Temperature-resistant hot melt adhesive for military electronic components and preparation method thereof

An electronic component, warm technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of unsuitable structural adhesives, high and low temperature resistance and low bonding strength , to achieve good high and low temperature synergistic effect, increase high and low temperature resistance, good effect

Inactive Publication Date: 2018-10-19
ANHUI NIKOLA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, hot melt adhesives have some disadvantages: mainly high and low temperature resi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A temperature-resistant hot-melt adhesive for military electronic components, consisting of the following raw materials in parts by weight:

[0018] 42 parts of EVA resin, 23 parts of pure thermosetting liquid polyimide resin, 22 parts of terpene phenolic resin, 6 parts of polyethylene wax, 3 parts of isobutyltriethoxysilane, 4 parts of expanded graphite, linear low density polyethylene 3 parts, 3.8 parts of adhesion modifier, 1.1 parts of antioxidant, 1.2 parts of heat stabilizer.

[0019] The adhesion modifier is a compound of hydroxyl-terminated polybutadiene and ethylene-methyl acrylate copolymer; wherein, the mass ratio of hydroxyl-terminated polybutadiene to ethylene-methyl acrylate copolymer is 1:1.2 .

[0020] The antioxidant is antioxidant 1010, and the thermal stabilizer is epoxy soybean oil.

[0021] The preparation method of the above-mentioned temperature-resistant hot melt adhesive for military electronic components includes the following preparation met...

Embodiment 2

[0026] A temperature-resistant hot-melt adhesive for military electronic components, consisting of the following raw materials in parts by weight:

[0027] 43 parts of EVA resin, 25 parts of pure thermosetting liquid polyimide resin, 24 parts of terpene phenolic resin, 7.6 parts of polyethylene wax, 3.6 parts of isobutyltriethoxysilane, 4.6 parts of expanded graphite, linear low density polyethylene 3.4 parts, 4.2 parts of adhesion modifier, 1.2 parts of antioxidant, 1.3 parts of heat stabilizer.

[0028] The adhesion modifier is a compound of hydroxyl-terminated polybutadiene and ethylene-methyl acrylate copolymer; wherein, the mass ratio of hydroxyl-terminated polybutadiene to ethylene-methyl acrylate copolymer is 1:1.3 .

[0029] The antioxidant is antioxidant 1010, and the thermal stabilizer is epoxy soybean oil.

[0030] The preparation method of the above-mentioned temperature-resistant hot melt adhesive for military electronic components includes the following prepara...

Embodiment 3

[0035] A temperature-resistant hot-melt adhesive for military electronic components, consisting of the following raw materials in parts by weight:

[0036] 42 parts of EVA resin, 24 parts of pure thermosetting liquid polyimide resin, 23 parts of terpene phenolic resin, 7.4 parts of polyethylene wax, 3.2 parts of isobutyltriethoxysilane, 4.3 parts of expanded graphite, linear low density polyethylene 3.5 parts, 4.2 parts of adhesion modifier, 1.1 parts of antioxidant, 1.3 parts of heat stabilizer.

[0037] The adhesion modifier is a compound of hydroxyl-terminated polybutadiene and ethylene-methyl acrylate copolymer; wherein, the mass ratio of hydroxyl-terminated polybutadiene to ethylene-methyl acrylate copolymer is 1:1.3 .

[0038] The antioxidant is antioxidant 1010, and the thermal stabilizer is epoxy soybean oil.

[0039] The preparation method of the above-mentioned temperature-resistant hot melt adhesive for military electronic components includes the following prepara...

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PUM

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Abstract

The invention discloses temperature-resistant hot melt adhesive for military electronic components and a preparation method thereof. The temperature-resistant hot melt adhesive comprises the followingraw materials (by weight): 30-45 parts of EVA resin, 18-26 parts of thermosetting liquid polyimide pure resin, 16-25 parts of polyterpene phenolic resin, 5-8 parts of polyethylene wax, 2-4 parts of isobutyl triethoxysilane, 3-5 parts of expandable graphite, 2-4 parts of linear low density polyethylene, 2.5-4.5 parts of an adhesive modifier, 0.8-1.3 parts of an antioxidant, and 1-1.5 parts of a heat stabilizer. The formula of the temperature-resistant hot melt adhesive for military electronic components is reasonable. After prepared, the temperature-resistant hot melt adhesive for military electronic components has good high-and-low temperature resistance, adhesive property, thermal stability, mechanical properties and the like, has excellent comprehensive performance, can be used in the preparation of parts or equipment in the industries of aerospace, ships and warships, radar, electronic information equipment and the like, and has good effects.

Description

technical field [0001] The invention belongs to the technical field of polymer glue formulations, and in particular relates to a temperature-resistant hot melt adhesive for military electronic components and a preparation method thereof. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as springs, hairsprings, and springs. Common ones include diodes, etc. Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power suppli...

Claims

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Application Information

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IPC IPC(8): C09J123/08C09J179/08C09J11/06C09J11/04C09J11/08
CPCC08L2201/08C08L2205/035C09J11/04C09J11/06C09J11/08C09J123/0853C08L79/08C08L61/06C08L23/06C08L23/0869C08L23/0815C08L91/00C08K9/06C08K7/24C08K5/1345
Inventor 夏森陈大龙黄耀操瑞谢荣婷
Owner ANHUI NIKOLA ELECTRONICS TECH CO LTD
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