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Plastic with anti-static and cooling properties for electronic product shell

A technology of heat dissipation performance and electronic products, which is applied in the field of plastics for electronic product casings, can solve the problems of poor compatibility, affect the stability and strength of plastic materials, and cannot achieve performance, and achieve the effect of improving heat dissipation performance.

Inactive Publication Date: 2018-09-28
合肥奇呗数字科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The additives added in these technical solutions do help to improve the corresponding performance, but the compatibility between these inorganic material additives and the polymer material body is poor, and the corresponding performance cannot be achieved if the amount added to the host material is too low , if the added amount is too high, it will affect the material stability and strength of the plastic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A plastic for electronic product housings with antistatic and heat dissipation properties. According to the mass parts, the plastic includes the following components: 40 parts of ABS resin, 14 parts of polycarbonate, 8 parts of conductive heat dissipation particles, and 3 parts of glass fiber Parts, 3 parts of EPDM, 4 parts of compatibilizer, 1 part of lubricant, 0.5 part of antioxidant, 1 part of coupling agent.

[0030] In this embodiment, the conductive heat dissipation particles are metal copper powder coated with gel, and the preparation method of the conductive heat dissipation particles includes the following steps:

[0031] (1) According to the volume ratio, dissolve 3 parts of ethyl orthosilicate in 40 parts of ethanol, then add 3 parts of deionized water and 7 parts of acetic acid, mix and stir to fully dissolve to obtain liquid A; according to the mass parts, After mixing 2 parts of boric acid, 3 parts of barium acetate and 5 parts of zinc acetate, add them to 50 ...

Embodiment 2

[0041] A plastic for electronic product housing with antistatic and heat dissipation properties. According to the mass parts, the plastic includes the following components: 50 parts of ABS resin, 18 parts of polycarbonate, 16 parts of conductive heat dissipation particles, and 7 parts of glass fiber Parts, 6 parts of EPDM rubber, 5 parts of compatibilizer, 3 parts of lubricant, 1.3 parts of antioxidant, 3 parts of coupling agent.

[0042] In this embodiment, the conductive heat dissipation particles are metal copper powder coated with gel, and the preparation method of the conductive heat dissipation particles includes the following steps:

[0043] (1) According to the volume ratio, dissolve 3 parts of ethyl orthosilicate in 40 parts of ethanol, then add 3 parts of deionized water and 7 parts of acetic acid, mix and stir to fully dissolve A liquid; according to the mass parts, After mixing 2 parts of boric acid, 3 parts of barium acetate and 5 parts of zinc acetate, add them to 50 ...

Embodiment 3

[0053] A plastic for electronic product housings with antistatic and heat dissipation properties. According to the mass parts, the plastic includes the following components: 46 parts of ABS resin, 15 parts of polycarbonate, 12 parts of conductive heat-dissipating particles, and 5 parts of glass fiber Parts, 4 parts of EPDM, 4.6 parts of compatibilizer, 2.1 parts of lubricant, 0.9 parts of antioxidant, 2 parts of coupling agent.

[0054] In this embodiment, the conductive heat dissipation particles are metal copper powder coated with gel, and the preparation method of the conductive heat dissipation particles includes the following steps:

[0055] (1) According to the volume ratio, dissolve 3 parts of ethyl orthosilicate in 40 parts of ethanol, then add 3 parts of deionized water and 7 parts of acetic acid, mix and stir to fully dissolve A liquid; according to the mass parts, After mixing 2 parts of boric acid, 3 parts of barium acetate and 5 parts of zinc acetate, add them to 50 pa...

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Abstract

The invention relates to the technical field of high polymer materials, in particular to a plastic with anti-static and cooling properties for an electronic product shell. The plastic is prepared fromABS resin, polycarbonate, conducting heat dissipation particles, glass fiber, ethylene propylene diene monomer, compatilizer, lubricant, antioxidant and a coupling agent, wherein the conducting heatdissipation particles are metal copper powder wrapped by gel, the fiber length of the glass fiber is 0.3-0.5 mm, the compatilizer is a mixture of nano calcium carbonate and maleic anhydride grafted polyolefin copolymer, the lubricant is zinc stearate or magnesium stearate, and the coupling agent is one of gamma-glycidyl oxypropyl trimethoxysilane, gamma-amino propyl triethoxysilane and gamma-chloropropyl trimethoxy silane. The resin material not only has high strength and hardness, but also can significantly improve the cooling property and the anti-static effect of the ABS resin material.

Description

Technical field [0001] The invention relates to the technical field of polymer materials, in particular to a plastic for electronic product housings with antistatic and heat dissipation properties. Background technique [0002] Some electronic or electrical equipment is usually equipped with a casing. The function of the casing is to protect the internal structure to prevent the internal precision components from being damaged by light, heat, water vapor, corrosive substances, or being impacted by external forces. Ensure the normal operation of the equipment and increase the service life of the equipment. Conventional equipment housing materials include metal materials, glass materials, ceramic materials, wood materials and organic polymer materials. These materials all have their own advantages and disadvantages. For example, metal materials have high structural strength and excellent impact resistance, but they have poor corrosion resistance and insulation properties. Wood mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L55/02C08L69/00C08L23/16C08L51/06C08K13/06C08K9/10C08K3/08C08K7/14C08K3/26C08K5/5435
CPCC08L55/02C08K2003/085C08K2003/265C08K2201/001C08K2201/011C08L2201/04C08L2201/08C08L2205/035C08L69/00C08L23/16C08L51/06C08K13/06C08K9/10C08K3/08C08K7/14C08K3/26C08K5/5435
Inventor 罗厚秀
Owner 合肥奇呗数字科技有限公司
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