Perovskite/silicon heterojunction stacked solar cell structure and manufacturing method thereof
A stacked battery and silicon heterojunction technology, which is applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems affecting the long-term stability of batteries, high cost, and difficulties in mass production of stacked batteries, and achieve high-efficiency metallization Solution, reduce battery production cost, improve the effect of battery stability
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[0035] A manufacturing method of a perovskite / silicon heterojunction solar laminated battery structure includes the following steps:
[0036] Step 1: Fabricate the monocrystalline silicon layer 9. The n-type polished monocrystalline silicon substrate with a thickness of 90-250μm is etched in KOH solution to obtain the pyramid structure surface. The temperature of the solution is about 90°C. After the completion, the silicon wafer is cleaned. Here, the thickness of the n-type polished single crystal silicon substrate is preferably 150 μm.
[0037] Step 2: Plasma-enhanced chemical vapor deposition (PECVD) is used to sequentially deposit the intrinsic amorphous silicon film 10 and the p-type or n-type amorphous silicon film 11 on the back of the single crystal silicon layer 9. The thickness of the lower intrinsic amorphous silicon film 10 (a-Si:H(i)) is 3-10 nm, preferably 5 nm here; the p-type or n-type amorphous silicon film 11 is selected as an n-type amorphous ...
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Specific Example 2
[0048] Step 1: Fabricate the monocrystalline silicon layer 9. The n-type polished monocrystalline silicon substrate with a thickness of 90-250μm is etched in KOH solution to obtain the pyramid structure surface. The temperature of the solution is about 90°C. After the completion, the silicon wafer is cleaned. Here, the thickness of the n-type polished single crystal silicon substrate is preferably 250 μm.
[0049] Step 2: Plasma-enhanced chemical vapor deposition (PECVD) is used to sequentially deposit the intrinsic amorphous silicon film 10 and the p-type or n-type amorphous silicon film 11 on the back of the single crystal silicon layer 9. The thickness of the lower intrinsic amorphous silicon film 10 (a-Si:H(i)) is 3-10 nm, preferably 5 nm here; the p-type or n-type amorphous silicon film 11 is selected as a p-type amorphous silicon film, p-type amorphous silicon film (a-Si:H(p + The thickness of )) is 3 to 30 nm, preferably 20 nm.
[0050] In step three, th...
Example Embodiment
Specific Example 3
[0060] Step 1: Fabricate the monocrystalline silicon layer 9. The n-type polished monocrystalline silicon substrate with a thickness of 90-250μm is etched in KOH solution to obtain the pyramid structure surface. The temperature of the solution is about 90°C. After the completion, the silicon wafer is cleaned. Here, the thickness of the n-type polished single crystal silicon substrate is preferably 250 μm.
[0061] Step 2: Plasma-enhanced chemical vapor deposition (PECVD) is used to sequentially deposit the intrinsic amorphous silicon film 10 and the p-type or n-type amorphous silicon film 11 on the back of the single crystal silicon layer 9. The thickness of the lower intrinsic amorphous silicon film 10 (a-Si:H(i)) is 3-10 nm, preferably 5 nm here; the p-type or n-type amorphous silicon film 11 is selected as a p-type amorphous silicon film, p-type amorphous silicon film (a-Si:H(p + The thickness of )) is 3 to 30 nm, preferably 20 nm.
[0062] In step three, th...
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