High-heat-conductivity crosslinkable resin composition as well as prepreg and thermosetting copper-clad plate prepared thereby
A cross-linked resin and prepreg technology, applied in the field of communication materials, can solve the problems of high-speed, high-frequency, lossless and large-capacity information transmission, limited addition of thermal conductive fillers, and limited improvement of substrate thermal conductivity, etc., to achieve good industrialization The production basis, the uniformity of various properties, and the effect of suitable viscosity
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[0016] Example 1
[0017] Take 70 parts of polybutadiene (Cray Willy Ricon130), 30 parts of polybutadiene-maleic anhydride copolymer (Cray Willy Ricon130MA8), 40 parts of BN (particle size 5μm), 5 parts of SiO 2 (Xinyi Hongrun), 35 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 1 part of dibenzoyl peroxide (Qinfeng Chemical), 20 o Under C, after stirring and mixing in a ball mill for 120 hours, a uniform high thermal conductivity polydiene composition was obtained; the composition was scraped on a clean stainless steel flat plate into a film with a thickness of about 0.81 mm, and after baking at 65 ° C for 25 min, Continue to bake at 120°C for 60 min, and after it naturally falls to room temperature, peel off the film from the stainless steel sheet to obtain a prepreg dielectric sheet; take 1 sheet of the prepreg dielectric sheet and 2 sheets of loz copper foil, under the pressure of 130 ~150kg / cm 2 , and the temperature is 320°C for 8 hours to obtain a the...
Example Embodiment
[0018] Example 2
[0019] Take 65 parts of polybutadiene (Cray Willy Ricon130), 35 parts of polybutadiene-maleic anhydride copolymer (Cray Willy Ricon130MA8), 15 parts of BN (particle size 5μm), 20 parts of SiC (particle size 6μm), 30 parts of flame retardant magnesium hydroxide (Albemarle MAGNIFIN H-5, USA), 20 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 0.9 parts of dibenzoyl peroxide (Qinfeng Chemical), 20 parts o C, stir and mix in a ball mill for 120h to obtain a uniform high thermal conductivity polydiene composition; set the molding temperature to 25 o C. The molding pressure is 30kg / cm 2 , The molding time is 10min, the composition is made into a film with a thickness of about 0.81mm, after baking at 65°C for 25min, and then continuing to bake at 120°C for 60min, after it naturally falls to room temperature, the film is removed from Peel off the stainless steel sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectr...
Example Embodiment
[0020] Example 3
[0021] Take 65 parts of polybutadiene (Cray Willy Ricon130), 35 parts of polybutadiene-maleic anhydride copolymer (Cray Willy Ricon130MA8), 35 parts of BN (particle size 5μm), 45 parts of polytetrafluoroethylene Pre-sintered material (Shandong Dongyue), 28 parts of decabromodiphenylethane (Shandong Neptune Chemical) and 0.9 parts of dibenzoyl peroxide (Qinfeng Chemical), 20 o Under C, a uniform high thermal conductivity polydiene composition was obtained after stirring and mixing in a ball mill for 120 h; the composition was scraped on a clean glass flat plate into a film with a thickness of about 0.81 mm, and after baking at 65 ° C for 25 min, Continue to bake at 120°C for 60min, and after it naturally falls to room temperature, peel off the film from the glass sheet to obtain a prepreg dielectric sheet; take 1 sheet of the prepreg dielectric sheet and 2 sheets of loz copper foil, under the pressure of 140 ~155kg / cm 2 , and the temperature is 330°C for 8 ho...
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