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High-heat-conductivity crosslinkable resin composition as well as prepreg and thermosetting copper-clad plate prepared thereby

A cross-linked resin and prepreg technology, applied in the field of communication materials, can solve the problems of high-speed, high-frequency, lossless and large-capacity information transmission, limited addition of thermal conductive fillers, and limited improvement of substrate thermal conductivity, etc., to achieve good industrialization The production basis, the uniformity of various properties, and the effect of suitable viscosity

Active Publication Date: 2018-11-06
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the compounding of various thermosetting resins and thermally conductive fillers mentioned above is usually realized through the solution mixing method, followed by gluing-baking-curing and other steps. The process is complicated and the solvent pollution is serious
In particular, the amount of thermally conductive filler added in this process is extremely limited, resulting in a limited increase in the thermal conductivity of the substrate, which is difficult to meet the current needs of high-speed, high-frequency, lossless and large-capacity information transmission

Method used

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  • High-heat-conductivity crosslinkable resin composition as well as prepreg and thermosetting copper-clad plate prepared thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Take 70 parts of polybutadiene (Craigville Ricon130), 30 parts of polybutadiene-maleic anhydride copolymer (Craigville Ricon130MA8), 40 parts of BN (particle size 5 μm), 5 parts of SiO 2 (Xinyi Hongrun), 35 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 1 part of dibenzoyl peroxide (Qinfeng Chemical), 20 o C, stirred and mixed in a ball mill for 120 hours to obtain a uniform high thermal conductivity polydiene composition; the composition was scraped on a clean stainless steel plate to form a film with a thickness of about 0.81 mm, and after baking at 65 ° C for 25 minutes, Continue to bake at 120°C for 60 minutes. After it naturally drops to room temperature, peel off the film from the stainless steel sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectric sheet and 2 pieces of loz copper foil, and heat it under a pressure of 130 ~150kg / cm 2 , and laminated for 8 hours at a temperature of 320° C. to prepare a thermose...

Embodiment 2

[0019] Take 65 parts of polybutadiene (Kray Willy Ricon130), 35 parts of polybutadiene-maleic anhydride copolymer (Kray Willy Ricon130MA8), 15 parts of BN (particle size 5 μm), 20 parts of SiC (particle size 6μm), 30 parts of flame retardant magnesium hydroxide (USA Albemarle MAGNIFIN H-5), 20 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 0.9 parts of dibenzoyl peroxide (Qinfeng Chemical), 20 o C, after stirring and mixing in a ball mill for 120h, a uniform high thermal conductivity polydiene composition was obtained; the molding temperature was set at 25 o C. Molding pressure is 30kg / cm 2 1. The molding time is 10 minutes, and the composition is made into a film with a thickness of about 0.81mm. After baking at 65°C for 25 minutes, continue to bake at 120°C for 60 minutes. Peel off the stainless steel sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectric sheet and 2 pieces of loz copper foil, and press it under a pressure...

Embodiment 3

[0021] Take 65 parts of polybutadiene (Kray Willy Ricon130), 35 parts of polybutadiene-maleic anhydride copolymer (Kray Willy Ricon130MA8), 35 parts of BN (particle size 5 μm), 45 parts of polytetrafluoroethylene Pre-sintered material (Shandong Dongyue), 28 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 0.9 parts of dibenzoyl peroxide (Qinfeng Chemical), 20 o C, after stirring and mixing in a ball mill for 120 hours, a uniform high thermal conductivity polydiene composition was obtained; the composition was scraped into a film with a thickness of about 0.81 mm on a clean glass plate, and after baking at 65 ° C for 25 minutes, Continue to bake at 120°C for 60 minutes, and after it naturally drops to room temperature, peel off the film from the glass sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectric sheet and 2 sheets of loz copper foil, and heat it under a pressure of 140 ~155kg / cm 2 , and laminated for 8 hours at a temper...

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Abstract

The invention relates to a high-heat-conductivity crosslinkable resin composition as well as a prepreg and a thermosetting copper-clad plate prepared thereby. The high-heat-conductivity crosslinkableresin composition is prepared by mixing crosslinkable matrix resin, modified resin, high-heat-conductivity filler, auxiliary filler, a flame retardant and an initiator through a ball-milling method. Anon-cured piece with uniform thickness and flat surface is prepared by extruding, mold-pressing or scrape-coating modes under the low-temperature environment, and the prepreg with proper toughness and viscosity is prepared through the steps of baking and the like. The thermosetting copper-clad plate is prepared by superposing the prepreg, a film and a copper foil through a laminating process. Thethermosetting copper-clad plate has an excellent dielectric property, mechanical strength, heat resistance, high heat-conducting coefficient, low thermal expansion coefficient and excellent propertyuniformity, and can meet various property requirements on the thermosetting copper-clad plate material by the current high-frequency and high-speed communication field. Good industrialized productionbasis and wide application prospect are achieved.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a highly thermally conductive crosslinkable resin composition and a prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Electronic products are rapidly developing in the direction of miniaturization, light weight, thinner and multi-functional. As the main carrier of electronic components, the copper clad laminate has higher and higher integration and finer circuit layout. Therefore, in addition to excellent insulation and thermal-mechanical properties, copper clad laminates should also have good thermal conductivity and heat dissipation functions. Although metal-based CCL has the best heat dissipation capability, its manufacturing cost remains high and production is difficult, and it is mostly used in high-current modules. Ceramic substrates such as alumina-based, aluminum-nitride-based, and silicon-nitride-based s...

Claims

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Application Information

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IPC IPC(8): C08L47/00C08L27/18C08K13/02C08K3/38C08K3/36C08K5/03C08K3/34C08K3/22B32B15/08B32B27/18B32B27/20B32B27/28B32B37/02B32B37/06B32B37/10
CPCB32B15/08B32B27/18B32B27/20B32B27/28B32B37/02B32B37/06B32B37/10B32B2307/302B32B2457/08C08K2003/2224C08K2003/385C08L47/00C08L2201/02C08L2203/20C08L2205/025C08L2205/03C08K13/02C08K3/38C08K3/36C08K5/03C08K3/34C08K3/22C08L27/18
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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