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High-performance surface mounting ink and preparation method thereof

A surface-mount, high-performance technology, applied in ink, household appliances, applications, etc., can solve problems that affect reliability, cannot realize automated production, and solder resist ink breakdown

Active Publication Date: 2018-11-09
广东科鼎新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When performing wave soldering on the PCB, some large component areas (such as resistors, capacitors, motors, etc.) need to withstand high temperature and high pressure, otherwise the solder resist ink may be broken down and cause a short circuit to affect reliability
However, the common practice in the industry is to stick this position with polyimide tape, and then tear off the tape after wave soldering. This process is basically impossible to realize automatic production. It needs manual operation by production staff, which is inefficient and time-consuming. , poor reliability

Method used

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  • High-performance surface mounting ink and preparation method thereof
  • High-performance surface mounting ink and preparation method thereof
  • High-performance surface mounting ink and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0030] (1) preparation of tetrabromobisphenol A type epoxy resin:

[0031] Add tetrabromobisphenol A, epichlorohydrin, and 80% isopropanol aqueous solution into the reactor, under nitrogen protection, stir until completely dissolved, then add dropwise 50% sodium hydroxide aqueous solution, The temperature is raised to 55°C, and the heat preservation reaction is carried out for 1 hour. The weight ratio is 1: 1.3: 3: 0.002; the temperature is raised to 65°C, and an aqueous sodium hydroxide solution with a mass fraction of 50% is added dropwise, and the heat preservation reaction is carried out for 1 hour. The tetrabromobisphenol A and the hydrogen with a mass fraction of 50% are The weight ratio of the sodium oxide aqueous solution is 1:0.002; the temperature is raised to 75° C., and the sodium hydroxide aqueous solution with a mass fraction of 50% is added dropwise, and the heat preservation reaction is carried out for 1 hour. The tetrabromobisphenol A and the hydrogen with a m...

Embodiment 1

[0074] The high-performance surface mount ink, calculated in parts by weight, includes:

[0075]

[0076] Wherein, the auxiliary agent includes photosensitizer, dispersant, leveling agent, accelerator, diluent, defoamer, coupling agent, 0.3 parts of photosensitizer, 1 part of dispersant, 0.4 part of leveling agent, 1 part of accelerator part, 2 parts of thinner, 0.1 part of defoamer, 0.2 part of coupling agent; the modified epoxy resin is 4-benzamide-2-hydroxybenzoic acid modified tetrabromobisphenol A type epoxy resin; The raw materials for the preparation of the acrylic resin include cyclic olefin monomers, chain olefin monomers, and 3,4-dihydroxystyrene acid, and the cyclic olefin monomers are 5-vinylbicyclo[2.2.1]hept-2 -ene, the chain olefin monomer is 4,4-dimethyl-1-hexene; the filler is barium sulfate, modified talcum powder, modified kaolin; the barium sulfate and the modified talc powder, the weight ratio of the modified kaolin is 1:2:0.7; the pigment is cobalt bl...

Embodiment 2

[0086] The high-performance surface mount ink, calculated in parts by weight, includes:

[0087]

[0088] Wherein, the auxiliary agent includes photosensitizer, dispersant, leveling agent, accelerator, diluent, defoamer, coupling agent, 0.3 parts of photosensitizer, 1 part of dispersant, 0.4 part of leveling agent, 1 part of accelerator part, 2 parts of thinner, 0.1 part of defoamer, 0.2 part of coupling agent; the modified epoxy resin is 4-benzamide-2-hydroxybenzoic acid modified tetrabromobisphenol A type epoxy resin; The raw materials for the preparation of the acrylic resin include cyclic olefin monomers, chain olefin monomers, and 3,4-dihydroxystyrene acid, and the cyclic olefin monomers are 5-vinylbicyclo[2.2.1]hept-2 -ene, the chain olefin monomer is 4,4-dimethyl-1-hexene; the filler is barium sulfate, modified talcum powder, modified kaolin; the barium sulfate and the modified talc powder, the weight ratio of the modified kaolin is 1:2:0.7; the pigment is cobalt bl...

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Abstract

The invention provides a high-performance surface mounting ink. The high-performance surface mounting ink is prepared from the following raw materials in parts by weight: 20-40 parts of modified epoxyresin, 10-20 parts of acrylic resin, 40-60 parts of filler, 3-4 parts of pigment, 1-10 parts of curing agent, and 1-10 parts of auxiliaries; wherein the auxiliaries include a photosensitizer, a dispersing agent, a flatting agent, a promoter, a diluent, a defoamer, and a coupling agent.

Description

technical field [0001] The invention belongs to the technical field of inks, in particular, the invention relates to a high-performance surface mounting ink and a preparation method thereof. Background technique [0002] In recent years, solder resists have been required to be more operable and have higher performance in response to higher densities of printed circuit boards associated with reductions in weight, weight, and size of electronic equipment. In addition, recently, along with miniaturization, weight reduction, and higher performance of electronic equipment, miniaturization and multi-pin semiconductor packages have been put into practical use, and mass production has been progressing. [0003] In the production process of the printed circuit board (PCB), in order to improve the welding efficiency and avoid damage to the parts that do not need to be welded, it is necessary to protect these parts with solder resist ink. The solder resist ink has been screen printed, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102C09D11/107C09D11/03C09D11/037
CPCC09D11/03C09D11/037C09D11/102C09D11/107
Inventor 聂雪峰
Owner 广东科鼎新材料股份有限公司
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