] 1) Dielectric properties: use Keysight E4990A precision impedance analyzer to measure the dielectric constant and dielectric loss of the sample at room temperature and 1MHz frequency;

[0032] 2) Glass forming temperature: use BROOKFIELD high temperature viscometer to detect, take glass viscosity as 10 3 The temperature corresponding to Pa·S is the glass fiber forming temperature;

[0033] 3) Liquidus temperature: Use a METTLER TOLEDO TGA / DSC 1-1600HT differential scanni...

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Abstract

The invention provides a fluorine-free low-dielectric glass fiber, which has an excellent dielectric constant and low dielectric loss. The dielectric constant is 4.13-4.95 and the dielectric loss is 4.32*10<-3> to 7.24*10<-3> under 1 MHz. The glass fiber composition is prepared from following raw materials in percentage by mole: 56 to 66% of SiO2, 19 to 23% of B2O3, 6 to 10% of Al2O3, 0.5 to 1% ofNa2O, 8 to 15% of CaO, 0.5 to 8% of Ce2O3, and does not contain any F (fluorides) or Fe (iron oxides). The provided glass fiber can be used to prepare a reinforcing material for printed circuit boards (PCB) and can be used to strengthen radome.

Description

technical field [0001] The invention belongs to the technical field of glass fibers, and in particular relates to a fluorine-free low dielectric constant and low loss glass fiber, which is especially suitable for the production field of copper clad laminates. Background technique [0002] With the rapid development of electronic technology, network signals are moving from the 4G era to the 5G era, the amount of information carried by electronic products is increasing, multi-functional application electronic products are emerging, and signal transmission is moving towards high-speed, high-frequency, digital and multi-functional It has achieved comprehensive development in the fields of national economy, aerospace, national defense and military industry. Electronic equipment has the characteristics of multi-functionality, lightness, flexibility, stability and reliability. It is an inevitable trend under the rapid improvement of the electronics industry and the development of i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C13/00C03B37/022
CPCC03B37/022C03C13/00
Inventor 李升岳云龙卢亚东
Owner UNIV OF JINAN
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