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Treatment method of electroplating copper-containing wastewater

A treatment method, a technology for electroplating wastewater, applied in the direction of metallurgical wastewater treatment, multi-stage water treatment, water/sewage treatment, etc., can solve the problems of incomplete network breaking, large amount of waste residue, slow reaction, etc., to accelerate network breaking and reduce Wastewater treatment cost, effect of shortening distance

Inactive Publication Date: 2018-08-14
文树龙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method of using calcium hydroxide-nickel oxyhydroxide to catalyze hypochlorous acid to treat electroplating copper-containing wastewater to solve the problems of slow reaction, incomplete network breaking and large amount of waste residue in the prior art

Method used

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  • Treatment method of electroplating copper-containing wastewater

Examples

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Effect test

Embodiment 1

[0031] Taking the electroplating copper-containing wastewater of a factory in Zhongshan as the treatment object, the total copper of the raw water quality is 570.58mg / L, the complexed copper is 9.8mg / L, the pH is 3.0, and the chemical oxygen demand COD is 1297.36mg / L.

[0032] Add the raw water of electroplating wastewater to the first sedimentation tank, add sodium hydroxide to adjust the pH to 7.0, and carry out the reaction for 2 hours. After the wastewater flows into the oxidation tank, adjust the pH to 8. Add 0.4 kg per ton of wastewater to the oxidation tank Add calcium hypochlorite, add calcium hydroxide-nickel oxyhydroxide in an amount of 0.2mol per liter of wastewater, and react for 3 hours; after the reaction, the mixed solution flows into the coagulation tank, adds 3g of PAM to each ton of wastewater for coagulation, and then starts the mixer Start stirring, and the residence time of the wastewater in the coagulation tank is 15 minutes (the fast mixing tank stays for...

Embodiment 2

[0034] Taking electroplating copper-containing wastewater from a factory in Zhongshan as the treatment object, the raw water quality was 430.58mg / L of total copper, 16.37mg / L of complexed copper, pH of 3.2, and COD of 1245.81mg / L.

[0035]Add the raw water of electroplating wastewater to the first sedimentation tank, add sodium hydroxide to adjust the pH to 8.0, and carry out the reaction for 2 hours. After the wastewater flows into the oxidation tank, adjust the pH to 12. Add 1.6kg per ton of wastewater to the oxidation tank. Add calcium hypochlorite, add calcium hydroxide-nickel oxyhydroxide in an amount of 0.5mol per liter of wastewater, and react for 3 hours; after the reaction, the mixed solution flows into the coagulation tank, and 10g of PAM is added to each ton of wastewater for coagulation, and then the mixer is turned on Start stirring, and the residence time of the wastewater in the coagulation tank is 15min (the fast mixing tank stays for 5mi and the rotation speed ...

Embodiment 3

[0037] Taking electroplating copper-containing wastewater from a factory in Zhuhai as the treatment object, the raw water quality was 754.3mg / L for total copper, 12.54mg / L for complex copper, pH 3.1, and COD 845.6mg / L.

[0038] Add the raw water of electroplating wastewater to the first sedimentation tank, add sodium hydroxide to adjust the pH to 7.5, and carry out the reaction for 2 hours. After the wastewater flows into the oxidation tank, adjust the pH to 9, and add 1.0kg per ton of wastewater to the oxidation tank. Add calcium hypochlorite, add calcium hydroxide-hydroxyl in an amount of 0.5mol per liter of wastewater, and react for 3 hours; after the reaction, the mixed solution flows into the coagulation tank, and 5g of PAM is added to each ton of wastewater for coagulation, and then the mixer is started to stir , the residence time of wastewater in the coagulation tank is 15min (the fast mixing tank stays for 5mi, the speed is 300r / min; the slow mixing tank stays for 10mi...

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Abstract

The invention discloses a treatment method of electroplating copper-containing wastewater. The treatment method comprises the following steps: wastewater flows into a first sedimentation tank, sodiumhydroxide is added, the pH value is regulated to 7.0-8.0, and copper hydroxide precipitates are recovered; the supernatant flows into an oxidation tank, the pH value is regulated to 8-12, and then calcium hypochlorite and a catalyst (calcium hydroxide-nickel oxide hydroxide) are sequentially added, and a full reaction is carried out in the oxidation pond; then the obtained substance flows into a coagulation tank containing polyacrylamide and a second sedimentation tank for coagulation sedimentation, and the obtained supernatant is discharged into a regulating tank, and whether the supernatantreaches a standard is detected; a small part of the obtained precipitates flow back to be mixed with raw water, and then enter the first sedimentation tank, precipitation is carried out for recoveringcopper hydroxide, and most of the precipitate flow back to the oxidation tank. According to the treatment method, calcium hydroxide-nickel oxide hydroxide is utilized to accelerate the conversion ofhypochlorous acid into free oxygen, then the reaction of the free oxygen with complex copper is accelerated, the precipitate returns to a first regulating tank, and finally the copper is recovered inthe form of copper hydroxide, so that the cost of wastewater treatment is reduced.

Description

technical field [0001] The invention relates to the technical field of environmental protection wastewater treatment, in particular to a treatment method for electroplating copper-containing wastewater. Background technique [0002] Copper electroplating is an indispensable process technology in the manufacturing process. In the electroplating process, a large amount of wastewater containing heavy metal copper will inevitably be produced. Heavy metal copper ions in wastewater are a kind of high pollutants. In the electroplating process, various electroplating additives are often added for the purpose of flattening the coating, and at the same time, various special electroplating additives are often used for via plating in the electroplating process. Electroplating additives generally contain toxic and harmful organic substances. How to effectively degrade these toxic and harmful organic substances contained in wastewater and discharge them up to the standard is an industrial...

Claims

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Application Information

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IPC IPC(8): C02F9/04C01G3/02C02F103/16
CPCC01G3/02C02F1/56C02F1/66C02F1/725C02F9/00C02F2001/007C02F2103/16C02F2301/08
Inventor 文树龙
Owner 文树龙
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