Unlock instant, AI-driven research and patent intelligence for your innovation.

Curable composition, cured film using same, and outer coating film

A technology of curable composition and compound, applied in the direction of coating, coating non-metallic protective layer, polyurea/polyurethane coating, etc., can solve the problem of not fully satisfying the bending resistance, and achieve excellent long-term insulation reliability, high Insulation reliability and warpage suppression effect

Active Publication Date: 2021-11-02
NIPPON POLYTECH CORP
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, even this thermosetting resin composition does not fully satisfy the bending resistance expected in the market, and further, an electrically insulating protective film having high bending resistance is desired.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Curable composition, cured film using same, and outer coating film
  • Curable composition, cured film using same, and outer coating film
  • Curable composition, cured film using same, and outer coating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0264] The following examples illustrate the present invention more specifically, but the present invention is not limited to the following examples.

[0265]

[0266]The acid value of the solution containing (component A) used in this invention was measured by the following method, and the acid value of (component A) was calculated|required using Formula (α). However, as the solvent used for the above-mentioned solution, a solvent having an acid value of "0" was used.

[0267] First, about 1 g of a solution containing (component A) was accurately weighed. Then, 30 g of a mixed solvent of isopropanol / toluene=1 / 2 (mass ratio) was added to this, and it melt|dissolved uniformly. An appropriate amount of phenolphthalein was added as an indicator to the obtained solution, and titration was performed using a 0.1N KOH solution (alcoholic). Furthermore, the acid value was computed by the following formula (α) from a titration result.

[0268] A=10×Vf×56.1 / (Wp×I)…Formula (α)

[0...

Synthetic example 1

[0292] (Synthesis example 1)

[0293] In a four-necked flask equipped with a stirrer, a cooling tube, a nitrogen inlet tube and a thermometer, add 270.7 mass of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) as tetracarboxylic dianhydride parts and 964.4 parts by mass of γ-butyrolactone as a solvent were stirred and dissolved at 120°C. 142.6 parts by mass of 4,4'-diphenylmethane diisocyanate (MDI) as a diisocyanate compound was added thereto and stirred, and 1,8-diazabicyclo[5.4.0]- 0.1 part by mass of 7-undecene (DBU) was reacted at 120° C. for 3 hours under a nitrogen stream. Then, by cooling to room temperature, an acid anhydride group-containing imide prepolymer at a terminal having a solid content concentration of 30% by mass was obtained.

[0294] Next, the obtained imide prepolymer having an acid anhydride group at the end with a solid content concentration of 30% by mass was heated up to 100° C. and stirred, and 950.8 parts by mass of polyester diol (α), 9...

Synthetic example 2

[0295] (Synthesis example 2)

[0296] In a four-necked flask equipped with a stirrer, a cooling tube, a nitrogen inlet tube and a thermometer, add 270.7 mass of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) as tetracarboxylic dianhydride parts and 964.4 parts by mass of γ-butyrolactone as a solvent were stirred and dissolved at 120°C. 142.6 parts by mass of 4,4'-diphenylmethane diisocyanate (MDI) as a diisocyanate compound was added thereto and stirred, and 1,8-diazabicyclo[5.4.0]- 0.1 part by mass of 7-undecene (DBU) was reacted at 120° C. for 3 hours under a nitrogen stream. Then, by cooling to room temperature, an acid anhydride group-containing imide prepolymer at a terminal having a solid content concentration of 30% by mass was obtained.

[0297] Next, the obtained imide prepolymer having an acid anhydride group at the end with a solid content concentration of 30% by mass was heated up to 100° C. and stirred, and 3-methyl-1,5-pentanediol:isophthalic acid wa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
particle sizeaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The object of the present invention is to provide a thermosetting resin combination that sufficiently suppresses warpage while maintaining high electrical insulation reliability under high temperature and high humidity when forming a protective film for a flexible wiring board, and is also excellent in bending resistance. things. The solution is that the curable composition of the present invention contains: (component A) a compound having at least one structural unit represented by formula (A) and at least one of an imide bond and an amide bond, (component B) curing agent, and (ingredient C) organic solvent. (Component A) contains (raw material a) a trivalent and / or tetravalent polycarboxylic acid derivative having an acid anhydride group, (raw material b) a polyol represented by formula (2), and (raw material c) polyisocyanate as A compound obtained by reacting essential components.

Description

technical field [0001] The present invention relates to a new curable composition used for an electrical insulating protective film, a method for forming a protective film of a flexible wiring board using the composition, a flexible wiring board and an electronic component, and the flexible wiring board. Manufacturing method of wire board. Background technique [0002] In recent years, in the field of electronic components, resin compositions (such as sealants, solder resists, etc.) used in electronic components have been required to have more excellent heat resistance and electrical properties in order to cope with miniaturization, thinning, and high speed. and moisture resistance. Therefore, instead of epoxy resins, polyimide resins, polyamideimide resins, and polyamide resins are used as resins constituting the resin composition. However, the resin structure of these resins is rigid and the cured film lacks flexibility. Therefore, when it is used for a film base materi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/02C08G18/83C08G59/40C08G73/10C09D7/61C09D7/65C09D175/06C09D201/06H05K3/28
CPCC08G18/83C08G59/40C08G73/10C08L101/02C09D175/06C09D201/06C09D7/40H05K3/28C08G18/44C08G18/4879C08G18/6755C08L75/06C08L75/08H05K1/09
Inventor 铃木快大贺一彦
Owner NIPPON POLYTECH CORP