Red light emitting material capable of being stimulated by near ultraviolet or blue light chip as well as preparation method and application thereof

Abstract

The invention relates to a red light emitting material capable of being stimulated by a near ultraviolet or blue light chip. The general formula of the chemical composition of the red light emitting material is (RE1-x-y-z-mLamZryMgz)2O3:xEu, wherein the x is more than or equal to 0.01 and less than or equal to 0.2, y is more than or equal to 0.001 and less than or equal to 0.2, z is more than or equal to 0 and less than or equal to 0.1, m is more than or equal to 0 and less than or equal to 0.2, RE is equal to Lu1-p-rYpGdr, and p is more than or equal to 0 and less than 1, and r is more than or equal to 0 and less than 1. The red light emitting material is wide in excitation spectrum coverage range and can be matched with the near ultraviolet or blue light LED chip. The red light emittingmaterial product comprises a red light rubber powder material, a red light transparent ceramic material and a red light transparent film material. In addition, the red light emitting material can be used by being combed with blue, green and yellow fluorescent materials (YAG:Ce), can perform encapsulation with the near ultraviolet or blue light chip in different forms and is applied to manufacturing of a white light LED lighting source.

Description

technical field [0001] The invention relates to the technical field of luminescent materials, in particular to a red luminescent material that can be excited by a near-ultraviolet or blue chip, and a preparation method and application thereof. Background technique [0002] As a novel solid light source, white light diode (WLED) is expected to be widely used in indoor lighting, liquid crystal Display backlight, aviation and navigation, marking lighting, outdoor lighting, medical and communication and other fields. It can be seen that the market economic benefits of white LEDs are very considerable. [0003] At present, the most commonly used and commercialized white light LED is to use InGaN / GaN blue light LED chip with Ce-doped 3+ the Y 3 Al 5 o 12 :Ce(YAG:Ce) yellow phosphor, that is, the InGaN / GaN chip emits blue light to excite the YAG:Ce phosphor, and the yellow light generated is mixed with the transmitted blue light to achieve white light emission. However, due t...

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Problems solved by technology

[0007] On the other hand, today's common white LED packaging technology is mainly to uniformly disperse phosphor powder in epoxy resin or silica gel layer to form phosphor powder glue to fix LED chips, but these organic polymer packaging materials have low thermal conductivity and poor heat dissipation performance. Poor, the temperature of the packaging layer will rise during the continuous lighting of the LED, resulting in a decrease in the luminous efficiency of the phosphor, and the organic polymer packaging material will undergo a chemical reaction at high temperature, causing it to age and deteriorate, greatly affecting the performance of the LED device. light output

Especially in the application of high-power LED devices, this packaging scheme will directly affect the service life and quality of the device

At the same time, this kind of packaging process is relatively cumbersome, and the coating thickness of the mixed layer of phosphor powder and packaging material on the chip surface is difficult to control, which easily leads to uneven emission of light, which limits its wide application to a certain extent.

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